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IS42S32400A-10TI

Description
Synchronous DRAM, 4MX32, 7ns, CMOS, PDSO86, PLASTIC, TSOP2-86
Categorystorage    storage   
File Size532KB,61 Pages
ManufacturerIntegrated Silicon Solution ( ISSI )
Download Datasheet Parametric View All

IS42S32400A-10TI Overview

Synchronous DRAM, 4MX32, 7ns, CMOS, PDSO86, PLASTIC, TSOP2-86

IS42S32400A-10TI Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerIntegrated Silicon Solution ( ISSI )
Parts packaging codeTSOP2
package instructionTSSOP, TSSOP86,.46,20
Contacts86
Reach Compliance Codecompliant
ECCN codeEAR99
access modeFOUR BANK PAGE BURST
Maximum access time7 ns
Other featuresAUTO/SELF REFRESH
Maximum clock frequency (fCLK)100 MHz
I/O typeCOMMON
interleaved burst length1,2,4,8
JESD-30 codeR-PDSO-G86
JESD-609 codee0
length22.22 mm
memory density134217728 bit
Memory IC TypeSYNCHRONOUS DRAM
memory width32
Humidity sensitivity level3
Number of functions1
Number of ports1
Number of terminals86
word count4194304 words
character code4000000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize4MX32
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Encapsulate equivalent codeTSSOP86,.46,20
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3.3 V
Certification statusNot Qualified
refresh cycle4096
Maximum seat height1.2 mm
self refreshYES
Continuous burst length1,2,4,8,FP
Maximum standby current0.002 A
Maximum slew rate0.15 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width10.16 mm
Base Number Matches1
IS42S81600A,
IS42S16800A,
IS42S32400A,
16Meg x 8, 8Meg x16 & 4Meg x 32
128-MBIT SYNCHRONOUS DRAM
FEATURES
• Clock frequency: 166,143,100 MHz
• Fully synchronous; all signals referenced to a
positive clock edge
• Internal bank for hiding row access/precharge
• Power supply
IS42S81600A
IS42S16800A
IS42S32400A
• LVTTL interface
• Programmable burst length
– (1, 2, 4, 8, full page)
• Programmable burst sequence:
Sequential/Interleave
• Auto Refresh (CBR)
• Self Refresh with programmable refresh periods
• 4096 refresh cycles every 64 ms
• Random column address every clock cycle
• Programmable
CAS
latency (2, 3 clocks)
• Burst read/write and burst read/single write
operations capability
• Burst termination by burst stop and precharge
command
• Industrial Temperature Availability
• Lead-free Availability
V
DD
3.3V
3.3V
3.3V
V
DDQ
3.3V
3.3V
3.3V
IS42S81600A
4M x8x4 Banks
54-pin TSOPII
ISSI
®
PRELIMINARY INFORMATION
JANUARY 2005
OVERVIEW
ISSI
's 128Mb Synchronous DRAM achieves high-speed
data transfer using pipeline architecture. All inputs and
outputs signals refer to the rising edge of the clock
input.The 128Mb SDRAM is organized as follows.
IS42S16800A
2M x16x4 Banks
54-pin TSOPII
IS42S32400A
1M x32x4 Banks
86-pin TSOPII
KEY TIMING PARAMETERS
Parameter
Clk Cycle Time
CAS
Latency = 3
CAS
Latency = 2
Clk Frequency
CAS
Latency = 3
CAS
Latency = 2
Access Time from Clock
CAS
Latency = 3
CAS
Latency = 2
-6
6
-
166
-
5.4
-
-7
7
10
143
100
5.4
6
-10
10
10
100
100
7
9
Unit
ns
ns
Mhz
Mhz
ns
ns
Copyright © 2005 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any
time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are
advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
PRELIMINARY INFORMATION, Rev. 00C
01/20/05
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