27HC641-55FA datasheet, PDF - EEWORLD Datasheet

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27HC641-55FA: DescriptionEPROM, 8KX8, 55ns, CMOS, CDIP24,; Categorystorage storage; File Size274KB，8 Pages; ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.); Websitehttps://www.nxp.com/

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27HC641-55FA Overview

EPROM, 8KX8, 55ns, CMOS, CDIP24,

27HC641-55FA Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	DIP, DIP24,.6
Reach Compliance Code	unknown
Maximum access time	55 ns
I/O type	COMMON
JESD-30 code	R-XDIP-T24
JESD-609 code	e0
memory density	65536 bit
memory width	8
Number of terminals	24
word count	8192 words
character code	8000
Maximum operating temperature	70 °C
Minimum operating temperature
organize	8KX8
Output characteristics	3-STATE
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP24,.6
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Certification status	Not Qualified
Maximum standby current	0.11 A
Maximum slew rate	0.11 mA
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Base Number Matches	1

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27HC641-55FA Related Products

	27HC641-55FA	27HC641-45A	27HC641-45FA	27HC641-45N	27HC641-55A	27HC641-55N
Description	EPROM, 8KX8, 55ns, CMOS, CDIP24,	OTP ROM, 8KX8, 45ns, CMOS, PQCC28	EPROM, 8KX8, 45ns, CMOS, CDIP24,	OTP ROM, 8KX8, 45ns, CMOS, PDIP24	OTP ROM, 8KX8, 55ns, CMOS, PQCC28	OTP ROM, 8KX8, 55ns, CMOS, PDIP24
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	DIP, DIP24,.6	QCCJ, LDCC28,.5SQ	DIP, DIP24,.6	DIP, DIP24,.6	QCCJ, LDCC28,.5SQ	DIP, DIP24,.6
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
Maximum access time	55 ns	45 ns	45 ns	45 ns	55 ns	55 ns
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-XDIP-T24	S-PQCC-J28	R-XDIP-T24	R-PDIP-T24	S-PQCC-J28	R-PDIP-T24
JESD-609 code	e0	e0	e0	e0	e0	e0
memory density	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit
memory width	8	8	8	8	8	8
Number of terminals	24	28	24	24	28	24
word count	8192 words	8192 words	8192 words	8192 words	8192 words	8192 words
character code	8000	8000	8000	8000	8000	8000
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	8KX8	8KX8	8KX8	8KX8	8KX8	8KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC	PLASTIC/EPOXY	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	QCCJ	DIP	DIP	QCCJ	DIP
Encapsulate equivalent code	DIP24,.6	LDCC28,.5SQ	DIP24,.6	DIP24,.6	LDCC28,.5SQ	DIP24,.6
Package shape	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR
Package form	IN-LINE	CHIP CARRIER	IN-LINE	IN-LINE	CHIP CARRIER	IN-LINE
power supply	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum standby current	0.11 A	0.11 A	0.11 A	0.11 A	0.11 A	0.11 A
Maximum slew rate	0.11 mA	0.11 mA	0.11 mA	0.11 mA	0.11 mA	0.11 mA
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	YES	NO	NO	YES	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	J BEND	THROUGH-HOLE	THROUGH-HOLE	J BEND	THROUGH-HOLE
Terminal pitch	2.54 mm	1.27 mm	2.54 mm	2.54 mm	1.27 mm	2.54 mm
Terminal location	DUAL	QUAD	DUAL	DUAL	QUAD	DUAL
Base Number Matches	1	1	1	1	1	1

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