LX5541
TM
®
Co-Package 2.3 – 2.5 GHz HBT Power Amp +
pHEMT Low Noise Amplifier + SPDT Switch
P
RODUCTION
D
ATA
S
HEET
KEY FEATURES
DESCRIPTION
LX5541 is a co-package RFIC
consisting
of
an
InGaP/GaAs
Heterojunction Bipolar Transistor
(HBT) power amplifier, an InGaAs
pseudomorphic HEMT (pHEMT) low
noise amplifier, and a SPDT switch.
All three RF devices are optimized for
WLAN applications in the 2.3 to 2.5
GHz frequency range.
The PA is implemented as a two-
stage monolithic microwave integrated
circuit (MMIC) with active bias and
output pre-matching. The LNA is fully
matched internally, and the LNA is
connected to the RX port of SPDT
switch directly inside the MLPQ
package.
Both PA and LNA operate with
single low voltage supply of 3.3V.
The PA (including SPDT switch loss)
offers 27 dB power gain between 2.3-
2.5GHz, at a low quiescent current of
90mA.
For 19dBm OFDM output power
(64QAM, 54Mbps) at the antenna port,
the PA including SPDT switch provides
a low EVM (Error-Vector Magnitude)
of about 3%, and consumes 145 mA
total DC current.
The LNA (including SPDT switch
loss) offers 13 dB gain, 2 dB noise
figure (switch contribution included)
and a high input IP3 of +5 dBm at 10
mA DC current.
LX5541 is available in a low profile
16-pin 3mmx3mm micro-lead package
(MLPQ-16L). LX5541 with a PA,
LNA and SPDT integrated in a small,
low profile, and low thermal resistance
package offers an ideal compact front
end solution for IEEE 802.11b/g/n
applications.
Small Footprint: 3x3mm
Low Profile: 0.45mm
2.3-2.5GHz Operation
Single-Polarity 3.3V
Supply
2
W W W.
Microsemi
.CO
M
On-Chip Active Bias Circuit
for both PA and LNA
TX Features:
Input matched PA
Quiescent Current ~ 90mA
Power Gain ~ 27 dB *
Total Current ~ 145mA for
Pout=19 dBm OFDM *
EVM~3 % at 19dBm (2%
at 17dBm) 54Mbps/64QAM
RX Features:
LNA Gain ~ 13 dB *
LNA Noise Figure ~ 2 dB *
LNA Input IP3 ~ +5dBm *
LNA On-Chip Input/Output
Match
* Including SPDT switch loss
APPLICATIONS
IMPORTANT:
For the most current data, consult
MICROSEMI’s
website:
http://www.microsemi.com
IEEE 802.11b/g/n
BLOCK DIAGRAM
Vdd
RxOut
Vcc
Vref
TxIn
Det
Vdd
LNAO
Ctl1
Ctl2
Ctl1
Ctl2
Ant
Ant
Vcc
Vb1/Vb2
PAIn
DetO
SwTxI
LX5541
LX5541
PAOut
DetI
Ext.
Match
Copyright
2006
Rev. 1.3, 2008-02-11
Microsemi
Analog Mixed Signal Group
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 1
LX5541
TM
®
Co-Package 2.3 – 2.5 GHz HBT Power Amp +
pHEMT Low Noise Amplifier + SPDT Switch
P
RODUCTION
D
ATA
S
HEET
PRODUCT HIGHLIGHT
W W W.
Microsemi
.CO
M
MSC
MSC
5530
5541
608Y
717A
PACKAGE ORDER INFO
LL
Plastic MLPQ
16 pin 3X3
RoHS Compliant /Pb-free
LX5541LL
Note: Available in Tape & Reel.
Append the letters “TR” to the part number.
(i.e. LX5541LL-TR)
ABSOLUTE MAXIMUM RATINGS
PACKAGE PIN OUT
Vc1
Vcc
E
L
X
T
RI
C
1
LS
L
X
T
5
CA
E
L
EC
5
RI
4
1
LS
L
EC
5
54
A
DC Supply Voltage, RF off (PA) ...................................................................... 5V
(LNA) .................................................................. 4V
Collector Current (PA) ............................................................................... 500mA
Drain current (LNA) ................................................................................. 40mA
Total Power Dissipation ....................................................................................2W
RF Input Power ........................................................................................
+10
dbm
Operation Ambient Temperature................................................... -40°C to +85°C
Storage Temperature ................................................................... -65°C to +150°C
Peak Package Solder Reflow Temp. (40 second max exposure) -260°C (+0,-5)
Note: Exceeding these ratings could cause damage to the device. All voltages are with respect
Ground. Currents are positive into, negative out of specified terminal
.
x
denotes respective pin designator 1, 2, or 3
to
13
NC
14
15
NC
PAOut
DetI
SwTxI
Ctl1
16
12
11
10
9
8
7
6
5
1
2
3
4
PAIn
Vb1
Vb2
DetO
ANT
Ctl2
Vdd
LNAO
P
ACKAGE
D
ATA
P
ACKAGE
D
ATA
LQ P
ACKAGE
(Bottom View)
THERMAL DATA
RoHS/Pb-free 100% Matte Tin Lead finish
LL
Plastic MLPQ 3X3 X1
12.8 C/W
53.4 C/W
THERMAL RESISTANCE
-
JUNCTION TO
C
ASE
,
θ
JC
THERMAL RESISTANCE
-
JUNCTION TO
A
MBIENT
,
θ
JA
Copyright
2006
Rev. 1.3, 2008-02-11
Microsemi
Analog Mixed Signal Group
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 2
TM
®
WWW .
Microsemi
.C
OM
INFORMATION
Thank you for your interest in Microsemi
®
Analog Mixed Signal products.
The full data sheet for this device contains proprietary information.
To obtain a copy, please contact your local Microsemi sales representative. The
name of your local representative can be obtained at the following link
http://www.microsemi.com/contact/contactfind.asp
or
Contact us directly by sending an email to:
IPGdatasheets@microsemi.com
Be sure to specify the data sheet you are requesting and include your company
name and contact information and or vcard.
We look forward to hearing from you.
Copyright
Microsemi
Analog Mixed Signal Group
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
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