LED SPECIFICATION
530PY9C
Features
Single color
High bright output
Low power consumption
High reliability and long life
Descriptions
Dice material AlGaInP Hewlett Packard
Emitting Color
Super Bright Amber (Yellow)
Device Outline
5mm Round Type/ 5mm
Lens Type
Water Clear
1. All dimensions are millimeters
2. Tolerance is +/-0.25mm unless otherwise noted
Directivity
1.0
0°
Ta=25° C
IF=20mA
30°
Relative Luminous
0.5
60°
0
90°
60°
30°
0°
0.5
90°
1.0
Radiation Angle
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FLUX LED SPECIFICATION
Typical electrical/optical characteristic curves
100
Forward Current(mA)
80
60
40
20
0
1.2
2.0 2.4 2.8
1.6
Forward Voltage(V)
3.2
FORWARD CURRENT Vs
FORWARD VOLTAGE
2.5
Radiant Intensity(mW/sr)
Relative Value at IF=70mA
2.0
1.5
1.0
0.5
0
0
60
80
40
20
IF-Forward Current (mA)
100
RADIANT INTENSITY Vs.
FORWARD CURRENT
100
Forward Current(mA)
80
60
40
20
0
0
FORWARD CURRENT
DERATING CURVE
RADIANT INTENSITY Vs.
AMBIENT TEMPERATURE
2.5
2.0
Radiant Intensity
1.5
1.0
0.5
20
40
60
80
)
100
0
-30
30
50
70
90
-10
10
Ambient Temperature T
A
( )
Ambient Temperature T
A
(
Relative Luminous Intensity
100
75
50
25
0
400
450
500
600
550
Wavelength (nm)
650
700
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LED
SOLDERING
METHOD
LAMP APPLICATION
SOLDERING CONDITIONS
REMARK
Solder no closer than 3mm from the
base of the package
Using soldering flux,” RESIN FLUX”
is recommended.
DIP
SOLDERING
Bath temperature: 260±5
Immersion time: with 5 sec
During soldering, take care not to
press the tip of iron against the
lead.
Soldering iron: 30W or smaller
SOLDERING
Temperature at tip of iron: 260 or lower (To prevent heat from being
IRON
Soldering time: within 5 sec.
transferred directly to the lead, hold
the lead with a pair of tweezers
while soldering
1) When soldering the lead of LED in a condition that the package is fixed with a panel (See Fig.1),
be careful not to stress the leads with iron tip.
2) When soldering wire to the lead, work with a Fig (See Fig.2) to avoid stressing the package.
Page : 5
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