HB56U832SB-6N datasheet, PDF - EEWORLD Datasheet

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HB56U832SB-6N: DescriptionEDO DRAM Module, 8MX32, 60ns, CMOS, SIP-72; Categorystorage storage; File Size310KB，25 Pages; ManufacturerHitachi （Renesas ）; Websitehttp://www.renesas.com/eng/

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HB56U832SB-6N Overview

EDO DRAM Module, 8MX32, 60ns, CMOS, SIP-72

HB56U832SB-6N Parametric

Parameter Name	Attribute value
Parts packaging code	MODULE
package instruction	SIMM, SSIM72
Contacts	72
Reach Compliance Code	unknown
ECCN code	EAR99
access mode	FAST PAGE WITH EDO
Maximum access time	60 ns
I/O type	COMMON
JESD-30 code	R-XSMA-N72
memory density	268435456 bit
Memory IC Type	EDO DRAM MODULE
memory width	32
Number of functions	1
Number of ports	1
Number of terminals	72
word count	8388608 words
character code	8000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	8MX32
Output characteristics	3-STATE
Package body material	UNSPECIFIED
encapsulated code	SIMM
Encapsulate equivalent code	SSIM72
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
power supply	5 V
Certification status	Not Qualified
refresh cycle	2048
Maximum seat height	25.4 mm
self refresh	NO
Maximum standby current	0.016 A
Maximum slew rate	0.76 mA
Maximum supply voltage (Vsup)	5.25 V
Minimum supply voltage (Vsup)	4.75 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	SINGLE
Base Number Matches	1

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HB56U832 Series, HB56U432 Series

8,388,608-word

32-bit High Density Dynamic RAM Module

4,194,304-word

32-bit High Density Dynamic RAM Module

ADE-203-736A (Z)

Rev.1.0

Feb. 7, 1997

Description

The HB56U832 is a 8M

32 dynamic RAM module, mounted 16 pieces of 16-Mbit DRAM (HM5117405)

sealed in SOJ package. The HB56U432 is a 4M

32 dynamic RAM module, mounted 8 pieces of 16-Mbit

DRAM (HM5117405) sealed in SOJ package. The HB56U832, HB56U432 offer Extended Data Out

(EDO) Page Mode as a high speed access time. An outline of the HB56U832, HB56U432 is 72-pin single

in-line package. Therefore, the HB56U832, HB56U432 make high density mounting possible without

surface mount technology. The HB56U832, HB56U432 provide common data inputs and outputs.

Decoupling capacitors are mounted on the module board.

Features

•

72-pin single in-line package



Outline: 107.95 mm (Length)

25.40 mm (Height)

9.14/5.28 mm (Thickness)



Lead pitch: 1.27 mm

Single 5 V (±5%) supply

High speed



Access time: t

RAC

= 50/60/70 ns (max)

Low power dissipation



Active mode: 4.41/3.99/3.57W (max) (HB56U832 Series)

4.20/3.78/3.36 W (max) (HB56U432 Series)



Standby mode (TTL): 168 mW (max) (HB56U832 Series)

(TTL): 84 mW (max) (HB56U432 Series)

(CMOS): 12.6 mW (max) (L-version) (HB56U832 Series)

(CMOS): 6.3 mW (max) (L-version) (HB56U432 Series)

EDO page mode capability

Refresh period



2048 refresh cycles: 32 ms

128 ms (L-version)

•

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