0201/0402/0603 Chip Inductors
FEATURES
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LASER CUT SPIRAL COIL OVER ALUMINA CORE
SUPER MINIATURE EIA 0201, 0402 & 0603 SIZE IN RESIN ENCLOSED BODY
HIGH Q AND SRF FOR HIGH FREQUENCY APPLICATIONS
TIGHT TOLERANCES (D ± 0.3nH, G ± 2% or J ± 5%)
BOTH FLOW AND REFLOW SOLDERING APPLICABLE
EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE
Inductance Range
1.0 ~ 220nH
D (±0.3nH), G (±2%)
J (±5%)
-40
o
~ +85
o
C
See Individual
Product Listings
NIS Series
SPECIFICATIONS
SURFACE MOUNT
Inductance Tolerances
Operating Temperature Range
Q-Factor, Self Resonant Frequency,
DC Resistance, Rated DC Current
and Inductance Tolerance
ENVIRONMENTAL CHARACTERISTICS
Test
Solderability
Humidity Resistance
Specification
90% Min. Coverage
Test Method & Condition
After 3 Sec. Dip in +230
o
C Solder Pot (Post Flux)
After 500 Hrs at 60
o
C and 90-95% RH (No Load)
After 10 Seconds at +260
o
C (5 Min, 120
o
C
Pre-Heat)
After 2 Hrs per Axis, 10~55Hz, 1.5mm Amplitude
After 100 Cycles (-40
o
to +85
o
C) 30 Min. Each
After 500 Hrs at -40
o
C
After 500 Hrs at 85
o
C with Rated DC Current
After 500 Hrs at 60
o
C with 90-95%RH
with Rated DC Current
(1) No Evidence of Damage
(2) Inductance Shall Be
Soldering Effect
Within + 5% of Initial
Value
Low Frequency Vibration
(3) Q Factor Shall Be Within
Thermal Shock
±20% of Initial Value
(±25% for 0201 size)
Low Temperature Storage
(1) No Evidence of Damage
High Temperature Load
(2) Inductance Shall Be
Life
Within + 10% of Initial
Value
(3) Q Factor Shall Be Within
Humidity Load Life
±20% of Initial Value
PART NUMBERING SYSTEM
NIS04 J 22N TR F
Lead Free (Std NIS02, Optional
on NIS04/06) 100% Sn
Packaging: TR = Tape & Reel
Inductance Code (N=decimal point)
(Ex. 2N2=2.2nH, 33N=33nH)
Tolerance Code (D=±0.3nH, G=±2%, J=±5%)
Series (02=0201, 04=0402, 06=0603)
PART AND LAND PATTERN DIMENSIONS (mm)
Series
L
W
H
t
A
B
C
NIS02 0.6 +0.05 0.3 +0.05 0.3 +0.05 0.15 +0.05 0.26~0.30 0.75~0.80 0.28~0.35
NIS04 1.0 +0.05 0.5 +0.05 0.5 +0.05
NIS06 1.6 +0.15 0.8 +0.15 0.8 +0.15
0.2 +0.1
0.3 +0.2
0.5~0.6
0.8~1.0
1.5~1.7
2.0~2.6
0.5~0.6
0.7~0.9
Recommended land patterns for flow and reflow soldering
DIMENSION (mm)
Solder Plated Terminations
Resin Enclosure
NIS Chip
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Land Pattern
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C
H
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L
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A
B
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NIC COMPONENTS
www.niccomp.com
www.lowESR.com
www.RFpassives.com
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