The documentation and process conversion
measures necessary to comply with this
revision shall be completed by 16 November 1998
INCH-POUND
MIL-PRF-19500/646A
16 August 1998
SUPERSEDING
MIL-PRF-19500/646
18 April 1997
PERFORMANCE SPECIFICATION SHEET
SEMICONDUCTOR DEVICE, DIODE, SILICON,
POWER RECTIFIER, ULTRAFAST,
TYPES 1N6774 THROUGH 1N6777
JAN, JANTX, JANTXV, AND JANS
This specification is approved for use by all Depart-
ments and Agencies of the Department of Defense.
1. SCOPE
1.1 Scope. This specification covers the performance requirements for silicon, ultrafast, power rectifier diodes.
Four levels of product assurance are provided for each device type as specified in MIL-PRF-19500.
1.2 Physical dimensions. See figure 1 (2 pin, isolated - TO-257).
1.3 Maximum ratings.
Types
V
RWM
I
D
= 10
µA
dc
Vdc
I
F
1/
T
C
=
+100°C
Adc
I
FSM
t
p
= 8.3ms
A(pk)
R
θJC
R
θJA
T
STG
and
T
OP
°C/
W
°C/W
40
°C
1N6774
1N6775
1N6776
1N6777
50
100
150
200
15
180
2.0
-65 to +150
1/ Derate at 300 mA/°C above T
c
= +100°C.
1.4 Primary electrical characteristics. Unless otherwise specified, primary electrical characteristics are at +25°C.
Types
V
F1
I
F
= 8 A dc
V
F2
I
F
= 15 A
dc
V dc
1.15
I
R1
V
R
= 0.8 V
RWM
(See 1.3)
µA
dc
10
I
R2
1/
V
R
= 0.8 V
RWM
T
C
= +100°C
µA
dc
500
t
rr
C
J
V
R
= 5 V
f = 1 MHz
pF
300
ALL
1/ see 1.3
V dc
1.00
ns
35
Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of
use in improving this document should be addressed to: Commander, Defense Supply Center,
Columbus, ATTN: DSCC-VA, 3990 East Broad Street, Columbus, Ohio 43216-5000, by using the
Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this
document or by letter.
AMSC N/A
FSC 5961
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
MIL-PRF-19500/646A
Dimensions
Symbol
Min
BL
CH
LD
LL
LO
LS
MHD
MHO
TL
TT
TW
NOTES:
1. Dimensions are in inches.
2. Metric equivalents are given for general information only. See 3.3.
3. All terminals are isolated from case.
.410
.249
.035
.500
Inches
Max
.430
.260
.045
.750
Millimeters
Min
10.4
6.32
0.89
12.70
Max
10.9
6.60
1.14
19.05
.150 typ
.200 bsc
.140
.527
.645
.040
.410
.150
.537
.665
.050
.420
3.81 typ
5.08 bsc
3.55
13.4
16.4
1.02
10.4
3.80
13.6
16.9
1.27
10.7
Configuration
Terminal
1
2
Description
Cathode
Anode
1
2
FIGURE 1. Physical dimensions and configuration (2 pin, isolated) (similar to TO-257).
2
MIL-PRF-19500/646A
2. APPLICABLE DOCUMENTS
2.1 General. The documents listed in this section are specified in sections 3 and 4 of this specification. This
section does not include documents cited in other sections of this specification or recommended for additional
information or as examples. While every effort has been made to ensure the completeness of this list, document
users are cautioned that they must meet all specified requirements documents cited in sections 3 and 4 of this
specification, whether or not they are listed.
2.2 Government documents.
2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a
part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are
those listed in the issue of the Department of Defense Index of Specifications and Standards (DODISS) and
supplement thereto, cited in the solicitation (see 6.2).
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-19500 - Semiconductor Devices, General Specification for.
STANDARD
MILITARY
MIL-STD-750 - Test Methods for Semiconductor Devices.
(Unless otherwise indicated, copies of federal and military specifications, standards, and handbooks are available
from the Standardization Documents Order Desk, Building 4D, 700 Robbins Avenue, Philadelphia, PA
19111-5094.)
2.3 Order of precedence. In the event of a conflict between the text of this document and the references cited
herein (except for related associated specifications or specification sheets), the text of this document takes
precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific
exemption has been obtained.
3. REQUIREMENTS
3.1 Associated specification. The individual item requirements shall be in accordance with MIL-PRF-19500 and
as specified herein.
3.2 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions used herein shall be as
specified in MIL-PRF-19500.
