REJ09B0144-0600
8
H8/3827R
Group
,
H8/3827S
Group
,
H8/38327
Group,
H8/38427
Group
Hardware Manual
Renesas 8-Bit Single-Chip Microcomputer
H8 Family/H8/300L Super Low Power Series
H8/3827R Group
H8/3822R
H8/3823R
H8/3824R
H8/3825R
H8/3826R
H8/3827R
H8/3824S
H8/3825S
H8/3826S
H8/3827S
H8/38327 Group
H8/38322
H8/38323
H8/38324
H8/38325
H8/38326
H8/38327
H8/38422
H8/38423
H8/38424
H8/38425
H8/38426
H8/38427
H8/3827S Group
H8/38427 Group
Rev. 6.00
Revision Date: Aug 04, 2006
Keep safety first in your circuit designs!
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and
more reliable, but there is always the possibility that trouble may occur with them. Trouble with
semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate
measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or
(iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas
Technology Corp. product best suited to the customer's application; they do not convey any license
under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or
a third party.
2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-
party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or
circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and
algorithms represents information on products at the time of publication of these materials, and are
subject to change by Renesas Technology Corp. without notice due to product improvements or
other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or
an authorized Renesas Technology Corp. product distributor for the latest product information
before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising
from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corp. by various means,
including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data,
diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total
system before making a final decision on the applicability of the information and products. Renesas
Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the
information contained herein.
5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or
system that is used under circumstances in which human life is potentially at stake. Please contact
Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when
considering the use of a product contained herein for any specific purposes, such as apparatus or
systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.
6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in
whole or in part these materials.
7. If these products or technologies are subject to the Japanese export control restrictions, they must
be exported under a license from the Japanese government and cannot be imported into a country
other than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the
country of destination is prohibited.
8. Please contact Renesas Technology Corp. for further details on these materials or the products
contained therein.
Rev. 6.00 Aug 04, 2006 page ii of xxxiv
Preface
The H8/3827R Group, H8/3827S Group, H8/38327 Group, and H8/38427 Group are high-
performance single-chip microcomputers that integrate peripheral functions necessary for system
configuration with an H8/300L CPU core.
The on-chip peripheral functions include ROM, RAM, six timers, 14-bit PWM, a serial
communication interface (SCI), an A/D converter, LCD controller/driver, and I/O ports, providing
an ideal configuration as a microcomputer for embedding in sophisticated control systems. PROM
(ZTAT™*
1
), flash memory (F-ZTAT™*
2
), and mask ROM are available as on-chip ROM,
enabling users to respond quickly and flexibly to changing application specifications and the
demands of the transition from initial to full-fledged volume production.
Notes: 1. ZTAT is a trademark of Renesas Technology Corp.
2. F-ZTAT is a trademark of Renesas Technology Corp.
Intended Readership: This manual is intended for users undertaking the design of an application
system using the H8/3827R Group, H8/3827S Group, H8/38327 Group, and
H8/38427 Group. Readers using this manual require a basic knowledge of
electrical circuits, logic circuits, and microcomputers.
Purpose:
The purpose of this manual is to give users an understanding of the hardware
functions and electrical characteristics of the H8/3827R Group, H8/3827S
Group, H8/38327 Group, and H8/38427 Group. Details of execution
instructions can be found in the H8/300L Series Programming Manual,
which should be read in conjunction with the present manual.
Using this Manual:
•
For an overall understanding of the H8/3827R Group, H8/3827S Group, H8/38327 Group, and
H8/38427 Group's functions
Follow the Table of Contents. This manual is broadly divided into sections on the CPU, system
control functions, peripheral functions, and electrical characteristics.
•
For a detailed understanding of CPU functions
Refer to the separate publication H8/300L Series Programming Manual.
Note on bit notation: Bits are shown in high-to-low order from left to right.
Rev. 6.00 Aug 04, 2006 page iii of xxxiv
Notes: The following limitations apply when using the on-chip emulator for program
development and debugging.
1. Pin P3
2
is reserved for use exclusively by the on-chip emulator and cannot be used for
other operations.
2. Pins P8
5
, P8
6
, and P8
7
cannot be used. In order to use these pins it is necessary to
install additional hardware on the user board.
3. The address area from H'E000 to H'EFFF is used by the on-chip emulator and therefore
cannot be accessed by the user.
4. The address area from H'F300 to H'F6FF must not be accessed under any
circumstances.
5. When the on-chip emulator is used, pin P3
2
functions as an I/O pin, pins P8
5
and P8
6
function as input pins, and pin P8
7
functions as an output pin.
6. It is necessary to change the user board for LCD display debugging. This item does not
apply if LCD display is not used or if the emulator is not operated in writer mode.
User Board Changes
The following changes are necessary.
• Connect pin V1 to the V
CC
power supply. Also connect capacitors and resistors to
pins V1, V2, and V3. Connect a capacitor and a resistor to pins V1, V2, and V3.
• No SEG signals are output from pins P8
5
/SEG30, P8
6
/SEG31, and P8
7
/SEG32, so
the display is unstable. In addition, a DC voltage is applied. If damage to the LCD is
a concern, disconnect the above three pins from the LCD.
A connection example is shown below. Refer to the emulator user’s manual for
information on other settings.
LCD
Vcc
Dis-
connect
V0
V1
V2
V3
H8/38327
H8/38427
Connect
P8
5
/SEG30
P8
6
/SEG31
P8
7
/SEG32
Emulator
connectors
Disconnect
Vcc
Vcc
Connect
R = 240
Ω
*
C = 0.1
µF
*
R V2
R V3
R
C C C
V0
H8/38327
H8/38427
Disonnect
P8
5
/SEG30
P8
6
/SEG31
P8
7
/SEG32
Emulator
connectors
LCD
Connect
Vcc
Normal Operation
Note:
*
Debugging
R and C values are intended only as guidelines.
They may be adjusted based on the indications.
Rev. 6.00 Aug 04, 2006 page iv of xxxiv
7. During a break, the watchdog timer continues to operate. Therefore, an internal reset is
generated if an overflow occurs during the break.
Related Material:
The latest information is available at our Web Site. Please make sure that you
have the most up-to-date information available. (http://www.renesas.com/)
User's Manuals on this LSI:
Manual Title
H8/3827R Group, H8/3827S Group, H8/38327 Group, H8/38427 Group
Hardware Manual
H8/300L Series Programming Manual
Document No.
This manual
REJ09B0214-0200
User's manuals for development tools:
Manual Title
C/C++ Compiler, Assembler, Optimizing Linkage Editor User’s Manual
H8S, H8/300 Series Simulator/Debugger User’s Manual
High-Performance Embedded Workshop User’s Manual
H8S, H8/300 Series High-Performance Embedded Workshop,
High-Performance Debugging Interface User’s Manual
Document No.
REJ10B0161-0100
REJ10B0211-0200
ADE-702-201
ADE-702-231
Application Note:
Manual Title
H8/300L Series Application Note
Document No.
ADE-502-065
Rev. 6.00 Aug 04, 2006 page v of xxxiv
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