LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LHR2043
Page 1/4
Package Dimensions
3.0
4.0
4.2
5.2
1.5MAX
25.0MIN
□0.5
TYP
1.0MIN
2.54TYP
Note : 1.All dimension are in millimeter tolerance is
±
0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
Directivity Radiation
0
°
-30
°
30
°
-60
°
60
°
100% 75% 50%
25%
0
25%
50% 75% 100%
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO.
LHR2043
Page 2/4
Absolute Maximum Ratings at Ta=25
℃
Ratings
Parameter
Symbol
HR
UNIT
Forward Current
Peak Forward Current
Duty 1/10@10KHz
Power Dissipation
Reverse Current @5V
Operating Temperature
Storage Temperature
Soldering Temperature
I
F
I
FP
PD
Ir
T
opr
Tstg
Tsol
30
100
100
10
-40 ~ +85
-40 ~ +100
Max 260
℃
for 5 sec Max
mA
mA
mW
μ
A
℃
℃
Typical Electrical & Optical Characteristics (Ta=25
℃
)
PART NO
MATERIAL
Emitted
COLOR
Peak
wave
length
λ
Pnm
Spectral
halfwidth
△λ
nm
Forward
voltage
@
20
mA(V)
Min.
Max.
2.4
Luminous
intensity
@20mA(mcd)
Min.
220
Typ.
350
Viewing
angle
2
θ
1/2
(deg)
Lens
Water Clear
660
20
LHR2043
GaAlAs
Red
1.5
30
Note : 1.The forward voltage data did not including
±
0.1V testing tolerance.
2. The luminous intensity data did not including
±
15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LHR2043
Page3/4
Typical Electro-Optical Characteristics Curve
HR CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
Relative Intensity@20mA
1.0
2.0
3.0
4.0
5.0
1000
3.0
2.5
2.0
1.5
1.0
0.5
0
1.0
10
100
1000
Forward Current(mA)
100
10
1.0
0.1
Forward Voltage(V)
Fig.3 Forward Voltage vs. Temperature
Forward Current(mA)
Fig.4 Relative Intensity vs. Temperature
Forward Voltage@20mA
Relative Intensity@20mA
80
100
1.2
1.1
1.0
0.9
0.8
-40
-20
-0
20
40
60
3.0
2.5
2.0
1.5
1.0
0.5
0
-40
-20
-0
20
40
60
80
100
Ambient Temperature(
℃
)
Ambient Temperature(
℃
)
Fig.5 Relative Intensity vs. Wavelength
1.0
Relative Intensity@20mA
0.5
0
600
650
700
750
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LHR2043
Page 4/4
Reliability Test:
Test Item
Test Condition
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
Description
This test is conducted for the purpose
of detemining the resisance of a part
in electrical and themal stressed.
The purpose of this is the resistance of
the device which is laid under ondition
of hogh temperature for hours.
Reference
Standard
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
Operating Life Test
High Temperature
Storage Test
1.Ta=105
℃±
5
℃
2.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-883:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40
℃±
5
℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
JIS C 7021: B-12
High Temperature
High Humidity Test
1.Ta=65
℃±
5
℃
2.RH=90 %~95%
3.t=240hrs
±
2hrs
The purpose of this test is the resistance
of the device under tropical for hous.
MIL-STD-202:103B
JIS C 7021: B-11
Thermal Shock Test
1.Ta=105
℃±
5
℃
&-40
℃±
5
℃
(10min) (10min)
2.total 10 cycles
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
This test intended to see soldering well
performed or not.
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Solder Resistance
Test
1.T.Sol=260
℃±
5
℃
2.Dwell time= 10
±
1sec.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
Solderability Test
1.T.Sol=230
℃±
5
℃
2.Dwell time=5
±
1sec
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