The documentation and process conversion
measures necessary to comply with this revision
shall be completed by 25 July 2007.
INCH-POUND
MIL-PRF-19500/116P
25 April 2007
SUPERSEDING
MIL-PRF-19500/116N
27 September 2006
PERFORMANCE SPECIFICATION SHEET
SEMICONDUCTOR DEVICE, DIODE, SILICON, SWITCHING, TYPES 1N4148-1, 1N4148UR-1,
1N4148UB, 1N4148UB2, 1N4148UB2R, 1N4148UBCA, 1N4148UBCC, 1N4148UBD, 1N914,
1N914UR, 1N4531, AND 1N4531UR, JAN, JANTX, JANTXV, JANHC, AND JANKC
JANS1N4148-1 (see 6.4). Device types 1N914 and 1N4531 are inactive for new design.
This specification is approved for use by all Departments and Agencies
of the Department of Defense.
The requirements for acquiring the product described herein shall consist
of this specification sheet and MIL-PRF-19500.
1. SCOPE
1.1 Scope. This specification covers the performance requirements for switching diodes. Three levels of product
assurance are provided for each device type as specified in MIL-PRF-19500. Two levels of product assurance are
provided for each unencapsulated device type.
1.2 Physical dimensions. See figures 1 (DO-35, DO-34), 2 (DO-213AA), 3 (UB), 4 (UB2), and 5 (die).
1.3 Maximum ratings. Unless otherwise specified T = +25°C.
A
VBR VRWM IO(PCB) IFSM TSTG
R
ΘJL
R
ΘJEC
R
ΘJA(PCB)
R
ΘJSP
tp = & TJ L = .375 inch (UR)
TA =
(2) (3) (4)
(UB)
Type
(9.53 mm)
(3)
(3) (4)
75°C 8.3ms
(3)
(1)
°C/W
°C/W
°C/W
°C/W
1N4148-1
325
250
1N4148UR-1
100
1N4148UB, 1N4148UB2,
325
120
1N4148UB2R, 1N4148UBCA,
1N4148UBCC, 1N4148UBD
1N4531
250
325
-65 to
1N4531UR
+175
100
1N914
250
325
1N914UR
100
(1) For temperature-current derating curves, see figures 6 and 7.
(2) T
A
= +75°C for both axial and Metal Electrode Leadless Face diodes (MELF) (UR) on printed circuit board
(PCB), PCB = FR4 - .0625 inch (1.59 mm) 1-layer 1-Oz Cu, horizontal, in still air; pads for (UR) = .061 inch
(1.55 mm) x.105 inch (2.67 mm); pads for axial = .092 inch (2.34 mm) diameter, strip = .030 inch (0.76 mm) x
1 inch (25.4 mm) long, lead length L
≤
0.187 inch (≤ 4.75 mm); R
ΘJA
with a defined PCB thermal resistance
condition included, is measured at IO = 200 mA dc.
(3) See figures 8, 9, and 10 for thermal impedance curves.
(4) R
ΘJSP
refers to thermal resistance from junction to the solder pads of the UB package.
V dc V (pk)
100
75
mA
200
Comments, suggestions, or questions on this document should be addressed to Defense Supply Center,
Columbus, ATTN: DSCC-VAC, P.O. Box 3990, Columbus, OH 43218-3990, or emailed to
semiconductor@dscc.dla.mil
. Since contact information can change, you may want to verify the currency of
this address information using the ASSIST Online database at
http://assist.daps.dla.mil
.
AMSC N/A
FSC 5961
A (pk)
°C
2
-65 to
+175
-65 to
+200
MIL-PRF-19500/116P
1.4 Primary electrical characteristics at T
A
= +25°C, unless otherwise indicated.
