HBN3010 datasheet, PDF - EEWORLD Datasheet

HBN3010: DescriptionTelecom Circuit, 1-Func, CMOS, PBGA176, PLASTIC, CSP, BGA-176; CategoryWireless rf/communication Telecom circuit; File Size724KB，14 Pages; ManufacturerSK Hynix; Websitehttp://www.hynix.com/eng/

Download Datasheet Parametric View All

HBN3010 Overview

Telecom Circuit, 1-Func, CMOS, PBGA176, PLASTIC, CSP, BGA-176

Parameter Name	Attribute value
Parts packaging code	BGA
package instruction	LFBGA, BGA176,15X15,32
Contacts	176
Reach Compliance Code	compliant
JESD-30 code	S-PBGA-B176
JESD-609 code	e1
length	13 mm
Number of functions	1
Number of terminals	176
Package body material	PLASTIC/EPOXY
encapsulated code	LFBGA
Encapsulate equivalent code	BGA176,15X15,32
Package shape	SQUARE
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH
power supply	3.3 V
Certification status	Not Qualified
Maximum seat height	1.4 mm
Nominal supply voltage	3.3 V
surface mount	YES
technology	CMOS
Telecom integrated circuit types	TELECOM CIRCUIT
Terminal surface	TIN SILVER COPPER
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
width	13 mm
Base Number Matches	1

!"#$"%

&'(! "

)

&*+(

.- !/ '

0"%

.0%/ #

10%2!

&45

066

.0"-/ #

7 1

%82

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components