HD64F2282 datasheet, PDF - EEWORLD Datasheet

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HD64F2282: DescriptionMICROCONTROLLER; CategoryThe embedded processor and controller Microcontrollers and processors; File Size3MB，615 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

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HD64F2282 Overview

MICROCONTROLLER

HD64F2282 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Renesas Electronics Corporation
Parts packaging code	QFP
package instruction	QFP,
Contacts	100
Reach Compliance Code	compliant
Has ADC	YES
Address bus width
bit size	16
maximum clock frequency	20 MHz
DAC channel	NO
DMA channel	NO
External data bus width
JESD-30 code	R-PQFP-G100
JESD-609 code	e0
length	20 mm
Number of I/O lines	72
Number of terminals	100
Maximum operating temperature	75 °C
Minimum operating temperature	-20 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	QFP
Package shape	RECTANGULAR
Package form	FLATPACK
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
ROM programmability	FLASH
Maximum seat height	3.1 mm
speed	20 MHz
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL EXTENDED
Terminal surface	TIN LEAD
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	14 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER
Base Number Matches	1

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REJ09B0148-0300

H8S/2282

Group,

H8S/2280

Group

Hardware Manual

Renesas 16-Bit Single-Chip Microcomputer

H8S Family/H8S/2200 Series

H8S/2282F

H8S/2282

H8S/2281

H8S/2280

HD64F2282

HD6432282

HD6432281

HD64F2280B

HD64F2280RB

Rev. 3.00

Revision Date: Sep 26, 2006

Keep safety first in your circuit designs!

1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and

more reliable, but there is always the possibility that trouble may occur with them. Trouble with

semiconductors may lead to personal injury, fire or property damage.

Remember to give due consideration to safety when making your circuit designs, with appropriate

measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or

(iii) prevention against any malfunction or mishap.

Notes regarding these materials

1. These materials are intended as a reference to assist our customers in the selection of the Renesas

Technology Corp. product best suited to the customer's application; they do not convey any license

under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or

a third party.

2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-

party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or

circuit application examples contained in these materials.

3. All information contained in these materials, including product data, diagrams, charts, programs and

algorithms represents information on products at the time of publication of these materials, and are

subject to change by Renesas Technology Corp. without notice due to product improvements or

other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or

an authorized Renesas Technology Corp. product distributor for the latest product information

before purchasing a product listed herein.

The information described here may contain technical inaccuracies or typographical errors.

Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising

from these inaccuracies or errors.

Please also pay attention to information published by Renesas Technology Corp. by various means,

including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com).

4. When using any or all of the information contained in these materials, including product data,

diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total

system before making a final decision on the applicability of the information and products. Renesas

Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the

information contained herein.

5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or

system that is used under circumstances in which human life is potentially at stake. Please contact

Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when

considering the use of a product contained herein for any specific purposes, such as apparatus or

systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.

6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in

whole or in part these materials.

7. If these products or technologies are subject to the Japanese export control restrictions, they must

be exported under a license from the Japanese government and cannot be imported into a country

other than the approved destination.

Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the

country of destination is prohibited.

8. Please contact Renesas Technology Corp. for further details on these materials or the products

contained therein.

Rev. 3.00 Sep 26, 2006 page ii of xxxii

Preface

This LSI is a single-chip microcomputer made up of the high-speed H8S/2000 CPU as its core,

and the peripheral functions required to configure a system.

This LSI is equipped with ROM, RAM, a 16-bit timer pulse unit, a watchdog timer, serial

communication interfaces, a controller area network, an A/D converter, a motor control PWM

timer, an LCD controller/driver (LCD), a clock pulse generator, and I/O ports as on-chip

peripheral modules. This LSI is suitable for use as an embedded processor for high-level control

systems. Its on-chip ROM is flash memory (F-ZTAT*) that provides flexibility as it can be

reprogrammed in no time to cope with all situations from the early stages of mass production to

full-scale mass production. This is particularly applicable to application devices with

specifications that will most probably change.

Note: * F-ZTAT is a trademark of Renesas Technology Corp.

Target Users: This manual was written for users who will be using the H8S/2282 Group and

H8S/2280 Group in the design of application systems. Target users are expected to

understand the fundamentals of electrical circuits, logical circuits, and

microcomputers.

Objective:

This manual was written to explain the hardware functions and electrical

characteristics of the H8S/2282 Group to the target users.

See the H8S/2600 Series, H8S/2000 Series Software Manual for a detailed

description of the instruction set.

Notes on reading this manual:

•

In order to understand the overall functions of the chip

Read the manual according to the contents. This manual can be roughly categorized into parts

on the CPU, system control functions, peripheral functions and electrical characteristics.

•

In order to understand the details of the CPU’s functions

Read the H8S/2600 Series, H8S/2000 Series Software Manual.

•

In order to understand the details of a register when its name is known

Read the index that is the final part of the manual to find the page number of the entry on the

List of Registers.

Rev. 3.00 Sep 26, 2006 page v of xxxii

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