CYLINDRICAL GENERAL PURPOSE
SURFACE MOUNT POWER RESISTOR
METAL GLAZE™
ISO-9001
Registered
MM
SERIES
·
·
·
·
Up to 2 watts
0.1 ohm to 2.2 megohm range
Up to 1000 volts
150°C maximum operating temperature
Size
Code
B
F
H
1
Metal Glaze
TM
thick film
element fired at 1000°C
to solid ceramic substrate
High temperature
dielectric coating
60/40 Solder over nickel barrier
MM SPECIFICATIONS:
IRC
Type
MMA0204
MMB0207
MMC0310
Maximum
Power Rating
1/4W @ 70°C
1W @ 70°C
2W @ 25°C
1.33W @ 70°C
Working Maximum
Voltage
200
350
500
1
Voltage
400
700
1000
Resistance
Range (ohms)
2
0.1 to 0.99
1.0 to 1.0 M
0.1 to 0.99
1.0 to 2.21M
0.2 to 0.99
1.0 to 2.21M
Tolerance
(±%)
2
1
1
1
1
1
1
TCR
(ppm/°C)
2
100
50
100
50
100
50
Product
Category
Low Range
Standard
Low Range
Standard
Low Range
Standard
Not to exceed PxR
2
Consult factory for tighter TCR, tolerance, or resistance values. E96 standard EIA Decade Values preferred. E196 and E24 Decade Values available.
MM PERFORMANCE CHARACTERISTICS:
Characteristics
Temperature Coefficient
Thermal Shock
Low Temperature Operation
Short Time Overload
High Temperature Exposure
Maximum Change
As specified
±0.5% +0.01 ohm
±0.25% +0.01 ohm
±1% +0.01 ohm
±0.5% +0.01 ohm
Test Method
MIL-R-55342E Par 4.7.9 (-55°C +125°C)
MIL-R-55342E Par 4.7.3 (-65°C +150°C, 5 cycles)
MIL-R-55342E Par 4.7.4 (-65°C @ working voltage)
MIL-R-55342E Par 4.7.5 (2.5 x PxR for 5 seconds)
MIL-R-55342E Par 4.7.6 (+150°C for 100 hours)
Resistance to Bonding Exposure ±0.25% 0.01 ohm
MIL-R-55342E Par 4.7.7
(Reflow soldered to board at 260°C for 10 seconds)
Solderability
95% minimum coverage MIL-STD-202, Method 208 (245°C for 5 seconds)
Moisture Resistance
±0.5% +0.01 ohm
MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours)
Life Test
Terminal Adhesion Strength
Resistance to Board Bending
1% +0.01 ohm
±1% +0.01 ohm
no mechanical damage
±1% + 0.01 ohm
no mechanical damage
MIL-R-55342E Par 4.7.10 (2000 hour at 70°C intermittent)
1200 gram push from underside of mounted chip for 60 seconds
Chip mounted in center of 90mm long board, deflected 5mm so as to
exert pull on chip contacts for 10 seconds
MM POWER DERATING CURVE:
120%
MM REPETITIVE SURGE CURVE:
1000
100%
Percent Relative Power
Peak Power (watts)
CHP 1/8, 1/2, 1
MMA0204, MMB0207
80%
MMC0310
100
MMB0207
60%
CHP 2
MMC0310
40%
MMA0204
10
20%
0%
30
40
50
60
70
80
90
100 110 120 130 140 150
1
0.0001
.1msec
0.0010
1msec
0.0100
10msec
0.1000
100msec
1.0000
10000msec
Ambient Temperature (°C)
Surge or Pulse duration (seconds)
Note: Use for repetitive pulses where the average power dissipation is not
to exceed the component rating at 70°C. Surge handling capacity for low-
repetitive surges may be significantly greater than shown above. Contact
factory for recommendations.
WIREWOUND AND FILM TECHNOLOGIES DIVISION
736 Greenway Road
•
Boone, North Carolina 28607-1860
•
Tel: 828-264-8861
•
Fax: 828-264-8866
•
www.irctt.com
1
ISO-9001
Registered
MM FAMILY STANDARD SIZES, SOLDER PADS AND PACKAGING:
DIMENSIONS
(mm and (inches)):
L
C
W
Size Code
B
F
H
Actual Size
L
3.25±0.18
(0.128±0.007)
6.38±0.25
(0.251±0.010)
9.32±0.25
(0.367±0.010)
W
1.45±0.15
(0.057±0.006)
2.01±0.15
(0.079±0.006)
2.67±0.15
(0.105±0.006)
C*
0.51+0.50/-0.38
(0.020+0.020/-0.015)
1.02±0.50
(0.040±0.020)
1.27±0.50
(0.050±0.020)
*C dimension is average termination width.
RECOMMENDED SOLDER PAD DIMENSIONS (REFLOW):
To ensure excellent solderability performance, IRC recommends the following pad design. This design will provide a large repeatable
solder fillet to the MM resistor on reflow processes and will provide maximum heat transfer to the PC board in high power applications.
By placing the MM on the solder paste while the paste is in the "tacky" state, the MM will be held in position until solder reflow begins.
The pad design then uses the surface tension of the molten solder to pull the component to the center of the solder pad. The
placement of a via rising above the board level directly beneath the MM is not recommended.
Size
Code
B
F
H
Dimensions (mm and (inches))
A
1.93
(0.076)
3.07
(0.121)
4.32
(0.170)
B
2.36
(0.093)
3.20
(0.126)
4.06
(0.160)
C
1.47
(0.058)
3.23
(0.127)
5.41
(0.213)
D
2.49
(0.098)
4.65
(0.183)
6.93
(0.273)
E
0.81
(0.032)
1.02
(0.040)
1.12
(0.044)
F
5.36
(0.211)
9.37
(0.369)
14.05
(0.553)
A
B
E
F
C
A
D
STANDARD REEL PACKAGING PER EIA-481:
Size Code
B
F
H
Reel Diameter*
7"
13"
7"
13"
13"
Quantity Per Reel
2,500 max.
10,000 max.
1,500 max.
5,000 max.
1,500 max.
24mm
4mm
Carrier Tape
Width
8mm
12mm
Component Pitch
4mm
4mm
* The 13" reel is considered standard and will be supplied unless otherwise specified.
HOW TO ORDER:
Sample Part No.
IRC Type
(MMA0204, MMB0207, MMC0310)
MMA0204 - 50 - 2203 - F - 13
Temperature Coefficient
(50 or 100)
Resistance Value
(100 ohms and greater - First 3 significant figures plus 4th digit multiplier)
Example: 100 ohms = 1000, 1000 ohms = 1001, 150,000 ohms = 1503
(Less than 100 ohms - "R" is used to designate decimal)
Example: 51 ohms = 51R0, 1 ohm = 1R00, 0.25 ohm = R250
Tolerance
(F = 1.0%)
Packaging Code*
(BLK = Bulk, 7=7" Reel, 13=13" Reel)
2
WIREWOUND AND FILM TECHNOLOGIES DIVISION
736 Greenway Road
•
Boone, North Carolina 28607-1860
•
Tel: 828-264-8861
•
Fax: 828-264-8866
•
www.irctt.com
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