TSPC860MHVG50A3 datasheet, PDF

TSPC860MHVG50A3: DescriptionMicroprocessor, 32-Bit, 50MHz, CMOS, CBGA357, CERAMIC, BGA-357; CategoryThe embedded processor and controller Microcontrollers and processors; File Size4MB，95 Pages; Manufacturere2v technologies

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TSPC860MHVG50A3 Overview

Microprocessor, 32-Bit, 50MHz, CMOS, CBGA357, CERAMIC, BGA-357

Parameter Name	Attribute value
Maker	e2v technologies
Parts packaging code	BGA
package instruction	,
Contacts	357
Reach Compliance Code	unknown
ECCN code	3A001.A.3
Address bus width	32
bit size	32
boundary scan	YES
maximum clock frequency	50 MHz
External data bus width	32
Format	FIXED POINT
Integrated cache	YES
JESD-30 code	S-CBGA-B357
low power mode	NO
Number of terminals	357
Maximum operating temperature	110 °C
Minimum operating temperature	-40 °C
Package body material	CERAMIC, METAL-SEALED COFIRED
Package shape	SQUARE
Package form	GRID ARRAY
Certification status	Not Qualified
speed	50 MHz
Maximum supply voltage	3.465 V
Minimum supply voltage	3.135 V
Nominal supply voltage	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal location	BOTTOM
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR
Base Number Matches	1

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