Version History
Rev 0
Rev 1.0
Rev 2.0
Description of Change
Pre-release, Alpha customers only
Initial Public Release
Added output voltage maximum value and note to clarify in
Table 10-1.;
also removed
overall life expectancy note, since life expectancy is dependent on customer usage and
must be determined by reliability engineering. Clarified value and unit measure for
Maximum allowed P
D
in
Table 10-3.
Corrected note about average value for Flash Data
Retention in
Table 10-4.
Added new RoHS-compliant orderable part numbers in
Table 13-1.
Added 160MAPBGA information, TA equation updated in
Table 10-4
and additional minor
edits throughout data sheet
Deleted formula for Max Ambient Operating Temperature (Automotive) and Max Ambient
Operating Temperature (Industrial) and corrected Flash Endurance to 10,000 in
Table 10-4.
Added RoHS-compliance and “pb-free” language to back cover.
Correcting MBGA pin assignments in
Table 2-2
for MOSI0 and MISO0
Added information/corrected state during reset in
Table 2-2.
Clarified external reference
crystal frequency for PLL in
Table 10-14
by increasing maximum value to 8.4MHz.
Corrected CLKO and HOME1 labels in
Figure 11-2
and
Table 11-2;
replaced “Tri-stated”
with an explanation in State During Reset column in
Table 2-2.
• Added the following note to the description of the TMS signal in
Table 2-2:
Note:
Always tie the TMS pin to V
DD
through a 2.2K resistor.
• Added the following note to the description of the TRST signal in
Table 2-2:
Note:
For normal operation, connect TRST directly to V
SS
. If the design is to be used in a
debugging environment, TRST may be tied to V
SS
through a 1K resistor.
Rev 3.0
Rev 4.0
Rev 5.0
Rev 6.0
Rev 7.0
Rev. 8
Rev. 9
• Add
Figure 10-1
showing current voltage characteristics.
• In
Table 10-24,
correct interpretation of Calibration Factors to be viewed as worst case
factors.
Please see http://www.freescale.com for the most current data sheet revision.
56F8367 Technical Data, Rev. 9
2
Freescale Semiconductor
Preliminary
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not
available from Freescale for import or sale in the United States prior to September 2010: MC56F8367, MC56F8167
Document Revision History
56F8367/56F8167 General Description
Note:
Features in italics are NOT available in the 56F8167 device.
• Up to 60 MIPS at 60MHz core frequency
• DSP and MCU functionality in a unified,
C-efficient architecture
• Access up to 4MB of off-chip program and 32MB of
data memory
• Chip Select Logic for glueless interface to ROM and
SRAM
• 512KB of Program Flash
• 4KB of Program RAM
• 32KB of Data Flash
• 32KB of Data RAM
• 32KB Boot Flash
• Up to two 6-channel PWM modules
• Four 4-channel, 12-bit ADCs
RSTO
EMI_MODE
EXTBOOT
5
V
PP
2
V
CAP
4
OCR_DIS
V
DD
V
SS
7
6
Digital Reg
V
DDA
2
Analog Reg
V
SSA
* Configuration
shown for on-chip
2.5V regulator
• Temperature Sensor
• Up to two Quadrature Decoders
• Optional on-chip regulator
• Up to two FlexCAN modules
• Two Serial Communication Interfaces (SCIs)
• Up to two Serial Peripheral Interfaces (SPIs)
• Up to four general-purpose Quad Timers
• Computer Operating Properly (COP) / Watchdog
• JTAG/Enhanced On-Chip Emulation (OnCE™) for
unobtrusive, real-time debugging
• Up to 76 GPIO lines
• 160-pin LQFP Package and 160 MAPBGA
RESET
6
3
4
6
3
4
4
4
5
4
4
PWM Outputs
Current Sense Inputs
or GPIOC
Fault Inputs
PWM Outputs
Current Sense Inputs
or GPIOD
Fault Inputs
AD0
AD1
VREF
AD0
AD1
PWMA
JTAG/
EOnCE
Port
16-Bit
56800E Core
Low Voltage
Supervisor
Bit
Manipulation
Unit
PWMB
Program Controller
and
Hardware Looping Unit
Address
Generation Unit
Data ALU
16 x 16 + 36 -> 36-Bit MAC
Three 16-bit Input Registers
Four 36-bit Accumulators
ADCA
PAB
PDB
CDBR
CDBW
Memory
ADCB
Program Memory
256K x 16 Flash
2K x 16 RAM
Boot ROM
16K x 16 Flash
R/W Control
XDB2
