LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
LED ARRAY
Pb
Lead-Free Parts
LA95B/DBK.X-2-PF
DATA SHEET
DOC. NO :
REV.
DATE
:
QW0905-LA95B/DBK.X-2-PF
A
: 31- Mar. - 2008
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LA95B/DBK.X-2-PF
Page 1/5
Package Dimensions
4.4
3.0±0.3
9.0
DBK
5.08
Ф2.9X2
9.6
5.62
3.2±0.3
2.5
2.54TYP
X
2.54
2.0
7.62±0.5
NPTH
∅
2.0 LED
∅
0.8~1.0
+
-
LDBK2640/H
2.9
3.1
3.3
4.3
1.5MAX
25.0MIN
□
0.5
TYP
1.0MIN
2.54TYP
+
-
Note : 1.All dimension are in millimeter tolerance is
±
0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LA95B/DBK.X-2-PF
Page 2/5
Absolute Maximum Ratings at Ta=25
℃
Ratings
Parameter
Symbol
DBK
Forward Current
Peak Forward Current
Duty 1/10@10KHz
Power Dissipation
Reverse Current @5V
Electrostatic Discharge( * )
Operating Temperature
Storage Temperature
I
F
I
FP
PD
Ir
ESD
T
opr
Tstg
30
100
120
50
150
-20 ~ +80
-30 ~ +100
mA
mA
mW
UNIT
μ
A
V
℃
℃
*
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic
glove is recommended when handing these LED. All devices, equipment and machinery must be properly
grounded.
Typical Electrical & Optical Characteristics (Ta=25
℃
)
COLOR
PART NO
MATERIAL
Dominant
wave
length
λ
Dnm
Spectral
halfwidth
△λ
nm
Forward
voltage
@20mA(V)
Viewing
angle
@20mA(mcd)
2
θ
1/2
(deg)
Luminous
intensity
Emitted
LA95B/DBK.X-2-PF
InGaN/GaN Blue
Lens
Blue Diffused
Typ.
470
30
3.5
Max. Min. Typ.
4.0
220 450
38
Note : 1.The forward voltage data did not including
±
0.1V testing tolerance.
2. The luminous intensity data did not including
±
15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LA95B/DBK.X-2-PF
Page 3/5
Typical Electro-Optical Characteristics Curve
DBK CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
1000
Forward Current(mA)
100
10
1
01
1.0
2.0
3.0
4.0
5.0
Relative Intensity
Normalize @20mA
2.5
2.0
1.5
1.0
0.5
0.0
1
10
100
1000
Forward Voltage(V)
Fig.3 Forward Voltage vs. Temperature
Forward Current(mA)
Fig.4 Relative Intensity vs. Temperature
Forward Voltage@20mA
Normalize @25
℃
Relative Intensity@20mA
Normalize @25
℃
-40
-20
0
20
40
60
80
100
1.2
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
80
100
1.1
1.0
0.9
0.8
Ambient Temperature(
℃
)
Ambient Temperature(
℃
)
Fig.5 Relative Intensity vs. Wavelength
Relative Intensity@20mA
1.0
0.5
0.0
400
450
500
550
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LA95B/DBK.X-2-PF
Page 4/5
Soldering Condition(Pb-Free)
1.Iron:
Soldering Iron:30W Max
Temperature 350°C Max
Soldering Time:3 Seconds Max(One time only)
Distance:2mm Min(From solder joint to case)
2.Wave Soldering Profile
Dip Soldering
Preheat: 120°C Max
Preheat time: 60seconds Max
Ramp-up
2° C/sec(max)
Ramp-Down:-5°C/sec(max)
Solder Bath:260° C Max
Dipping Time:3 seconds Max
Distance:2mm Min(From solder joint to case)
If Holder-set operation PCB
0.5
mm above Holder expor be explain
That Holder press-tep
:
120°Max.
Temp(° C)
260° C3sec Max
260°
5° /sec
max
120°
2° /sec
max
Preheat
60 Seconds Max
25°
0° 0
50
100
150
Time(sec)
Note: 1.Wave solder should not be made more than one time.
2.You can just only select one of the soldering conditions as above.
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