Freescale Semiconductor
Data Sheet: Technical Data
Document Number: MC9S08MP16
Rev. 1, 10/2009
MC9S08MP16 Series Data
Sheet
Features
• 8-Bit HCS08 Central Processor Unit (CPU)
– Up to 51.34 MHz CPU at 2.7V to 5.5V across temperature
range of –40°C to 105°C
– Up to 40 MHz CPU at 2.7V to 5.5V across temperature range
of –40°C to 125°C
– HC08 instruction set with added BGND instruction and
additional addressing modes for LDHX and STHX
– Support for up to 48 interrupt/reset sources
• On-Chip Memory
– Up to 16 KB flash memory; read/program/erase over full
operating voltage and temperature
– Up to 1 KB random-access memory (RAM)
– Security circuitry to prevent unauthorized access to RAM and
flash memory contents
• Power-Saving Modes
– Two low power stop modes; reduced power wait mode
– Peripheral clock gating can disable clocks to unused modules
• Clock Source Options
– Oscillator (XOSC) — Loop-control Pierce oscillator; Crystal
or ceramic resonator range of 31.25–38.4 kHz or 1–16 MHz
– Internal Clock Source (ICS) — Containing a
frequency-locked-loop (FLL) controlled by internal or
external reference; precision trimming of internal reference
allows 0.2% resolutions and 2% deviation over temperature
and voltage; supports CPU frequencies up to 51.34 MHz
• System Protection
– Watchdog computer operating properly (COP) reset running
from dedicated 1-kHz internal clock source or bus clock
– Low-voltage detection with reset or interrupt; selectable trip
points
– Illegal opcode and illegal address detection with reset
– Flash memory block protection
• Development Support
– Single-wire background debug interface
– Breakpoint capability to allow single breakpoint setting during
in-circuit debugging (plus three more breakpoints in on-chip
debug module)
– On-chip in-circuit emulator (ICE) debug module containing
three comparators and nine trigger modes. Eight deep FIFO for
storing change-of-flow addresses and event-only data. Debug
module supports both tag and force breakpoints
• Peripherals
–
IPC
— Interrupt Priority Controller with 4 programmable
interrupt priority levels
–
ADC
— 13-channel, 12-bit resolution; 2.5
μs
conversion time;
automatic compare function; 1.7 mV/°C temperature sensor;
internal bandgap reference channel; operation in stop3
48-LQFP
Case 932-03
28-SOIC
Case 751F-05
32-LQFP
Case 873A-03
–
PGA
— Differential programmable gain amplifier with
programmable gain (x1, x2, x4, x8, x16, or x32)
–
HSCMP
— Three fast analog comparators with positive and
negative inputs; separately selectable interrupt on rising and
falling comparator output; filtering; windowing; HSCMP1 and
HSCMP2 outputs can be optionally routed to FTM1 module;
runs in stop3
–
DAC
— Three 5-bit digital to analog convertor used as a
32-tap voltage reference for each comparator
–
PDB
— Two programmable delay blocks: PDB1 synchronizes
PWM with samples of ADC; PDB2 synchronizes PWM with
comparing window of analog comparators
–
SCI
— Full duplex non-return to zero (NRZ); LIN master
extended break generation; LIN slave extended break
detection; wake up on active edge
–
SPI
— Full-duplex or single-wire bidirectional;
Double-buffered transmit and receive; Master or Slave mode;
MSB-first or LSB-first shifting
–
IIC/SMBus
— Up to 400 kbps; Multi-master operation;
Programmable slave address; Interrupt driven byte-by-byte
data transfer; supports broadcast mode and 10-bit addressing;
SMBus compatible
–
FTM
— Two Flextimers with total of 8 channels; One
2-channel (FTM1) and one 6-channel (FTM2); supports
operation up to 2x bus clock; selectable input capture, output
compare, edge- or center-aligned PWM; dead time insertion;
fault inputs
–
MTIM
— 8-bit modulo counter with 8-bit prescaler
–
RTC
— (Real-time counter) 8-bit modulus counter with
binary or decimal based prescaler; External clock source for
precise time base, time-of-day, calendar or task scheduling;
Free running on-chip low power oscillator (1 kHz) for cyclic
wake-up without external components, runs in all MCU modes
–
CRC
— Cyclic redundancy check generator
–
KBI
— Three 8 channel keyboard interrupt module with
software selectable polarity on edge or edge/level modes
• Input/Output
– 40 GPIOs, 2 output-only pins.