3.3 Interface requirements and physical dimensions. The interface requirements and physical dimensions shall
be as specified in MIL-PRF-19500 and on figure 1 (TO-257) herein. Methods used for electrical isolation of the
terminal feedthroughs shall employ materials that contain a minimum of 90 percent Al
2
O
3
(ceramic). Examples of
such construction techniques are metallized ceramic eyelets or ceramic walled packages. The preferred
measurements used herein is the metric SI system. However, since this item was originally designed using inch-
pound units of measurement, in the event of a conflict between the metric and inch-pound units, the inch-pound
units shall take precedence.
3
MIL-PRF-19500/646A
3.3.1 Lead material and finish. Lead finish shall be solderable in accordance with MIL-PRF-19500,
MIL-STD-750, and herein. Where a choice of lead finish or formation is desired, it shall be specified in the
acquisition document (see 6.2). When lead formation is performed, as a minimum, the vendor shall perform 100
percent hermetic seal in accordance with screen 14 of table II of MIL-PRF-19500 and 100 percent DC testing in
accordance with group A, subgroup 2 herein.
3.3.2
Polarity. Polarity and terminal configuration shall be in accordance with figure 1 herein.
3.4 Marking. Marking shall be in accordance with MIL-PRF-19500.
3.5 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance
characteristics are as specified in 1.3, 1.4, and table I herein.
3.6 Electrical test requirements. The electrical test requirements shall be the subgroups specified in 4.4.2 and
4.4.3 herein.
3.7 Qualification. Devices furnished under this specification shall be products that are authorized by the
qualifying activity for listing on the applicable qualified products list before contract award (see 4.2 and 6.2 ).
4. QUALITY ASSURANCE VERIFICATION
4.1 Classification of Inspections. The inspection requirements specified herein are classified as follows:
a. Qualification inspection (see 4.2).
b. Screening (see 4.3)
c. Conformance inspection (see 4.4).
4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-19500, and table III
herein.
4
MIL-PRF-19500/646A
4.3
Screening (JANTX, JANTXV, and JANS levels). Screening shall be in accordance with table IV of
MIL-PRF-19500, and as specified herein. The following measurements shall be made in accordance with
table I herein. Devices that exceed the limits of table I herein shall not be acceptable.
Screen (see
table IV of MIL-
PRF-19500)
3C 1/
Measurement
JANS level
Thermal impedance (see 4.3.2)
JANTX and JANTXV levels
Thermal impedance (see 4.3.2)
9 and 10
Not applicable
Not applicable
11
I
R1
and V
F2
I
R1
and V
F2
12
See 4.3.1, t = 240 hours
See 4.3.1, t = 48 hours
13
Subgroups 2 and 3 of table I
herein;
V
F2
and
∆I
R1
; I
R1
≤
100 percent of
initial value or ±2.5
µA,
whichever
is
greater;
∆V
F2
≤
±100 mV.
Subgroup 2 of table I herein;
V
F2
and I
R1
;
∆I
R1
≤
100 percent of
initial value or ±2.5
µA,
whichever
is greater;
∆V
F2
≤
±100 mV.
1/ Thermal impedance shall be performed any time before screen 13.
4.3.1 Power burn-in conditions. Power burn-in conditions are as follows:
MIL-STD-750 method 1038, test condition A. T
C
= +125°C; V
R
= 0.8 of rated V
RWM
(see 1.3).
4.3.2 Thermal impedance (Z
θJX
) measurements for screening. The Z
θJX
measurements shall be performed in
accordance with MIL-STD-750, method 3101. The maximum limit (not to exceed the group A, subgroup 2 limit)
and conditions for Z
θJX
in screening (table IV of MIL-PRF-19500) shall be derived by each vendor by means of
statistical process control. When the process has exhibited control and capability, the capability data shall be used
to establish the fixed screening limit. In addition to screening, once a fixed limit has been established, monitor all
future sealing lots using a random five piece sample from each lot to be plotted on the applicable X, R chart. If a lot
exhibits an out of control condition, the entire lot shall be removed from the line and held for Engineering evaluation
and disposition.
4.3.2.1 Thermal impedance (Z
θJX
) measurements for initial qualification or requalification. The Z
θJX
measurements shall be performed in accordance with MIL-STD-750, method 3101 (read and record data Z
θJX
).
Derived conditions limits and thermal response curve shall be supplied to the qualifying activity on the qualification
lot prior to qualification approval. Measurement conditions shall be in accordance with 4.4.1.
4.4 Conformance inspection. Conformance inspection shall be in accordance with MIL-PRF-19500 and as
specified herein.
5
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