EEWORLDEEWORLDEEWORLD

Part Number

Search

AS7C33256PFS18A-200TQI

Description
Standard SRAM, 256KX18, 8.5ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100
Categorystorage    storage   
File Size283KB,11 Pages
ManufacturerALSC [Alliance Semiconductor Corporation]
Download Datasheet Parametric Compare View All

AS7C33256PFS18A-200TQI Overview

Standard SRAM, 256KX18, 8.5ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100

AS7C33256PFS18A-200TQI Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Parts packaging codeQFP
package instructionLQFP, QFP100,.63X.87
Contacts100
Reach Compliance Codeunknown
ECCN code3A991.B.2.A
Is SamacsysN
Maximum access time8.5 ns
Maximum clock frequency (fCLK)200 MHz
I/O typeCOMMON
JESD-30 codeR-PQFP-G100
JESD-609 codee0
length20 mm
memory density4718592 bit
Memory IC TypeSTANDARD SRAM
memory width18
Number of functions1
Number of terminals100
word count262144 words
character code256000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize256KX18
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeLQFP
Encapsulate equivalent codeQFP100,.63X.87
Package shapeRECTANGULAR
Package formFLATPACK, LOW PROFILE
Parallel/SerialPARALLEL
power supply2.5/3.3,3.3 V
Certification statusNot Qualified
Maximum seat height1.6 mm
Maximum standby current0.03 A
Minimum standby current3.14 V
Maximum slew rate0.57 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3.135 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationQUAD
width14 mm
Base Number Matches1
March 2002
®
AS7C33256PFS16A
AS7C33256PFS18A
3.3V 256K
×
16/18 pipeline burst synchronous SRAM
Features
• Organization: 262,144 words × 16 or 18 bits
• Fast clock speeds to 200 MHz in LVTTL/LVCMOS
• Fast clock to data access: 3.0/3.1/3.5/4.0/5.0 ns
• Fast OE access time: 3.0/3.1/3.5/4.0/5.0 ns
• Fully synchronous register-to-register operation
• “Flow-through” mode
• Single-cycle deselect
- Dual-cycle deselect also available (AS7C33256PFD16A/
AS7C33256PFD18A)
• Pentium®
1
compatible architecture and timing
• Asynchronous output enable control
• Economical 100-pin TQFP package
• Byte write enables
• Multiple chip enables for easy expansion
• 3.3V core power supply
• 2.5V or 3.3V I/O operation with separate V
DDQ
• 30 mW typical standby power in power down mode
• NTD™
1
pipeline architecture available
(AS7C33256NTD16A/AS7C33256NTD18A)
1. Pentium
®
is a registered trademark of Intel Corporation. NTD™ is a
trademark of Alliance Semiconductor Corporation. All trademarks men-
tioned in this document are the property of their respective owners.
Logic block diagram
LBO
CLK
ADV
ADSC
ADSP
A[17:0]
CLK
CS
CLR
Pin arrangement
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
Burst logic
Q
18
D
CS
CLK
18
16 18
Address
register
256K × 16/18
Memory
array
A6
A7
CE0
CE1
NC
NC
BWb
BWa
CE2
V
DD
V
SS
CLK
GWE
BWE
OE
ADSC
ADSP
ADV
A8
A9
NC
NC
NC
V
DDQ
V
SSQ
NC
NC
DQb
DQb
V
SSQ
V
DDQ
DQb
DQb
FT
V
DD
NC
V
SS
DQb
DQb
V
DDQ
V
SSQ
DQb
DQb
DQpb/NC
NC
V
SSQ
V
DDQ
NC
NC
NC
16/18 16/18
GWE
BW
b
BWE
BW
a
CE0
CE1
CE2
D
DQb
Q
Byte Write
registers
Byte Write
registers
CLK
D
CLK
D
DQa
Q
2
OE
Enable
Q
register
Enable
Q
delay
register
CE
CLK
D
ZZ
Output
registers
CLK
Input
registers
CLK
Power
down
CLK
OE
FT
Selection guide
–200
Minimum cycle time
Maximum pipelined clock frequency
Maximum pipelined clock access time
Maximum operating current
Maximum standby current
Maximum CMOS standby current (DC)
5
200
3
570
160
30
–183
5.4
183
3.1
540
140
30
–166
6
166
3.5
475
130
30
–133
7.5
133
4
425
100
30
–100
10
100
5
325
90
30
Units
ns
MHz
ns
mA
mA
mA
3/8/02; V.1.5
Alliance Semiconductor
LBO
A5
A4
A3
A2
A1
A0
NC
NC
V
SS
V
DD
NC
NC
A10
A11
A12
A13
A14
A15
A16
16/18
DQ [a,b]
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
TQFP 14 × 20mm
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
A17
NC
NC
V
DDQ
V
SSQ
NC
DQpa/NC
DQa
DQa
V
SSQ
V
DDQ
DQa
DQa
VSS
NC
V
DD
ZZ
DQa
DQa
V
DDQ
V
SSQ
DQa
DQa
NC
NC
V
SSQ
V
DDQ
NC
NC
NC
Note: pins 24, 74 are NC for ×16.
P. 1 of 11
Copyright © Alliance Semiconductor. All rights reserved.

