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K7M163625A-FC600

Description
ZBT SRAM, 512KX36, 6ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165
Categorystorage    storage   
File Size298KB,25 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
Download Datasheet Parametric View All

K7M163625A-FC600 Overview

ZBT SRAM, 512KX36, 6ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165

K7M163625A-FC600 Parametric

Parameter NameAttribute value
Parts packaging codeBGA
package instructionLBGA,
Contacts165
Reach Compliance Codeunknown
ECCN code3A991.B.2.A
Maximum access time6 ns
Other featuresFLOW-THROUGH ARCHITECTURE
JESD-30 codeR-PBGA-B165
length15 mm
memory density18874368 bit
Memory IC TypeZBT SRAM
memory width36
Number of functions1
Number of terminals165
word count524288 words
character code512000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize512KX36
Package body materialPLASTIC/EPOXY
encapsulated codeLBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, LOW PROFILE
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum seat height1.4 mm
Maximum supply voltage (Vsup)3.465 V
Minimum supply voltage (Vsup)3.135 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
width13 mm
Base Number Matches1
K7M163625A
K7M163225A
K7M161825A
Document Title
512Kx36/32 & 1Mx18 Flow-Through NtRAM
TM
512Kx36/32 & 1Mx18-Bit Flow Through NtRAM
TM
Revision History
Rev. No.
0.0
0.1
0.2
0.3
History
1.
1.
1.
2.
1.
2.
Initial document.
Add JTAG Scan Order
Remove bin -90
Updated DC characteristics(ICC,ISB,ISB1,ISB2)
Add x32 org and industrial temperature .
Add 165FBGA package
Draft Date
Feb. 23. 2001
May. 10. 2001
Aug. 03. 2001
Aug. 30. 2001
Remark
Preliminary
Preliminary
Preliminary
Preliminary
1.0
2.0
2.1
1. Final spec release
1. Add the speed bin (-60)
1. Delete 119BGA package.
2. Correct the Ball Size of 165 FBGA.
May. 10. 2002
Oct. 26, 2002
April. 04. 2003
Final
Final
Final
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the
specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters of this device. If you have any ques-
tions, please contact the SAMSUNG branch office near your office, call or contact Headquarters.
-1-
April 2003
Rev 2.1
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