MT28C128532W30EBW-F705P856BTWT datasheet, PDF

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MT28C128532W30EBW-F705P856BTWT: DescriptionMemory Circuit, 4MX16, CMOS, PBGA77, LEAD FREE, FBGA-77; Categorystorage storage; File Size203KB，15 Pages; ManufacturerMicron Technology; Websitehttp://www.mdtic.com.tw/

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MT28C128532W30EBW-F705P856BTWT Overview

Memory Circuit, 4MX16, CMOS, PBGA77, LEAD FREE, FBGA-77

MT28C128532W30EBW-F705P856BTWT Parametric

Parameter Name	Attribute value
Maker	Micron Technology
Parts packaging code	BGA
package instruction	LFBGA,
Contacts	77
Reach Compliance Code	unknown
Other features	CELLULARRAM IS ORGANIZED AS 2M X 16; CONTAINS ADDITIONAL 4M X 16 FLASH
JESD-30 code	R-PBGA-B77
JESD-609 code	e1
length	10 mm
memory density	67108864 bit
Memory IC Type	MEMORY CIRCUIT
memory width	16
Number of functions	1
Number of terminals	77
word count	4194304 words
character code	4000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-25 °C
organize	4MX16
Package body material	PLASTIC/EPOXY
encapsulated code	LFBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH
Certification status	Not Qualified
Maximum seat height	1.4 mm
Maximum supply voltage (Vsup)	1.95 V
Minimum supply voltage (Vsup)	1.7 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal surface	TIN SILVER COPPER
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
width	8 mm
Base Number Matches	1

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128Mb MULTIBANK BURST FLASH

32Mb/64Mb BURST CellularRAM COMBO

FLASH AND CellularRAM

™

COMBO MEMORY

Features

Stacked die Combo package

• Includes two 64Mb Flash devices

• Choice of either one 32Mb or one 64Mb CellularRAM

device

Basic configuration

Flash

• Flexible multibank architecture

• 4 Meg x 16 configuration

• Async/Page/Burst interface

• Support for true concurrent operations with no latency

CellularRAM

• Low-power, high-density design

• 2 Meg x 16 or 4 Meg x 16 configurations

• Burst interface

F_V

, V

Q, F_V

, C_V

voltages

• 1.70V (MIN)/1.95V (MAX) F_V

, C_V

• 1.70V (MIN)/2.24V (MAX) V

Q (W18)

• 2.20V (MIN)/3.30V (MAX) V

Q (W30)

• 1.80V (TYP) F_V

(in-system PROGRAM/ERASE)

•

12V ±5% (HV) F_

tolerant (factory programming

MT28C128532W18/W30E

MT28C128564W18/W30E

Low Voltage, Wireless Temperature

Figure 1: 77-Ball FBGA

A18

A19

C_VSS

F_VCC

A21

A11

C_LB#

C_VSS

CLK

RFU

A12

A17

F_VPP

C_WE#

C_CE#

A13

F_WP#

ADV#

A20

A10

A15

C_UB#

F_RST#

F_WE#

A14

A16

DQ8

DQ2

DQ10

DQ5

DQ13

WAIT#

F_CE2#

C_OE#

DQ0

DQ1

DQ3

DQ12

DQ14

DQ7

F_OE2#

F_OE1#

DQ9

DQ11

DQ4

DQ6

DQ15

VCCQ

F_CE1#

C_VCC

F_VCC

VCCQ

C_CRE

compatibility)

Fast programming Algorithm (FPA)

Enhanced suspend options

• ERASE-SUSPEND-to-READ within same bank

• PROGRAM-SUSPEND-to-READ within same bank

• ERASE-SUSPEND-to-PROGRAM within same bank

Each Flash contains two 64-bit chip protection registers for

security purposes

100,000 ERASE cycles per block

Cross-compatible command set support

• Extended command set

• Common Flash interface (CFI) compliant

Manufacturer’s Identification Code (ManID)

• Micron

• Intel

C_VSS

VSSQ

VCCQ

F_VCC

C_VSS

VSSQ

F_VSS

C_VSS

Top View

(Ball Down)

Options

Flash Timing

• 60ns

(W18)

• 70ns (W18/W30)

Flash Burst Frequency

• 66 MHz

(W18)

• 54 MHz (W18/W30)

Flash Boot Block Configuration

• Top/Top

• Top/Bottom

• Bottom/Top

• Bottom/Bottom

CellularRAM Timing

• 70ns

• 85ns

CellularRAM Burst Frequency

• 66 MHz

I/O Voltage Range

• VccQ 1.70V–2.24V (W18)

• VccQ 2.20V–3.30V (W30)

Manufacturer’s Identification Code (ManID)

• Micron (0x2Ch)

• Intel (0x89h)

Operating Temperature Range

• Wireless Temperature (-25°C to +85°C)

Package

• 77-ball FBGA (Standard) 8 x 10 grid

• 77-ball FBGA (Lead-free) 8 x 10 grid

NOTE:

1. Contact factory for availability.

2. Contact factory for details.

09005aef80df9a45

MT28C128564W18E.fm - Rev. C Pub 2/04 EN

PRODUCTS AND SPECIFICATIONS DISCUSSED HEREIN ARE SUBJECT TO CHANGE BY MICRON WITHOUT NOTICE.

128Mb MULTIBANK BURST FLASH

32Mb/64Mb BURST CellularRAM COMBO

Table of Contents

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1

Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1

Device General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5

Flash General Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5

Flash Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5

CellularRAM General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5

Part Number Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8

Valid Part Number Combinations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8

Device Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8

Boot Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

MultiChip Packaging Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

Unique IDs, State Machines, and Registers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

Command Codes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

READ Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

Flash Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

Power Consumption. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12

Data Sheet Designation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14

Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15

09005aef80df9a45

MT28C128564W18E.fm - Rev. C Pub 2/04 EN

Micron Technology, Inc., reserves the right to change products or specifications without notice.

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