IC,BUS TRANSCEIVER,SINGLE,4-BIT,AS-TTL,DIP,16PIN,PLASTIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | National Semiconductor（TI ） |
| package instruction | DIP, DIP16,.3 |
| Reach Compliance Code | unknown |
| Control type | COMMON CONTROL |
| Counting direction | UNIDIRECTIONAL |
| JESD-30 code | R-PDIP-T16 |
| JESD-609 code | e0 |
| Number of digits | 4 |
| Number of functions | 1 |
| Number of terminals | 16 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Output characteristics | 3-STATE |
| Output polarity | TRUE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP16,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| surface mount | NO |
| technology | TTL |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| DP8216N/A+ | DP8216J/A+ | DP8226N/A+ | |
|---|---|---|---|
| Description | IC,BUS TRANSCEIVER,SINGLE,4-BIT,AS-TTL,DIP,16PIN,PLASTIC | IC,BUS TRANSCEIVER,SINGLE,4-BIT,AS-TTL,DIP,16PIN,CERAMIC | IC,BUS TRANSCEIVER,SINGLE,4-BIT,AS-TTL,DIP,16PIN,PLASTIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible |
| package instruction | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 |
| Reach Compliance Code | unknown | unknown | unknown |
| Control type | COMMON CONTROL | COMMON CONTROL | COMMON CONTROL |
| Counting direction | UNIDIRECTIONAL | UNIDIRECTIONAL | UNIDIRECTIONAL |
| JESD-30 code | R-PDIP-T16 | R-XDIP-T16 | R-PDIP-T16 |
| JESD-609 code | e0 | e0 | e0 |
| Number of digits | 4 | 4 | 4 |
| Number of functions | 1 | 1 | 1 |
| Number of terminals | 16 | 16 | 16 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE |
| Output polarity | TRUE | TRUE | INVERTED |
| Package body material | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP16,.3 | DIP16,.3 | DIP16,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE |
| surface mount | NO | NO | NO |
| technology | TTL | TTL | TTL |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL |
| Maker | National Semiconductor（TI ） | National Semiconductor（TI ） | - |
| Base Number Matches | - | 1 | 1 |
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