EGL34A THRU EGL34G
SURFACE MOUNT GLASS PASSIVATED ULTRAFAST RECTIFIER
Reverse Voltage - 50 to 400 V
Forward Current - 0.5 A
Features
• Plastic package has Underwriters Laboratories
Flammability Classification 94V-0
• High temperature metallurgically bonded construction
• Cavity-free glass passivated junction
• Fast switching for high efficiency
Mechanical Data
• Case: MiniMELF (DO-213AA), molded plastic body
• Terminals: Solder plated, solderable per MIL-STD-750,
method 2026
• Polarity: Color band denotes cathode end
• Mounting Position: Any
MiniMELF (DO-213AA) Plastic Package
Absolute Maximum Ratings and Characteristics
Ratings at 25
O
C ambient temperature unless otherwise specified.
Parameter
Maximum Repetitive Peak Reverse Voltage
Maximum RMS Voltage
Maximum DC Blocking Voltage
Maximum Average Forward Rectified Current
at T
T
= 75
O
C
Peak Forward Surge Current 8.3 ms Single Half Sine
Wave Superimposed on Rated Load (JEDEC Method)
Maximum Forward Voltage at 0.5 A
Maximum Reverse Current
at Rated DC Blocking Voltage
Maximum Reverse recovery time
Typical Junction Capacitance
2)
Typical Thermal Resistance
3), 4)
Operating and Storage Temperature Range
1)
2)
3)
4)
Symbols
EGL34A EGL34B EGL34C EGL34D EGL34F EGL34G
Units
V
RRM
V
RMS
V
DC
I
F(AV)
I
FSM
V
F
T
A
= 25
O
C
T
A
= 125
O
C
1)
50
35
50
100
70
100
150
105
150
0.5
10
1.25
5
50
50
7
150
70
200
140
200
300
210
300
400
280
400
V
V
V
A
A
1.35
V
μA
ns
pF
O
I
R
t
rr
C
J
R
θJA
R
θJT
T
j
,T
stg
C/W
O
- 65 to + 175
C
Test conditions: I
F
= 0.5 A, I
R
= 1 A, I
rr
= 0.25 A
Measured at 1 MHz and applied reverse voltage of 4 VDC.
Thermal resistance from junction to ambient, 0.24" X 0.24"(6 X 6 mm) copper pads to each terminals.
Thermal resistance from junction to terminal, 0.24" X 0.24"(6 X 6 mm) copper pads to each terminals.
SEMTECH ELECTRONICS LTD.
(Subsidiary
of Sino-Tech International Holdings Limited, a company
listed on the Hong Kong Stock Exchange, Stock Code: 724)
®
Dated : 12/02/2009 V
Buy&Sell
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