|
TPA6136A2YFFT |
TPA6136A2YFFR |
| Description |
25-mW DirectPath™ Stereo Headphone Amplifier with Pop Suppression (WCSP) 16-DSBGA -40 to 85 |
25-mW DirectPath™ Stereo Headphone Amplifier with Pop Suppression (WCSP) 16-DSBGA -40 to 85 |
| Brand Name |
Texas Instruments |
Texas Instruments |
| Is it lead-free? |
Lead free |
Lead free |
| Is it Rohs certified? |
conform to |
conform to |
| Maker |
Texas Instruments |
Texas Instruments |
| Parts packaging code |
BGA |
BGA |
| package instruction |
VFBGA, BGA16,4X4,16 |
DSBGA-16 |
| Contacts |
16 |
16 |
| Reach Compliance Code |
compli |
compli |
| ECCN code |
EAR99 |
EAR99 |
| Factory Lead Time |
1 week |
6 weeks |
| Samacsys Descripti |
25-mW DIRECTPATH STEREO HEADPHONE AMPLIFIER WITH POP SUPPRESSION |
25-mW DirectPath Stereo Headphone Amplifier with Pop Suppression (WCSP) |
| Nominal bandwidth |
20 kHz |
20 kHz |
| Commercial integrated circuit types |
AUDIO AMPLIFIER |
AUDIO AMPLIFIER |
| harmonic distortion |
1% |
1% |
| JESD-30 code |
S-PBGA-B16 |
S-PBGA-B16 |
| JESD-609 code |
e1 |
e1 |
| length |
1.905 mm |
1.905 mm |
| Humidity sensitivity level |
1 |
1 |
| Number of channels |
2 |
2 |
| Number of functions |
1 |
1 |
| Number of terminals |
16 |
16 |
| Maximum operating temperature |
85 °C |
85 °C |
| Minimum operating temperature |
-40 °C |
-40 °C |
| Nominal output power |
0.025 W |
0.025 W |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
VFBGA |
VFBGA |
| Encapsulate equivalent code |
BGA16,4X4,16 |
BGA16,4X4,16 |
| Package shape |
SQUARE |
SQUARE |
| Package form |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Peak Reflow Temperature (Celsius) |
260 |
260 |
| power supply |
3.6 V |
3.6 V |
| Certification status |
Not Qualified |
Not Qualified |
| Maximum seat height |
0.625 mm |
0.625 mm |
| Maximum slew rate |
2.9 mA |
2.9 mA |
| Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
| Minimum supply voltage (Vsup) |
2.3 V |
2.3 V |
| surface mount |
YES |
YES |
| Temperature level |
INDUSTRIAL |
INDUSTRIAL |
| Terminal surface |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal form |
BALL |
BALL |
| Terminal pitch |
0.4 mm |
0.4 mm |
| Terminal location |
BOTTOM |
BOTTOM |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
| width |
1.905 mm |
1.905 mm |
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