EPF1100TSL-9.375M
REGULATORY COMPLIANCE
2011/65 +
2015/863
(Data Sheet downloaded on Aug 31, 2020)
191 SVHC
ITEM DESCRIPTION
Quartz Crystal Clock Oscillators XO (SPXO) HCMOS/TTL (CMOS) 5.0Vdc 14 Pin DIP Metal Thru-Hole 9.375MHz ±100ppm
-20°C to +70°C
ELECTRICAL SPECIFICATIONS
Nominal Frequency
Frequency Tolerance/Stability
Aging at 25°C
Operating Temperature Range
Supply Voltage
Input Current
Output Voltage Logic High (Voh)
Output Voltage Logic Low (Vol)
Rise/Fall Time
Duty Cycle
Load Drive Capability
Output Logic Type
Pin 1 Connection
Pin 1 Input Voltage (Vih and Vil)
Disable Current
Peak to Peak Jitter (tPK)
RMS Period Jitter (tRMS)
Start Up Time
Storage Temperature Range
9.375MHz
±100ppm Maximum (Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability over the Operating
Temperature Range, Supply Voltage Change, Output Load Change, First Year Aging at 25°C, Shock, and Vibration)
±5ppm/year Maximum
-20°C to +70°C
5.0Vdc ±10%
45mA Maximum (Unloaded)
2.4Vdc Minimum (IOH = -16mA)
0.4Vdc Maximum (IOL = +16mA)
4nSec Maximum (Measured at 0.8Vdc to 2.0Vdc)
50 ±10(%) (Measured at 1.4Vdc with TTL Load; Measured at 50% of waveform with HCMOS Load)
10TTL Load Maximum
TTL
Tri-State (Disabled Output: High Impedance)
+2.0Vdc Minimum to enable output, +0.8Vdc to disable output, No Connect to enable output.
30mA Maximum (Pin 1 = Ground)
500pSec Maximum, 90pSec Typical
50pSec Maximum, 13pSec Typical
10mSec Maximum
-55°C to +125°C
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
Fine Leak Test
Gross Leak Test
Lead Integrity
Mechanical Shock
Resistance to Soldering Heat
Resistance to Solvents
Solderability
Temperature Cycling
Vibration
MIL-STD-883, Method 1014, Condition A
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 2004
MIL-STD-202, Method 213, Condition C
MIL-STD-202, Method 210
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
MIL-STD-883, Method 1010
MIL-STD-883, Method 2007, Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Revision B 03/25/2014 | Page 1 of 7
Ecliptek, LLC
5458 Louie Lane, Reno, NV 89511
1-800-ECLIPTEK or 714.433.1200
EPF1100TSL-9.375M
MECHANICAL DIMENSIONS (all dimensions in millimeters)
15.240
±0.203
7.620
±0.203
1
14
7
8
5.08 MIN
5.08 MAX
13.2
MAX
MARKING
ORIENTATION
DIA 0.457
±0.100 (X4)
PIN
CONNECTION
Tri-State (High
Impedance)
Ground/Case Ground
Output
Supply Voltage
0.9 MAX
1
7
8
14
LINE MARKING
1
2
3
ECLIPTEK
9.3750M
XXXXX
XXXXX=Ecliptek
Manufacturing Identifier
20.8 MAX
www.ecliptek.com | Specification Subject to Change Without Notice | Revision B 03/25/2014 | Page 2 of 7
Ecliptek, LLC
5458 Louie Lane, Reno, NV 89511
1-800-ECLIPTEK or 714.433.1200
EPF1100TSL-9.375M
OUTPUT WAVEFORM & TIMING DIAGRAM
TRI-STATE INPUT
V
IH
V
IL
CLOCK OUTPUT
V
OH
80% or 2.0V
DC
50% or 1.4V
DC
20% or 0.8V
DC
V
OL
OUTPUT DISABLE
(HIGH IMPEDANCE
STATE)
t
PLZ
Fall
Time
Rise
Time
T
W
T
Duty Cycle (%) = T
W
/T x 100
t
PZL
www.ecliptek.com | Specification Subject to Change Without Notice | Revision B 03/25/2014 | Page 3 of 7
Ecliptek, LLC
5458 Louie Lane, Reno, NV 89511
1-800-ECLIPTEK or 714.433.1200
EPF1100TSL-9.375M
Test Circuit for TTL Output
Output Load
Drive Capability
10TTL
5TTL
R
L
Value
(Ohms)
390
780
C
L
Value
(pF)
15
15
Oscilloscope
Frequency
Counter
Table 1: R
L
Resistance Value and C
L
Capacitance
Value Vs. Output Load Drive Capability
+
+
Power
Supply
_
+
Voltage
Meter
_
Current
Meter
_
Supply
Voltage
(V
DD
)
Probe
(Note 2)
Output
R
L
(Note 4)
+
0.01µF
(Note 1)
0.1µF
(Note 1)
C
L
(Note 3)
Power
Supply
_
Ground
Power Down
or Tri-State
Note 1: An external 0.01µF ceramic bypass capacitor in parallel with a 0.1µF high frequency ceramic bypass
capacitor close (less than 2mm) to the package ground and supply voltage pin is required.
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth
(>300MHz) passive probe is recommended.
Note 3: Capacitance value C
L
includes sum of all probe and fixture capacitance.
Note 4: Resistance value R
L
is shown in Table 1. See applicable specification sheet for 'Load Drive Capability'.
Note 5: All diodes are MMBD7000, MMBD914, or equivalent.
www.ecliptek.com | Specification Subject to Change Without Notice | Revision B 03/25/2014 | Page 4 of 7
Ecliptek, LLC
5458 Louie Lane, Reno, NV 89511
1-800-ECLIPTEK or 714.433.1200
EPF1100TSL-9.375M
Recommended Solder Reflow Methods
High Temperature Solder Bath (Wave Solder)
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
Additional Notes
3°C/Second Maximum
150°C
175°C
200°C
60 - 180 Seconds
3°C/Second Maximum
217°C
60 - 150 Seconds
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
20 - 40 Seconds
6°C/Second Maximum
8 Minutes Maximum
Level 1
Temperatures shown are applied to back of PCB board and device leads only. Do
not use this method for product with the Gull Wing option.
www.ecliptek.com | Specification Subject to Change Without Notice | Revision B 03/25/2014 | Page 5 of 7
Ecliptek, LLC
5458 Louie Lane, Reno, NV 89511
1-800-ECLIPTEK or 714.433.1200
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