1-1-3 DC/DC Converter ICs
SI-8000JD Series
■Features
• Surface-mount package (TO263-5)
• Output current: 1.5A
• High efficiency: 77 to 88%
• Requires only 4 discrete components
• Internally-adjusted phase correction and
output voltage
Surface-Mount, Separate Excitation Step-down Switching Mode
■Lineup
Part Number
V
O
(V)
I
O
(A)
SI-8033JD
3.3
SI-8050JD
5.0
1.5
SI-8090JD
9.0
SI-8120JD
12.0
■Absolute
Maximum Ratings
Parameter
DC Input Voltage
Output Current
Power Dissipation
*
Junction Temperature
Storage Temperature
Thermal Resistance (Junction to Case)
Thermal Resistance (Junction to
Ambient Air)
Symbol
V
IN
I
O
P
D
T
j
T
stg
Ratings
43
1.5
3
+125
–40 to +125
3
33.3
Unit
V
A
W
°C
°C
°C/W
°C/W
When mounted on glass-epoxy board 40
×
40 mm (copper
area 100%)
When mounted on glass-epoxy board 40
×
40 mm (copper
area 100%)
Conditions
• Capable of downsizing a choke-coil due to IC's
high switching frequency (125 kHz). (Com-
pared with conventional Sanken devices)
• Built-in foldback-overcurrent and thermal
protection circuits
• Output ON/OFF available (Circuit current at
output OFF: 200
µ
A max)
• Soft start available by ON/OFF pin Conditions
θ
j-c
θ
j-a
*: Limited by thermal protection circuit
■Applications
• Power supplies for telecommunication equipment
• Onboard local power supplies, etc.
■Recommended
Operating Conditions
Ratings
Parameter
DC Input Voltage Range
DC Output Current Range
*
Operating Junction Temperature Range
Operating Temperature Range*
Symbol
V
IN1
V
IN2
I
O
T
jop
T
op
SI-8033JD
5.3 to 40
6.3 to 40
SI-8050JD
7 to 40
8 to 40
0 to 1.5
–30 to +125
–30 to +125
SI-8090JD
11 to 40
12 to 40
SI-8120JD
14 to 40
15 to 40
V
A
°C
°C
Unit
Conditions
I
O
=0 to 1A
I
O
=0 to 1.5A
V
IN
≥V
O
+3V
*: Limited by Ta–P
D
characteristics
■Electrical
Characteristics
Ratings
Parameter
Symbol
min.
V
O
Output Voltage
Efficiency
Oscillation Frequency
Line Regulation
Load Regulation
Temperature Coefficient of Output Voltage
Overcurrent Protection
Starting Current
Low Level Voltage
ON/OFF
*
Pin
Outflow Current
at Low Voltage
Conditions
3.234
SI-8033JD
typ.
3.30
77
V
IN
=15V, I
O
=0.5A
125
V
IN
=15V, I
O
=0.5A
25
10
±0.5
1.6
V
IN
=15V
0.5
100
7
V
IN
=15V, Io=0A
200
V
IN
=15V, V
ON/OFF
=0.3V
7
V
IN
=20V, Io=0A
200
V
IN
=20V, V
ON/OFF
=0.3V
1.6
V
IN
=20V
0.5
100
V
SSL
=0V
7
V
IN
=21V, Io=0A
200
V
IN
=21V, V
ON/OFF
=0.3V
7
V
IN
=24V, Io=0A
200
V
IN
=24V, V
ON/OFF
=0.3V
80
30
V
IN
=8 to 30V, I
O
=0.5A
V
IN
=15V, I
O
=0.2 to 0.8A
max.
3.366
min.
4.90
SI-8050JD
typ.
5.00
82
V
IN
=20V, I
O
=0.5A
125
V
IN
=20V, I
O
=0.5A
40
10
±0.5
1.6
V
IN
=21V
0.5
100
100
40
V
IN
=10 to 30V, I
O
=0.5A
V
IN
=20V, I
O
=0.2 to 0.8A
max.
5.10
min.
8.82
SI-8090JD
typ.
9.00
86
V
IN
=21V, I
O
=0.5A
125
V
IN
=21V, I
O
=0.5A
50
10
±1.0
1.6
V
IN
=24V
0.5
100
120
40
V
IN
=15 to 30V, I
O
=0.5A
V
IN
=21V, I
O
=0.2 to 0.8A
max.
9.18
min.
11.76
SI-8120JD
typ.
12.00
88
V
IN
=24V, I
O
=0.5A
125
V
IN
=24V, I
O
=0.5A
60
10
±1.0
130
V
IN
=18 to 30V, I
O
=0.5A
40
V
IN
=24V, I
O
=0.2 to 0.8A
max.