XAB1
XAB2
External
Address Bus
Switch
6
2
8
4
3
External Data
Bus Switch
A0-5 or GPIOA8-13
A6-7 or GPIOE2-3
A8-15 or GPIOA0-7
GPIOB0-3 (A16-19)
GPIOB4 (A20, prescaler_clock)
GPIOB5-7 (A21-23, clk0-3**)
D0-6 or GPIOF9-15
D7-15 or GPIOF0-8
WR
RD
GPIOD2-5 or CS4 -7
PS / CS0 (GPIOD8)
DS / CS1 (GPIOD9)
GPIOD0 (CS2 or
CAN2_TX)
GPIOD1 (CS3 or
CAN2_RX)
Temp_Sense
Quadrature
Decoder 0 or
Quad
Timer A or
GPIOC
Quadrature
Decoder 1 or
Quad
Timer B or
SPI1 or
GPIOC
Quad
Timer C or
GPIOE
Quad
Timer D or
GPIOE
FlexCAN
4
D
ata Memory
16K x 16 Flash
16K x 16 Flash
PDB
CDBR
CDBW
External Bus
Interface Unit
PAB
System Bus
Control
7
9
4
IPBus Bridge (IPBB)
Decoding
Peripherals
Clock
resets
Bus Control
4
2
Peripheral
Device Selects
RW
Control
IPAB
IPWDB
IPRDB
GPIO or EMI CS or
FlexCAN2
4
2
PLL
SPI0 or
GPIOE
4
SCI1 or
GPIOD
2
SCI0 or
GPIOE
2
COP/
Watchdog
Interrupt
Controller
IRQA IRQB
System
O
Integration
R
Module
CLKO
P
O
Clock
Generator
S
C
XTAL
EXTAL
**See Table 2-2
for explanation
CLKMODE
56F8367/56F8167 Block Diagram
56F8367 Technical Data, Rev. 9
Freescale Semiconductor
Preliminary
3
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not
available from Freescale for import or sale in the United States prior to September 2010: MC56F8367, MC56F8167
Table of Contents
Part 1: Overview . . . . . . . . . . . . . . . . . . . . . . . 5
1.1.
1.2.
1.3.
1.4.
1.5.
1.6.
56F8367/56F8167 Features . . . . . . . . . . . . . 5
Device Description . . . . . . . . . . . . . . . . . . . . 7
Award-Winning Development Environment . 9
Architecture Block Diagram . . . . . . . . . . . . 10
Product Documentation . . . . . . . . . . . . . . . 14
Data Sheet Conventions . . . . . . . . . . . . . . . 14
Part 8: General Purpose Input/Output (GPIO)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132
8.1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . 132
8.2. Memory Maps . . . . . . . . . . . . . . . . . . . . . . 132
8.3. Configuration . . . . . . . . . . . . . . . . . . . . . . . 133
Part 9: Joint Test Action Group (JTAG) . 137
9.1. 56F8367 Information. . . . . . . . . . . . . . . . . 137
Part 2: Signal/Connection Descriptions . . . 15
2.1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.2. Signal Pins . . . . . . . . . . . . . . . . . . . . . . . . . 18
Part 10: Specifications . . . . . . . . . . . . . . . 138
10.1. General Characteristics. . . . . . . . . . . . . . 138
10.2. DC Electrical Characteristics . . . . . . . . . . 142
10.3. AC Electrical Characteristics . . . . . . . . . . 146
10.4. Flash Memory Characteristics . . . . . . . . . 147
10.5. External Clock Operation Timing . . . . . . . 147
10.6. Phase Locked Loop Timing. . . . . . . . . . . 148
10.7. Crystal Oscillator Timing . . . . . . . . . . . . . 148
10.8. External Memory Interface Timing . . . . . . 149
10.9. Reset, Stop, Wait, Mode Select, and
Interrupt Timing . . . . . . . . . . . . . . 151
10.10. Serial Peripheral Interface (SPI) Timing . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . 154
10.11. Quad Timer Timing . . . . . . . . . . . . . . . . 157
10.12. Quadrature Decoder Timing . . . . . . . . . . 157
10.13. Serial Communication Interface (SCI)
Timing . . . . . . . . . . . . . . . . . . . . . 158
10.14. Controller Area Network (CAN) Timing . 159
10.15. JTAG Timing . . . . . . . . . . . . . . . . . . . . . 159
10.16. Analog-to-Digital Converter (ADC)
Parameters . . . . . . . . . . . . . . . . . 161
10.17. Equivalent Circuit for ADC Inputs . . . . . . 164
10.18. Power Consumption . . . . . . . . . . . . . . . . 164
Part 3: On-Chip Clock Synthesis (OCCS) . . 39
3.1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . 39
3.2. External Clock Operation . . . . . . . . . . . . . . 39
3.3. Registers . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Part 4: Memory Operating Modes (MEM) . . 41
4.1.
