54111-412-16-1800LF datasheet, PDF

54111-412-16-1800LF: DescriptionBoard Connector, 16 Contact(s), 1 Row(s), Male, Straight, 0.1 inch Pitch, Solder Terminal, Locking, Black Insulator, Receptacle; CategoryThe connector The connector; File Size63KB，1 Pages; ManufacturerAmphenol; Websitehttp://www.amphenol.com/; Environmental Compliance

Download Datasheet Parametric View All

54111-412-16-1800LF Overview

Board Connector, 16 Contact(s), 1 Row(s), Male, Straight, 0.1 inch Pitch, Solder Terminal, Locking, Black Insulator, Receptacle

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Reach Compliance Code	compliant
body width	0.094 inch
subject depth	0.709 inch
body length	1.6 inch
Body/casing type	RECEPTACLE
Connector type	BOARD CONNECTOR
Contact to complete cooperation	SN ON NI
Contact completed and terminated	Matte Tin (Sn) - with Nickel (Ni) barrier
Contact point gender	MALE
Contact material	PHOSPHOR BRONZE
contact mode	RECTANGULAR
Contact style	SQ PIN-SKT
Insulation resistance	5000000000 Ω
Insulator color	BLACK
insulator material	THERMOPLASTIC
JESD-609 code	e3
Manufacturer's serial number	54111
Plug contact pitch	0.1 inch
Installation option 1	LOCKING
Installation method	STRAIGHT
Installation type	BOARD
Number of connectors	ONE
PCB row number	1
Number of rows loaded	1
Maximum operating temperature	125 °C
Minimum operating temperature	-65 °C
PCB contact pattern	RECTANGULAR
Plating thickness	30u inch
Rated current (signal)	3 A
Guideline	UL, CSA
reliability	COMMERCIAL
Terminal length	0.095 inch
Terminal pitch	2.54 mm
Termination type	SOLDER
Total number of contacts	16
Base Number Matches	1

PDM: Rev:E

STATUS:

Released

Printed: Jun 03, 2008

The impact of operational amplifier input offset voltage on input signal: I recently made a uV DC weak signal amplifier circuit. The input signal is smaller than the offset voltage of the op amp. The amplification factor is 100, but the result from the op amp is not what I ...; lclhitwh Analog electronics

High-speed (I) FFT hardware design in FDM modulation and demodulation: [i=s] This post was last edited by paulhyde on 2014-9-15 08:56 [/i] High-speed (I) FFT hardware design for FDM modulation and demodulation...; xiangzi001 Electronics Design Contest

How can I directly dive into the assembly code in EVC? Thank you: How can I directly dive into assembly code in EVC? Help!!!...; fionachow Embedded System

Cadence design pads, through-hole pads startlayer and endlayer must be designed with thermal pads and antipads: As the title says, my personal understanding is that the startlayer of through-hole pads is the top layer, and the endlayer is the bottom layer. Thermal pads and antipads are used in the case of negat...; wudayongnb PCB Design

Improving LCD backlight dimming granularity(2): The result is a total of 93 dimming steps, using the same quasi-exponential curve to increase (or decrease) the ILED current from zero to the maximum ILED current set in the chip. Assuming a maximum I...; songbo Analog electronics

Shortcut: L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ

Popular Components