12.24
(T
a
=25°C)
Unit
V
IN
=15V, I
O
=0.5A
V
IN
=20V, I
O
=0.5A
V
IN
=21V, I
O
=0.5A
V
IN
=24V, I
O
=0.5A
V
%
kH
Z
mV
mV
mV/
°C
A
V
η
Conditions
f
Conditions
∆V
OLINE
Conditions
∆V
OLOAD
Conditions
∆V
O
/∆T
a
I
S1
Conditions
V
SSL
I
SSL
Conditions
I
q
Conditions
I
q(oFF)
Conditions
µ
A
mA
Quiescent Circuit Current
µ
A
*: Pin 5 is the ON/OFF pin. Soft start at power on can be performed with a capacitor connected to
this pin.
The output can also be turned ON/OFF with this pin.
The output is stopped by setting the voltage of this pin to V
SSL
or lower.
ON/OFF-pin voltage can be changed with an open-collector drive circuit of a transistor.
When using both the soft-start and ON/OFF functions together, the discharge current from C
3
flows into the ON/OFF control transistor. Therefore, limit the current securely to protect the
transistor if C
3
capacitance is large.
The ON/OFF pin is pulled up to the power supply in the IC, so applying the external voltage is
prohibited.
SI-8000JD
SI-8000JD
SI-8000JD
5 ON/OFF
5 ON/OFF
C3
5 ON/OFF
C3
V
OUT.
ON/OFF
Soft Start
Soft Start
+V
OUT.
ON/OFF
16
ICs
SI-8000JD Series
■External
Dimensions (TO263-5)
Case temperature
measurement point
(0.40)
±0.2
(Unit : mm)
10.0
±0.2
(8.0)
4.5
3-R0.3
±0.2
1.2
(15°)
(4.4)
1.3
+0.10
–0.05
(4.6)
(1.75)
(6.8)
±0.2
±0.2
φ
1.5 Dp:
±0.2
(3°)
(2×R0.45)
(3°)
±0.1
0.10
(3°)
±0.15
2.4
(R0.3)
±0.3
±0.2
0.88
±0.10
(R0.3)
0 to 6°
(0.5)
(1.7
±0.25
Pin Assignment
q
V
IN
w
SW
OUT
e
GND
r
V
OS
t
ON/OFF
Plastic Mold Package Type
Flammability: 94V-0
Product Mass: Approx. 1.48g
9.2±
±0.3
15.3
±0.2
2.0
15.30
±0.3
(0.75)
4.9
2.54
(1.7
±0.25
)
1
2
3
4
9.9
±0.2
0.8
±0.25
)
(1.7
5
(3°)
±0.1
)
0.8
±0.25
(1.7
)
±0.1
(3°)
2-R0.3
10.0
±0.02
■Block
Diagram
■Typical
Connection Diagram
L1
V
IN
1
V
IN
SW
OUT
2
4
+
Di
V
OUT
1
V
IN
PReg.
OCP
SW
OUT
2
4.9
±0.2
9.2
SI-8000JD
C
1
+
ON/OFF GND
5
3
C
3
V
OS
5 ON/OFF
ON/OFF
Soft
Start
Reset
OSC
+
–
C
2
Latch &
Drive
GND
Comp.
Error Amp.
+
–
GND
TSD
4
V
REF
GND
3
C
1
C
2
C
3
L
1
Di
:
:
:
:
:
50V/220
µ
F
25V/470
µ
F
10V/0.47
µ
F (Only when using soft-start function)
100
µ
H
SJPB-H6 (Sanken)
■Reference
Data
Copper Laminate Area on Glass Epoxy Board vs.
Thermal Resistance (Junction to Ambient Air) (Typical Value)
Thermal Resistance (junction to ambient air)
θ
j-a (°C/W )
55
50
2.6
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
Output Current vs. Power Dissipation (Typical)
With glass epoxy board of 40
×
40 mm
45
40
35
30
0
Power Dissipation
Pd (W)
40V
30V
20V
V
IN
8V
200
400
600
800
1000
1200
1400
1600
1800
Copper Laminate Area (mm
2
)
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
Output Current I
O
(A)
■T
a
-P
D
Characteristics
3.5
3
Copper Area
40×40 mm
(
θ
j-a : 33.3°C/W)
20×40 mm
(
θ
j-a : 37°C/W)
20×20 mm
(
θ
j-a :44°C/W)
10×10 mm
(
θ
j-a : 53°C/W)
P
D
=V
O
·I
O
100
V
O
–1 –V
F
·I
O
1–
ηχ
V
IN
Power Dissipation P
D
(W)
2.5
2
1.5
1
0.5
The efficiency depends on the input voltage and the output current. Therefore, obtain the value
from the efficiency graph and substitute the percentage in the formula above.
V
O
: Output Voltage
V
IN
: Input Voltage
I
O
: Output Current
ηχ
: Efficiency (%)
V
F
: D
1
forward voltage
0.4V(I
O
=2A)(SJPB-H6)
Thermal design for D
1
must be considered separately.
0
–25
0
25
50
75
100
125
Ambient Temperature T
a
(°C)
ICs
17
Embedded System
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