4.2.
4.3.
4.4.
4.5.
4.6.
4.7.
4.8.
Introduction . . . . . . . . . . . . . . . . . . . . . . . . .
Program Map . . . . . . . . . . . . . . . . . . . . . . .
Interrupt Vector Table . . . . . . . . . . . . . . . . .
Data Map . . . . . . . . . . . . . . . . . . . . . . . . . .
Flash Memory Map . . . . . . . . . . . . . . . . . . .
EOnCE Memory Map . . . . . . . . . . . . . . . . .
Peripheral Memory Mapped Registers . . . .
Factory Programmed Memory . . . . . . . . . .
41
42
43
47
47
49
49
80
Part 5: Interrupt Controller (ITCN) . . . . . . . . 81
5.1.
5.2.
5.3.
5.4.
5.5.
5.6.
5.7.
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . 81
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
Functional Description . . . . . . . . . . . . . . . . . 81
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . 83
Operating Modes . . . . . . . . . . . . . . . . . . . . . 83
Register Descriptions . . . . . . . . . . . . . . . . . 84
Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
Part 11: Packaging . . . . . . . . . . . . . . . . . . 166
11.1. 56F8367 Package and Pin-Out
Information . . . . . . . . . . . . . . . . . . 166
11.2. 56F8167 Package and Pin-Out
Information . . . . . . . . . . . . . . . . . . 173
Part 6: System Integration Module (SIM) . 111
6.1.
6.2.
6.3.
6.4.
6.5.
6.6.
6.7.
6.8.
6.9.
Overview . . . . . . . . . . . . . . . . . . . . . . . . .
Features . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating Modes . . . . . . . . . . . . . . . . . . . .
Operating Mode Register . . . . . . . . . . . . .
Register Descriptions . . . . . . . . . . . . . . . .
Clock Generation Overview . . . . . . . . . . .
Power Down Modes Overview . . . . . . . . .
Stop and Wait Mode Disable Function . . .
Resets . . . . . . . . . . . . . . . . . . . . . . . . . . .
111
111
112
112
113
127
128
128
129
Part 12: Design Considerations . . . . . . . . 177
12.1. Thermal Design Considerations . . . . . . . . 177
12.2. Electrical Design Considerations . . . . . . . 178
12.3. Power Distribution and I/O Ring
Implementation . . . . . . . . . . . . . . 179
Part 13: Ordering Information . . . . . . . . . 180
Part 7: Security Features . . . . . . . . . . . . . . 129
7.1. Operation with Security Enabled . . . . . . . 129
7.2. Flash Access Blocking Mechanisms . . . . 130
56F8367 Technical Data, Rev. 9
4
Freescale Semiconductor
Preliminary
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not
available from Freescale for import or sale in the United States prior to September 2010: MC56F8367, MC56F8167
56F8367/56F8167 Features
Part 1 Overview
1.1 56F8367/56F8167 Features
1.1.1
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Core
Efficient 16-bit 56800E family controller engine with dual Harvard architecture
Up to 60 Million Instructions Per Second (MIPS) at 60MHz core frequency
Single-cycle 16
×
16-bit parallel Multiplier-Accumulator (MAC)
Four 36-bit accumulators, including extension bits
Arithmetic and logic multi-bit shifter
Parallel instruction set with unique DSP addressing modes
Hardware DO and REP loops
Three internal address buses and one external address bus
Four internal data buses and one external data bus
Instruction set supports both DSP and controller functions
Controller-style addressing modes and instructions for compact code
Efficient C compiler and local variable support
Software subroutine and interrupt stack with depth limited only by memory
JTAG/EOnCE debug programming interface
1.1.2
Differences Between Devices
Table 1-1
outlines the key differences between the 56F8367 and 56F8167 devices.
Table 1-1 Device Differences
Feature
Guaranteed Speed
Program RAM
Data Flash
PWM
CAN
Quad Timer
Quadrature Decoder
Temperature Sensor
Dedicated GPIO
56F8367
60MHz/60 MIPS
4KB
32KB
2x6
2
4
2x4
1
—
56F8167
40MHZ/40MIPS
Not Available
Not Available
1x6
Not Available
2
1x4
Not Available
7
56F8367 Technical Data, Rev. 9
Freescale Semiconductor
Preliminary
5
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not
available from Freescale for import or sale in the United States prior to September 2010: MC56F8367, MC56F8167
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