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BL-B5141-TBS18C

Description
Chip material: GaP/GaP
File Size143KB,3 Pages
ManufacturerBRIGHT
Websitehttp://www.brightled.co.kr/
Download Datasheet View All

BL-B5141-TBS18C Overview

Chip material: GaP/GaP

BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-B5141-TBS18C
Features:
1. Chip material: GaP/GaP
2. Emitted color : Bright Red
3. Lens Appearance : Red Diffused
4. Low power consumption.
5. High efficiency.
6. Versatile mounting on P.C. Board or panel.
7. Low current requirement.
8. 3mm diameter package
9. This product don’t contained restriction
substance, compliance ROHS standard.
Package dimensions:
3.00(.118)
0.81(.032)
5.30(.209)
1.5(.059)
MAX.
25.4(1.00) MIN.
CATHODE
0.5(.02)
SQ.TYP.
3.80(.150)
1.00(.039) MIN.
Flat Denotes Cathode
Applications:
1. TV set
2. Monitor
3. Telephone
4. Computer
5. Circuit board
Notes:
2.54(.100)
NOM.
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25mm (0.01”) unless otherwise specified.
3. Lead spacing is measured where the leads emerge from
the package.
4. Specifications are subject to change without notice.
Absolute Maximum Ratings(Ta=25℃)
Parameter
Power Dissipation
Forward Current
Peak Forward Current*
1
Reverse
Voltage
Operating Temperature
Storage Temperature
Soldering Temperature
Symbol
Pd
I
F
I
FP
V
R
Topr
Tstg
Tsol
Rating
40
15
50
5
-40
~80
-40
~85
260
(for 5 seconds)
Unit
mW
mA
mA
V
*
1
Condition for I
FP
is pulse of 1/10 duty and 0.1msec width.
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