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2-176971-8 Product Details
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1.27 [.050] Series II and Series III Connectors
5 of 6 EU R oHS/ELV C om plia nt
(
Sta te m e nt of C om plia nce
)
No Im a ge Ava ila ble
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2-176971-8
T E I nternal N umber: 2 - 1 7 6 9 7 1 - 8
Product Highlights:
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Mating Type = Receptacle
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Number of Positions = 68
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Terminate To Printed C ircuit Board
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Right Angle Mount Angle
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No PC B Retention Feature
View all Features
Obsolete
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Documentation & Additional Information
Product Drawings:
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None Available
Catalog Pages/Data Sheets:
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None Available
Product Specifications:
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C HAMP.050 Series(II) C onnector Wire to Board Type
(PDF, English)
Application Specifications:
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None Available
Instruction Sheets:
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None Available
CAD Files:
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None Available
List all Documents
Product Features
(Please use the Product Drawing for all design activity)
Product Type Features:
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Mating Type
= Receptacle
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Number of Positions
= 68
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Mount Angle
= Right Angle
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PC B Retention Feature
= No
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Mating C onnector Lock
= Without
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Product Series
= Series II
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PC B Thickness (mm [in]) = 2.36 – 3.18 [0.093 – 0.125]
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Panel Thickness (mm [in]) = 2.01 [0.079]
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C olor = Black
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Frame Material = Die C ast Zinc
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Shield Material = Steel
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C omment = Alternate tail lengths 3.10 [.122] and 2.20 [.087]
available
Mechanical Attachment:
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Panel Attachment
= With
Termination Related Features:
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Termination Post Length (mm [in]) = 3.90 [0.153]
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Solder Tail C ontact Plating = Tin-Lead
Body Related Features:
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C enterline (mm [in]) = 1.27 [0.050]
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Frame Plating = Nickel
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Shield Plating = Nickel over C opper
Contact Related Features:
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C ontact Mating Area Plating Material
= Gold (30)
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C ontact Base Material = Phosphor Bronze
Housing Related Features:
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Housing Material Temperature
= Standard
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Housing Material = Nylon
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Housing Flammability Rating = UL 94V-0
Industry Standards:
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RoHS/ELV C ompliance
= ELV compliant, 5 of 6 C ompliant
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Lead Free Solder Processes
= Wave solder capable to 240?C
Conditions for Usage:
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Terminate To
= Printed C ircuit Board
Other:
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Brand = AMP
Additional Information:
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Product Line Information
Related Products:
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Tooling
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