– Hysteresis and configurable pull up device on input pins;
Configurable slew rate and drive strength on output pins;
Sink/Source current up to 20mA
• Package Options
– 48-LQFP, 32-LQFP, 28-SOIC
– 48-LQFP qualified for automotive usage
Freescale reserves the right to change the detail specifications as may be required to permit
improvements in the design of its products.
© Freescale Semiconductor, Inc., 2009. All rights reserved.
Table of Contents
1
2
Pin Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
2.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
2.2 Parameter Classification . . . . . . . . . . . . . . . . . . . . . . . . .9
2.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . .9
2.4 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . .10
2.5 ESD Protection and Latch-Up Immunity . . . . . . . . . . . .11
2.6 DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
2.7 Supply Current Characteristics . . . . . . . . . . . . . . . . . . .15
2.8 External Oscillator (XOSC) Characteristics . . . . . . . . .20
2.9 Internal Clock Source (ICS) Characteristics . . . . . . . . .21
2.10 ADC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .23
2.11 Digital to Analog (DAC) Characteristics . . . . . . . . . . . .26
2.12 High Speed Comparator (HSCMP) Characteristics . . .26
2.13 Programmable Gain Amplifier (PGA) Characteristics .
2.14 AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.14.1 Control Timing . . . . . . . . . . . . . . . . . . . . . . . . .
2.14.2 FTM Module Timing . . . . . . . . . . . . . . . . . . . . .
2.14.3 MTIM Module Timing . . . . . . . . . . . . . . . . . . . .
2.14.4 SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.15 Flash Memory Specifications. . . . . . . . . . . . . . . . . . . .
2.16 EMC Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.16.1 Radiated Emissions . . . . . . . . . . . . . . . . . . . . .
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.1 Device Numbering Scheme. . . . . . . . . . . . . . . . . . . . .
Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Related Documentation. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
26
27
27
28
29
30
33
33
33
34
35
35
35
35
3
4
5
6
MC9S08MP16 Series Data Sheet, Rev. 1
2
Freescale Semiconductor
Interrupt Priority Controller
(IPC)
HCS08 CORE
CPU
BKGD
INT
BKP
ON-CHIP ICE
DEBUG MODULE (DBG)
CYCLIC REDUNDANCY
CHECK (CRC)
8-BIT KEYBOARD
INTERRUPT (KBI1)
8-BIT KEYBOARD
INTERRUPT (KBI2)
BKGD/MS
8-BIT KEYBOARD
INTERRUPT (KBI3)
IIC MODULE (IIC)
KBI1P[7:0]
PTA7/SPSCK