Type
(1)
VF1
IF mA dc
1N4148-1
1N914
1N4531
Type
(1)
10
10
10
V dc
0.8
0.8
0.8
VF2
IF mA dc
100
50
100
IR4 at
VR = 75 V dc
TA = 150°C
µA
dc
75
75
75
V dc
1.2
1.2
1.2
IR1 at
VR = 20 V dc
nA dc
25
25
25
tfr at
Vfr = 5.0 V dc (pk) and
IF = 50 mA dc
ns
20
20
20
IR2 at
VR = 75 V dc
nA dc
500
500
500
trr
IR3 at
VR = 20 V dc
TA = 150°C
µA
dc
35
35
35
ns
5
5
5
1N4148-1
1N914
1N4531
(1) Primary electrical characteristics for surface mount devices are equivalent to the corresponding non-surface
mount devices unless otherwise noted.
2. APPLICABLE DOCUMENTS
2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification. This
section does not include documents cited in other sections of this specification or recommended for additional
information or as examples. While every effort has been made to ensure the completeness of this list, document
users are cautioned that they must meet all specified requirements of documents cited in sections 3, 4, or 5 of this
specification, whether or not they are listed.
2.2 Government documents.
2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a
part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are
those cited in the solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
MIL-PRF-19500
-
Semiconductor Devices, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-750
-
Test Methods for Semiconductor Devices.
(Copies of these documents are available online at
http://assist.daps.dla.mil/quicksearch/
or
http://assist.daps.dla.mil
or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D,
Philadelphia, PA 19111-5094.)
2.3 Order of precedence. In the event of a conflict between the text of this document and the references cited
herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws
and regulations unless a specific exemption has been obtained.
2
MIL-PRF-19500/116P
Types
Ltr
1N4148-1
1N914
(DO-35)
1N4531
(DO-34)
BD
BL
LD
LL
BD
BL
LD
LL
Dimensions
Inches
Min
Max
.056
.075
.140
.180
.018
.022
1.000
1.500
.050
.075
.080
.120
.018
.022
1.000
1.500
Millimeters
Min
Max
1.42
1.91
3.56
4.57
0.46
0.56
25.40
38.10
1.27
1.90
2.03
3.05
0.46
0.56
25.40
38.10
NOTES:
1. Dimensions are in inches.
2. Millimeters are given for general information only.
3. In accordance with ASME Y14.5M, diameters are equivalent to
Φx
symbology.
TYPES 1N4148-1, 1N914, AND 1N4531.
FIGURE 1. Physical dimensions.
3
MIL-PRF-19500/116P
DO-213AA
Symbol
BD
BL
ECT
S
Dimensions
Inches
Millimeters
Min
Max
Min
Max
.063
.067
1.60 1.70
.130
.146
3.30 3.71
.016
.022
0.41 0.56
.001 min
0.03 min
NOTES:
1. Dimensions are in inches.
2. Millimeters are given for general information only.
3. Dimensions are pre-solder dip.
4. Referencing to dimension S, minimum clearance of glass body to mounting surface on all orientations.
5. In accordance with ASME Y14.5M, diameters are equivalent to
Φx
symbology.
TYPES 1N914UR, 1N4148UR-1, AND 1N4531UR.
FIGURE 2. Physical dimensions (DO-213AA).
4
MIL-PRF-19500/116P
UB
1N4148UBCA
1N4148UB
2
1N4148UBD
1
Dimensions
Inches
Millimeters
Max
Min
Max
Min
.046
.056
1.17
1.42
.115
.128
2.92
3.25
.085
.108
2.16
2.74
.128
3.25
.108
2.74
.022
.038
0.56
0.97
.017
.035
0.43
0.89
Dimensions
Inches
Millimeters
Min
Max
Min
Max
.035
.039
0.89
0.99
.071
.079
1.80
2.01
.016
.024
0.41
0.61
.008
0.20
.012
0.31
.022
0.56
1N4148UBCC
Symbol
Symbol
BH
LS1
BL
LS2
BW
LW
CL
r
CW
r1
LL1
r2
LL2
NOTES:
1. Dimensions are in inches. Millimeters are given for general information only.
2. Ceramic package only.
3. Hatched areas on package denote metallized areas. Pad 4 = shielding, connected to the lid.
4. In accordance with ASME Y14.5M, diameters are equivalent to
Φx
symbology.
* FIGURE 3. Physical dimensions, surface mount (UB versions).
5
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