HYM71V16M635HCLT6-H datasheet, PDF

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HYM71V16M635HCLT6-H: DescriptionSynchronous DRAM Module, 16MX64, 5.4ns, CMOS, SODIMM-144; Categorystorage storage; File Size156KB，14 Pages; ManufacturerSK Hynix; Websitehttp://www.hynix.com/eng/

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HYM71V16M635HCLT6-H Overview

Synchronous DRAM Module, 16MX64, 5.4ns, CMOS, SODIMM-144

HYM71V16M635HCLT6-H Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	SK Hynix
Parts packaging code	MODULE
package instruction	DIMM, DIMM144,32
Contacts	144
Reach Compliance Code	unknown
ECCN code	EAR99
access mode	DUAL BANK PAGE BURST
Maximum access time	5.4 ns
Other features	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	133 MHz
I/O type	COMMON
JESD-30 code	R-XDMA-N144
length	67.6 mm
memory density	1073741824 bit
Memory IC Type	SYNCHRONOUS DRAM MODULE
memory width	64
Number of functions	1
Number of ports	1
Number of terminals	144
word count	16777216 words
character code	16000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	16MX64
Output characteristics	3-STATE
Package body material	UNSPECIFIED
encapsulated code	DIMM
Encapsulate equivalent code	DIMM144,32
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3.3 V
Certification status	Not Qualified
refresh cycle	4096
Maximum seat height	3.8 mm
self refresh	YES
Maximum standby current	0.008 A
Maximum slew rate	1.76 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal pitch	0.8 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	31.75 mm
Base Number Matches	1

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16Mx64 bits

PC133 SDRAM SO DIMM

based on 8Mx16 SDRAM with LVTTL, 4 banks & 4K Refresh

HYM71V16M635HC(L)T6 Series

DESCRIPTION

The Hynix HYM71V16M635HC(L)T6 Series are 16Mx64bits Synchronous DRAM Modules. The modules are composed of eight

8Mx16bits CMOS Synchronous DRAMs in 400mil 54pin TSOP-II package, one 2Kbit EEPROM in 8pin TSSOP package on a 144pin

glass-epoxy printed circuit board. Two 0.33uF and one 0.1uF decoupling capacitors per each SDRAM are mounted on the PCB.

The Hynix HYM71V16M635HC(L)T6 Series are Dual In-line Memory Modules suitable for easy interchange and addition of

128Mbytes memory. The Hynix HYM71V16M635HC(L)T6 Series are fully synchronous operation referenced to the positive edge of

the clock . All inputs and outputs are synchronized with the rising edge of the clock input. The data paths are internally pipelined to

achieve very high bandwidth.

FEATURES

•

PC133/PC100MHz support

144pin SDRAM SO DIMM

Serial Presence Detect with EEPROM

1.25” (31.75mm) Height PCB with double sided com-

ponents

Single 3.3±0.3V power supply

- 1, 2, 4 or 8 or Full page for Sequential Burst

•

All device pins are compatible with LVTTL interface

- 1, 2, 4 or 8 for Interleave Burst

Data mask function by DQM

•

Programmable CAS Latency ; 2, 3 Clocks

•

SDRAM internal banks : four banks

Module bank : two physical bank

Auto refresh and self refresh

4096 refresh cycles / 64ms

Programmable Burst Length and Burst Type

ORDERING INFORMATION

Part No.

HYM71V16M635HCT6-K

Normal

HYM71V16M635HCT6-H

133MHz

HYM71V16M635HCLT6-K

Low Power

HYM71V16M635HCLT6-H

4 Banks

TSOP-II

Gold

Clock

Frequency

Internal

Bank

Ref.

Power

SDRAM

Package

Plating

This document is a general product description and is subject to change without notice. Hynix Semiconductor Inc. does not assume any responsibility for

use of circuits described. No patent licenses are implied.

Rev. 0.3/Dec. 01

HYM71V16M635HCLT6-H Related Products

	HYM71V16M635HCLT6-H	HYM71V16M635HCT6-H	HYM71V16M635HCT6-K	HYM71V16M635HCLT6-K
Description	Synchronous DRAM Module, 16MX64, 5.4ns, CMOS, SODIMM-144	Synchronous DRAM Module, 16MX64, 5.4ns, CMOS, SODIMM-144	Synchronous DRAM Module, 16MX64, 5.4ns, CMOS, SODIMM-144	Synchronous DRAM Module, 16MX64, 5.4ns, CMOS, SODIMM-144
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Parts packaging code	MODULE	MODULE	MODULE	MODULE
package instruction	DIMM, DIMM144,32	DIMM, DIMM144,32	DIMM, DIMM144,32	DIMM, DIMM144,32
Contacts	144	144	144	144
Reach Compliance Code	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99
access mode	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST
Maximum access time	5.4 ns	5.4 ns	5.4 ns	5.4 ns
Other features	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	133 MHz	133 MHz	133 MHz	133 MHz
I/O type	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-XDMA-N144	R-XDMA-N144	R-XDMA-N144	R-XDMA-N144
length	67.6 mm	67.6 mm	67.6 mm	67.6 mm
memory density	1073741824 bit	1073741824 bit	1073741824 bit	1073741824 bit
Memory IC Type	SYNCHRONOUS DRAM MODULE	SYNCHRONOUS DRAM MODULE	SYNCHRONOUS DRAM MODULE	SYNCHRONOUS DRAM MODULE
memory width	64	64	64	64
Number of functions	1	1	1	1
Number of ports	1	1	1	1
Number of terminals	144	144	144	144
word count	16777216 words	16777216 words	16777216 words	16777216 words
character code	16000000	16000000	16000000	16000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C
organize	16MX64	16MX64	16MX64	16MX64
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
encapsulated code	DIMM	DIMM	DIMM	DIMM
Encapsulate equivalent code	DIMM144,32	DIMM144,32	DIMM144,32	DIMM144,32
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	3.3 V	3.3 V	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
refresh cycle	4096	4096	4096	4096
Maximum seat height	3.8 mm	3.8 mm	3.8 mm	3.8 mm
self refresh	YES	YES	YES	YES
Maximum standby current	0.008 A	0.008 A	0.008 A	0.008 A
Maximum slew rate	1.76 mA	1.76 mA	1.76 mA	1.76 mA
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3 V	3 V	3 V	3 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	NO LEAD	NO LEAD	NO LEAD	NO LEAD
Terminal pitch	0.8 mm	0.8 mm	0.8 mm	0.8 mm
Terminal location	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	31.75 mm	31.75 mm	31.75 mm	31.75 mm
Maker	SK Hynix	-	SK Hynix	SK Hynix

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