K6T4016S3C-RF100 datasheet, PDF

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K6T4016S3C-RF100: DescriptionStandard SRAM, 256KX16, 100ns, CMOS, PDSO44, 0.400 INCH, REVERSE, TSOP2-44; Categorystorage storage; File Size152KB，9 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/

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K6T4016S3C-RF100 Overview

Standard SRAM, 256KX16, 100ns, CMOS, PDSO44, 0.400 INCH, REVERSE, TSOP2-44

K6T4016S3C-RF100 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	SAMSUNG
Parts packaging code	TSOP2
package instruction	TSOP2,
Contacts	44
Reach Compliance Code	compliant
ECCN code	3A991.B.2.A
Maximum access time	100 ns
JESD-30 code	R-PDSO-G44
length	18.41 mm
memory density	4194304 bit
Memory IC Type	STANDARD SRAM
memory width	16
Number of functions	1
Number of terminals	44
word count	262144 words
character code	256000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	256KX16
Package body material	PLASTIC/EPOXY
encapsulated code	TSOP2
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum supply voltage (Vsup)	2.7 V
Minimum supply voltage (Vsup)	2.3 V
Nominal supply voltage (Vsup)	2.5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	GULL WING
Terminal pitch	0.8 mm
Terminal location	DUAL
width	10.16 mm
Base Number Matches	1

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K6T4016S3C Family

Document Title

256Kx16 bit Low Power and Low Voltage CMOS Static RAM

CMOS SRAM

Revision History

Revision No. History

0.0

0.01

1.0

Initial draft

Errata correction

Finalize

Draft Date

June 16, 1998

August 10, 1998

April 30, 1999

Remark

Preliminary

Final

The attached datasheets are provided by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the specifications and

products. SAMSUNG Electronics will anwswer to your questions about device. If you have any questions, please contact the SAMSUNG branch offices.

Revision 1.0

April 1999

K6T4016S3C-RF100 Related Products

	K6T4016S3C-RF100	K6T4016S3C-RF10	K6T4016S3C-TF12	K6T4016S3C-TF100	K6T4016S3C-TF10	K6T4016S3C-TF120	K6T4016S3C-RF12	K6T4016S3C-RF120
Description	Standard SRAM, 256KX16, 100ns, CMOS, PDSO44, 0.400 INCH, REVERSE, TSOP2-44	Standard SRAM, 256KX16, 100ns, CMOS, PDSO44, 0.400 INCH, REVERSE, TSOP2-44	Standard SRAM, 256KX16, 120ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44	Standard SRAM, 256KX16, 100ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44	Standard SRAM, 256KX16, 100ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44	Standard SRAM, 256KX16, 120ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44	Standard SRAM, 256KX16, 120ns, CMOS, PDSO44, 0.400 INCH, REVERSE, TSOP2-44	Standard SRAM, 256KX16, 120ns, CMOS, PDSO44, 0.400 INCH, REVERSE, TSOP2-44
Maker	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG
Parts packaging code	TSOP2	TSOP2	TSOP2	TSOP2	TSOP2	TSOP2	TSOP2	TSOP2
package instruction	TSOP2,	TSOP2-R,	TSOP2,	TSOP2,	0.400 INCH, TSOP2-44	TSOP2,	TSOP2-R,	TSOP2,
Contacts	44	44	44	44	44	44	44	44
Reach Compliance Code	compliant	unknown	unknown	compliant	unknown	compliant	unknown	compliant
ECCN code	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
Maximum access time	100 ns	100 ns	120 ns	100 ns	100 ns	120 ns	120 ns	120 ns
JESD-30 code	R-PDSO-G44	R-PDSO-G44	R-PDSO-G44	R-PDSO-G44	R-PDSO-G44	R-PDSO-G44	R-PDSO-G44	R-PDSO-G44
length	18.41 mm	18.41 mm	18.41 mm	18.41 mm	18.41 mm	18.41 mm	18.41 mm	18.41 mm
memory density	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	16	16	16	16	16	16	16	16
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	44	44	44	44	44	44	44	44
word count	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words
character code	256000	256000	256000	256000	256000	256000	256000	256000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
organize	256KX16	256KX16	256KX16	256KX16	256KX16	256KX16	256KX16	256KX16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSOP2	TSOP2-R	TSOP2	TSOP2	TSOP2	TSOP2	TSOP2-R	TSOP2
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm
Maximum supply voltage (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
Minimum supply voltage (Vsup)	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V
Nominal supply voltage (Vsup)	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
width	10.16 mm	10.16 mm	10.16 mm	10.16 mm	10.16 mm	10.16 mm	10.16 mm	10.16 mm

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