PTA6/MOSI
PTA5/SCL/MISO
PTA4/TCLK/SDA/SS
PTA3/SCL/FTM1CH1
PTA2/SDA/FTM1CH0
PTA1/SCL/RxD
PTA0/SDA/TxD
PTB7/KBI1P7/ADP7/C3IN4
PTB6/KBI1P6/CMP3OUT/ADP6/C3IN3
PTB5/KBI1P5/CMP2OUT/ADP5/C2IN4
PTB4/KBI1P4/ADP4/C2IN3
PTB3/KBI1P3/ADP3/C3IN2/PGA-
PTB2/KBI1P2/ADP2/C1IN2/PGA+
PTB1/KBI1P1/ADP1/C2IN2
PTB0/KBI1P0/ADP0/CIN1
PTC7/KBI2P7/TCLK
PTC6/KBI2P6/FTM2FAULT
PTC5/KBI2P5/FTM2CH5
PTC4/KBI2P4/FTM2CH4
PTC3/KBI2P3/FTM2CH3
PTC2/KBI2P2/FTM2CH2
PTC1/KBI2P1/FTM2CH1
PTC0/KBI2P0/FTM2CH0
PTD7/KBI3P7/CMP3OUT
PTD6/KBI3P6/CMP2OUT
PTD5/KBI3P5/CMP1OUT
PTD4/KBI3P4/PDB2OUT
PTD3/KBI3P3/FTM1FAULT
PTD2/KBI3P2/PDB1OUT
PTD1/KBI3P1/SCL
PTD0/KBI3P0/SDA
PTE6/EXTAL
PTE5/XTAL
PTE4/ADP12/C1IN4
PTE3/ADP11/C1IN3
PTE2/ADP10
PTE1/ADP9
PTE0/ADP8
PTF2
PTF1/RESET
PTF0/BKGD/MS
HCS08 SYSTEM CONTROL
RESETS AND INTERRUPTS
MODES OF OPERATION
POWER MANAGEMENT
COP
KBI2P[7:0]
KBI3P[7:0]
RESET
LVD
USER FLASH
SCL
SDA
(Only on MC9S08MP16)
2-CHANNEL FLEXTIMER
(FTM1)
6-CHANNEL FLEXTIMER
(MC9S08MP16 = 16384 BYTES)
(MC9S08MP12 = 12288 BYTES)
USER RAM
TCLK
FTM1FAULT
FTM2CH[5:0]
TCLK
FTM2FAULT
TCLK
(FTM2)
8-BIT MODULO TIMER
(MTIM)
SERIAL COMMUNICATIONS
INTERFACE (SCI)
XTAL
EXTAL
SERIAL PERIPHERAL
INTERFACE (SPI)
PROGRAMMABLE DELAY
BLOCK (PDB1)
PROGRAMMABLE DELAY
BLOCK (PDB2)
12-BIT
ANALOG-TO-DIGITAL
CONVERTER (ADC)
PROGRAMMABLE
GAIN AMPLIFIER (
PGA)
50.33 MHz INTERNAL CLOCK
SOURCE (ICS)
LOW-POWER OSCILLATOR
31.25 kHz to 38.4 kHz
1 MHz to 16 MHz
(XOSC)
REAL TIME
COUNTER (RTC)
TxD
RxD
SS
SPSCK
MISO
MOSI
PDB1OUT
PDB2OUT
V
REFH
V
DDA
/V
REFH
V
SSA
/V
REFL
VOLTAGE
REGULATOR
V
REFL
V
DD1
V
SS1
V
DD2
V
SS2
PGA+
PGA–
CIN1
C1IN2
C1IN3
C1IN4
CMP1OUT
C2IN2
C2IN3
C2IN4
CMP2OUT
C3IN2
C3IN3
C3IN4
CMP3OUT
(Only on MC9S08MP16)
DIGITAL-TO-ANALOG
CONVERTER (DAC1)
HIGH SPEED ANALOG
COMPARATOR (HSCMP1)
DIGITAL-TO-ANALOG
CONVERTER (DAC2)
HIGH SPEED ANALOG
COMPARATOR (HSCMP2)
DIGITAL-TO-ANALOG
CONVERTER (DAC3)
HIGH SPEED ANALOG
COMPARATOR (HSCMP3)
Notes:
When PTF1 is configured as RESET, pin becomes bi-directional with output being open-drain drive containing an internal pull-up device.
When PTF0 is configured as BKGD, pin becomes bi-directional.
V
DD2
pad is tied internally on 32-pin and 28-pin packages,
V
SS2
pad is tied internally on 28-pin packages
Figure 1. MC9S08MP16 Series Block Diagram
MC9S08MP16 Series Data Sheet, Rev. 1
Freescale Semiconductor
3
PORT F
PORT E
ADP12–ADP0
PORT D
PORT C
(MC9S08MP16 = 1024 BYTES)
(MC9S08MP12 = 512 BYTES)
PORT B
FTM1CH[1:0]
PORT A
pins not available on 28-pin packages
pins not available on 32-pin or 28-pin packages