R5324x SERIES
TRIPLE LDO
NO. EA-099-130424
OUTLINE
The R5324x Series are CMOS-based multi positive voltage regulator ICs with high output voltage accuracy,
low supply current, low noise, low dropout and high ripple rejection. The R5324x Series contain three voltage
regulators. Each of these voltage regulators in the R5324x Series consists of a voltage reference unit, an error
amplifier, resistors for setting output voltage, a short current limit circuit, a chip enable circuit, and so on.
The chip enable function contributes to prolong battery life. Further, regulators in the R5324x Series are with
low dropout voltage, excellent load transient response and line transient response, thus the R5324x series are
very suitable for the power supply for hand-held communication equipment.
Since the packages for these ICs are SON-8 (Non-promotion) and DFN(PLP)2527-10, high density mounting
of the ICs on boards is possible.
FEATURES
•
•
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Supply Current .................................................................. Typ. 90μA (VR1, VR2, VR3)
Standby Current ................................................................ Typ. 0.1μA
Output Current .................................................................. Min. 200mA (VR1), 150mA (VR2), 100mA (VR3)
Dropout Voltage ................................................................ Typ. 0.23V (VR1) (I
OUT
=200mA,
V
OUT
=2.8V)
Typ. 0.22V (VR2) (I
OUT
=150mA,
V
OUT
=2.8V)
Typ. 0.15V (VR3) (I
OUT
=100mA,
V
OUT
=2.8V)
Ripple Rejection................................................................ Typ. 70dB (f=1kHz), Typ. 65dB (f=10kHz)
Input Voltage Range ......................................................... 2.0V to 6.0V
Output Voltage Range....................................................... 1.5V to 4.0V (0.1V steps)
(
For details, please refer to MARK INFORMATIONS.)
Output Voltage Accuracy...................................................
±2.0%
Temperature-Drift Coefficient of Output Voltage ............... Typ.
±100ppm/°C
Line Regulation ................................................................. Typ.0.02%/V
Packages ......................................................................... DFN(PLP)2527-10, SON-8 (Non-promotion)
Built-in fold-back protection circuit .................................... Typ.50mA (VR1), Typ.40mA (VR2, VR3)
(Current at short mode)
Ceramic capacitors are recommended to be used with this IC .....1.0μF or more
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APPLICATIONS
•
Power source for cellular phones and portable communication equipment.
•
Power source for electrical appliances such as cameras, VCRs.
•
Power source for battery-powered equipment.
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R5324x
SELECTION GUIDE
The output voltage, auto discharge function, package, etc. for the ICs can be selected at the user’s request.
Product Name
R5324Kxxx∗-TR
R5324Dxxx∗-TR-F
Package
DFN(PLP)2527-10
Quantity per Reel
5,000 pcs
Pb Free
Yes
Halogen Free
Yes
SON-8
3,000 pcs
Yes
No
(Non-promotion)
xxx : The combination of output voltage for each channel can be designated by serial numbers. (from 001)
The output voltage for each channel can be set in the range from 1.5V to 4.0V in 0.1V steps.
(For details, please refer to MARK INFORMATIONS.)
∗
: The auto discharge function at off state are options as follows.
(A) without auto discharge function at off state
(B) with auto discharge function at off state
The products scheduled to be discontinued : "Non-promotion"
These products will be discontinued in the future. We advise you to select other products.
3
R5324x
PIN CONFIGURATIONS
•
DFN (PLP) 2527-10
Top View
10 9 8 7 6
•
SON-8 (Non-promotion)
Top View
8 7
6 5
Bottom View
6 7 8 9 10
Bottom View
5 6 7 8
∗
∗
∗
1 2 3 4 5
5 4 3 2 1
1 2
3 4
4 3 2 1
PIN DESCRIPTIONS
•
DFN(PLP)2527-10
Pin No
1
2
3
4
5
6
7
8
9
10
Symbol
V
DD
V
DD
CE1
CE2
CE3
GND
NC
V
OUT3
V
OUT2
V
OUT1
Input Pin
Input Pin
Chip Enable Pin 1 ("H" Active)
Chip Enable Pin 2 ("H" Active)
Chip Enable Pin 3 ("H" Active)
Ground Pin
No Connection
Output Pin 3
Output Pin 2
Output Pin 1
Pin Description
•
∗
) Tab is GND level. (They are connected to the reverse side of this IC.)
The tab is better to be connected to the GND, but leaving it open is also acceptable.
The V
DD
pin must be wired together when it is mounted on board.
SON-8 (Non-promotion)
Pin No
1
2
3
4
5
6
7
8
Symbol
V
DD
CE1
CE2
CE3
GND
V
OUT3
V
OUT2
V
OUT1
Input Pin
Chip Enable Pin 1 ("H" Active)
Chip Enable Pin 2 ("H" Active)
Chip Enable Pin 3 ("H" Active)
Ground Pin
Output Pin 3
Output Pin 2
Output Pin 1
Pin Description
∗
) Tab suspension leads are GND level. (They are connected to the reverse side of this IC.)
The tab suspension leads should be open and do not connect to other wires or land patterns.
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R5324x
ABSOLUTE MAXIMUM RATINGS
Symbol
V
IN
CE
V
OUT
I
OUT1
I
OUT2
I
OUT3
P
D
Topt
Tstg
Input Voltage
Input Voltage (CE Pin)
Output Voltage
Output Current (V
OUT1
)
Output Current (V
OUT2
)
Output Current (V
OUT3
)
Power Dissipation (DFN(PLP)2527-10)*
Power Dissipation (SON-8)* (Non-promotion)
Operating Temperature Range
Storage Temperature Range
Item
Rating
6.5
-0.3 to 6.5
-0.3 to V
IN
+0.3
230
180
180
910
480
-40 to 85
-55 to 125
°
C
°
C
Unit
V
V
V
mA
mA
mA
mW
∗
) For Power Dissipation, please refer to PACKAGE INFORMATION.
ABSOLUTE MAXIMUM RATINGS
Electronic and mechanical stress momentarily exceeded absolute maximum ratings may cause the
permanent damages and may degrade the life time and safety for both device and system using the device
in the field.
The functional operation at or over these absolute maximum ratings is not assured.
RECOMMENDED OPERATING CONDITIONS (ELECTRICAL CHARACTERISTICS)
All of electronic equipment should be designed that the mounted semiconductor devices operate within the
recommended operating conditions. The semiconductor devices cannot operate normally over the
recommended operating conditions, even if when they are used over such conditions by momentary
electronic noise or surge. And the semiconductor devices may receive serious damage when they continue
to operate over the recommended operating conditions.
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