AS7C33256PFS18A-200TQI Related Products

AS7C33256PFS18A-200TQI AS7C33256PFS18A-200TQC AS7C33256PFS18A-100TQC AS7C33256PFS18A-133TQC AS7C33256PFS16A-183TQC AS7C33256PFS16A-183TQI AS7C33256PFS16A-200TQI AS7C33256PFS16A-200TQC AS7C33256PFS18A-183TQC AS7C33256PFS18A-183TQI
Description Standard SRAM, 256KX18, 8.5ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100 Standard SRAM, 256KX18, 8.5ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100 Standard SRAM, 256KX18, 12ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100 Standard SRAM, 256KX18, 10ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100 Standard SRAM, 256KX16, 9ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100 Standard SRAM, 256KX16, 9ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100 Standard SRAM, 256KX16, 8.5ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100 Standard SRAM, 256KX16, 8.5ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100 Standard SRAM, 256KX18, 9ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100 Standard SRAM, 256KX18, 9ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Parts packaging code QFP QFP QFP QFP QFP QFP QFP QFP QFP QFP
package instruction LQFP, QFP100,.63X.87 LQFP, QFP100,.63X.87 LQFP, QFP100,.63X.87 LQFP, QFP100,.63X.87 LQFP, QFP100,.63X.87 LQFP, QFP100,.63X.87 LQFP, QFP100,.63X.87 LQFP, QFP100,.63X.87 LQFP, QFP100,.63X.87 LQFP, QFP100,.63X.87
Contacts 100 100 100 100 100 100 100 100 100 100
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown unknown
ECCN code 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
Maximum access time 8.5 ns 8.5 ns 12 ns 10 ns 9 ns 9 ns 8.5 ns 8.5 ns 9 ns 9 ns
Maximum clock frequency (fCLK) 200 MHz 200 MHz 100 MHz 133 MHz 183 MHz 183 MHz 200 MHz 200 MHz 183 MHz 183 MHz
I/O type COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 code R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0 e0 e0
length 20 mm 20 mm 20 mm 20 mm 20 mm 20 mm 20 mm 20 mm 20 mm 20 mm
memory density 4718592 bit 4718592 bit 4718592 bit 4718592 bit 4194304 bit 4194304 bit 4194304 bit 4194304 bit 4718592 bit 4718592 bit
Memory IC Type STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
memory width 18 18 18 18 16 16 16 16 18 18
Number of functions 1 1 1 1 1 1 1 1 1 1
Number of terminals 100 100 100 100 100 100 100 100 100 100
word count 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words
character code 256000 256000 256000 256000 256000 256000 256000 256000 256000 256000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C 70 °C 70 °C 70 °C 70 °C 85 °C 85 °C 70 °C 70 °C 85 °C
organize 256KX18 256KX18 256KX18 256KX18 256KX16 256KX16 256KX16 256KX16 256KX18 256KX18
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LQFP LQFP LQFP LQFP LQFP LQFP LQFP LQFP LQFP LQFP
Encapsulate equivalent code QFP100,.63X.87 QFP100,.63X.87 QFP100,.63X.87 QFP100,.63X.87 QFP100,.63X.87 QFP100,.63X.87 QFP100,.63X.87 QFP100,.63X.87 QFP100,.63X.87 QFP100,.63X.87
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
power supply 2.5/3.3,3.3 V 2.5/3.3,3.3 V 2.5/3.3,3.3 V 2.5/3.3,3.3 V 2.5/3.3,3.3 V 2.5/3.3,3.3 V 2.5/3.3,3.3 V 2.5/3.3,3.3 V 2.5/3.3,3.3 V 2.5/3.3,3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm
Maximum standby current 0.03 A 0.03 A 0.03 A 0.03 A 0.03 A 0.03 A 0.03 A 0.03 A 0.03 A 0.03 A
Minimum standby current 3.14 V 3.14 V 3.14 V 3.14 V 3.14 V 3.14 V 3.14 V 3.14 V 3.14 V 3.14 V
Maximum slew rate 0.57 mA 0.57 mA 0.325 mA 0.425 mA 0.54 mA 0.54 mA 0.57 mA 0.57 mA 0.54 mA 0.54 mA
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL INDUSTRIAL COMMERCIAL COMMERCIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm
Terminal location QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD
width 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm
Maker - - ALSC [Alliance Semiconductor Corporation] - ALSC [Alliance Semiconductor Corporation] ALSC [Alliance Semiconductor Corporation] ALSC [Alliance Semiconductor Corporation] ALSC [Alliance Semiconductor Corporation] ALSC [Alliance Semiconductor Corporation] ALSC [Alliance Semiconductor Corporation]
Request WinCE.Net ASP to call text file method
I'm looking for a method to call a text file from an ASP page in WinCE.Net. I've tried but can't create a Scripting.FileSystemObject object and an ADODB.Stream object in a WinCE.Net ASP page. Do you h...
iyj Embedded System
Reliable packaging technology - bonding [transfer]
Bonding: Bonding in English, literally translated as "chip wire bonding". Bonding is a wire bonding method in the chip production process. It is generally used to connect the internal circuit of the c...
呱呱 FPGA/CPLD
Arrow Live: Focus on "TI FPD-Link III Automotive Chipset", the ideal solution for automotive video transmission
As cars become smarter, there will be more and more onboard cameras and information display screens in cars. All of these devices need to be connected to a processor. The TI FPD-Link III chipset provi...
EEWORLD社区 TI Technology Forum
Is Zigbee easy to learn?
Is Zigbee easy to learn? Is the protocol stack complicated?...
wellpanda RF/Wirelessly
Resistor Accuracy and Common Resistance Values
Resistor accuracy and common resistance values Let's take a look at the commonly used resistance values of resistors. When designing, don't use resistors that are not available for sale! If you need i...
20023974 DIY/Open Source Hardware
The scope of automotive electronics is too large, so I'll post something fun.
If there is a car: the front looks like a Mercedes-Benz, and the back looks like a BMW; it must be Geely. If there is a car: the appearance has not changed, but the name has been changed; it must be S...
wljmm Automotive Electronics

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 598  637  2237  2810  1283  13  46  57  26  3 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号