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P6SMBJ300AP

Description
DIODE 600 W, UNIDIRECTIONAL, SILICON, TVS DIODE, DO-214AA, SMBJ, 2 PIN, Transient Suppressor
CategoryDiscrete semiconductor    diode   
File Size1MB,4 Pages
ManufacturerMicro Commercial Components (MCC)
Environmental Compliance  
Download Datasheet Parametric View All

P6SMBJ300AP Overview

DIODE 600 W, UNIDIRECTIONAL, SILICON, TVS DIODE, DO-214AA, SMBJ, 2 PIN, Transient Suppressor

P6SMBJ300AP Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerMicro Commercial Components (MCC)
Parts packaging codeDO-214AA
package instructionSMBJ, 2 PIN
Contacts2
Reach Compliance Codeunknown
Base Number Matches1
MCC
Features
  omponents
20736 Marilla Street Chatsworth

  !"#
$ %    !"#
P6SMBJ6.8(C)A
THRU
P6SMBJ550(C)A
Transient
Voltage Suppressor
6.8 to 550 Volts
600 Watt
DO-214AA
(SMBJ) (LEAD FRAME)
A
l
For surface mount applicationsin in or der to optimize
boar d space
l
L ow pr ofil e package
l
Fast response time: typical less than 1.0ps from 0 volts to
V
BR
minimum
l
Low inductance
l
Excellent clamping capability
Mechanical Data
l
l
l
CASE: JEDEC DO-214AA
Terminals: solderable per MIL-STD-750, Method 2026
Polarity: Color band denotes posit ive end (cathode)
except Bidirectional
l
Maximum soldering temperature: 250 C for 10 seconds
o
B
C
Maximum Ratings @ 25
o
C Unless Otherwise Specified
Peak Pulse Current on
I
PP
See Table 1 Note: 1
10/1000us waveform
Peak Pulse Power
P
PP
600W
Note: 1,
Dissipation
Peak Forward Surge
I
FSM)
100A
Note: 3
Current
Operation And Storage T
J
, T
STG
Temperature Range
-55
o
C to
+150
o
C
DIM
A
B
C
D
E
F
G
H
F
H
D
G
E
DIMENSIONS
INCHES
MIN
.160
.130
.006
.030
.200
.079
.075
.002
MM
MIN
4.06
3.30
0.15
0.76
5.08
2.00
1.91
0.05
MAX
.185
.155
.012
.060
.220
.096
.087
.008
MAX
4.70
3.94
0.31
1
..52
5.59
2.44
2.21
0.203
NOTE
NOTES:
1.
2.
3.
Non-repetitive current pulse, per Fig.3 and derated above
o
T
A
=25 C per Fig.2.
2
Mounted on 5.0mm copper pads to each terminal.
8.3ms, single half sine wave duty cycle=4 pulses per. Minute
maximum.
SUGGESTED SOLDER
PAD LAYOUT
0.106"
0.082”
0.050”
www.mccsemi.com
Revision: 2
2004/08/20
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