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HY5V66DLF-S

Description
Synchronous DRAM, 4MX16, 6ns, CMOS, PBGA54, 0.80 MM PITCH, FBGA-54
Categorystorage    storage   
File Size740KB,13 Pages
ManufacturerSK Hynix
Websitehttp://www.hynix.com/eng/
Download Datasheet Parametric View All

HY5V66DLF-S Overview

Synchronous DRAM, 4MX16, 6ns, CMOS, PBGA54, 0.80 MM PITCH, FBGA-54

HY5V66DLF-S Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerSK Hynix
Parts packaging codeBGA
package instructionTFBGA, BGA54,9X9,32
Contacts54
Reach Compliance Codecompliant
ECCN codeEAR99
access modeFOUR BANK PAGE BURST
Maximum access time6 ns
Other featuresAUTO/SELF REFRESH
Maximum clock frequency (fCLK)100 MHz
I/O typeCOMMON
interleaved burst length1,2,4,8
JESD-30 codeS-PBGA-B54
length8 mm
memory density67108864 bit
Memory IC TypeSYNCHRONOUS DRAM
memory width16
Number of functions1
Number of ports1
Number of terminals54
word count4194304 words
character code4000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize4MX16
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeTFBGA
Encapsulate equivalent codeBGA54,9X9,32
Package shapeSQUARE
Package formGRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3.3 V
Certification statusNot Qualified
refresh cycle4096
Maximum seat height1.2 mm
self refreshYES
Continuous burst length1,2,4,8,FP
Maximum standby current0.002 A
Maximum slew rate0.16 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width8 mm
Base Number Matches1
Preliminary
HY5V66D(L)F(P) Series
4Banks x 1M x 16bits Synchronous DRAM
Document Title
4Bank x 1M x 16bits Synchronous DRAM
Revision History
Revision No.
0.1
History
Initial Draft
Draft Date
FEBRUARY 2004
Remark
Preliminary
This document is a general product description and is subject to change without notice. Hynix does not assume any responsibility for
use of circuits described. No patent licenses are implied.
Rev. 0.1 / Feb. 2004
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