H8S/2143 datasheet, PDF - EEWORLD Datasheet

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H8S/2143: Description16-BIT, FLASH, 10 MHz, MICROCONTROLLER, PQFP100; Categorysemiconductor The embedded processor and controller; File Size6MB，1177 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

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H8S/2143 Overview

16-BIT, FLASH, 10 MHz, MICROCONTROLLER, PQFP100

H8S/2143 Parametric

Parameter Name	Attribute value
External data bus width	16
Number of input and output buses	82
Number of terminals	100
Minimum operating temperature	-20 Cel
Maximum operating temperature	75 Cel
Line speed	10 MHz
Processing package description	14 X 14 MM, 0.50 MM PITCH, PLASTIC, QFP-100
each_compli	Yes
state	Active
microprocessor_microcontroller_peripheral_ic_type	MICROCONTROLLER
ADC channel	YES
Address bus width	24
Number of digits	16
clock_frequency_max	20 MHz
cpu_family	H8S/2000
DAC channel	YES
DMA channel	NO
jesd_30_code	S-PQFP-G100
jesd_609_code	e0
moisture_sensitivity_level	NOT SPECIFIED
Packaging Materials	PLASTIC/EPOXY
ckage_code	FQFP
ckage_equivalence_code	QFP100,.63SQ,20
packaging shape	SQUARE
Package Size	FLATPACK, FINE PITCH
eak_reflow_temperature__cel_	NOT SPECIFIED
wer_supplies	5
PWM channel	YES
qualification_status	COMMERCIAL
ROM programming	FLASH
seated_height_max	3.05 mm
sub_category	Microcontrollers
Maximum supply voltage	120 mA
Rated supply voltage	5 V
Minimum supply voltage	4.5 V
Maximum supply voltage	5.5 V
surface mount	YES
Craftsmanship	CMOS
Temperature level	COMMERCIAL EXTENDED
terminal coating	TIN LEAD
Terminal form	GULL WING
Terminal spacing	0.5000 mm
Terminal location	QUAD
ime_peak_reflow_temperature_max__s_	NOT SPECIFIED
length	14 mm
width	14 mm

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REJ09B0327-0400

H8S/2148

Group

, H8S/2144

Group

H8S/2148F-ZTAT™, H8S/2147N F-ZTAT™,

H8S/2144F-ZTAT™, H8S/2142F-ZTAT™

Hardware Manual

Renesas 16-Bit Single-Chip Microcomputer

H8S Family/H8S/2100 Series

H8S/2148

HD6432148S

HD6432148SW

HD64F2148

HD64F2148V

HD64F2148A

HD64F2148AV

HD6432147S

HD6432147SW

HD64F2147A

HD64F2147AV

H8S/2147N HD64F2147N

HD64F2147NV

H8S/2144

HD6432144S

HD64F2144

HD64F2144V

HD64F2144A

HD64F2144AV

H8S/2143

HD6432143S

H8S/2142

HD6432142

HD64F2142R

HD64F2142RV

H8S/2147

Rev. 4.00

Revision Date: Sep 27, 2006

Keep safety first in your circuit designs!

1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and

more reliable, but there is always the possibility that trouble may occur with them. Trouble with

semiconductors may lead to personal injury, fire or property damage.

Remember to give due consideration to safety when making your circuit designs, with appropriate

measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or

(iii) prevention against any malfunction or mishap.

Notes regarding these materials

1. These materials are intended as a reference to assist our customers in the selection of the Renesas

Technology Corp. product best suited to the customer's application; they do not convey any license

under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or

a third party.

2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-

party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or

circuit application examples contained in these materials.

3. All information contained in these materials, including product data, diagrams, charts, programs and

algorithms represents information on products at the time of publication of these materials, and are

subject to change by Renesas Technology Corp. without notice due to product improvements or

other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or

an authorized Renesas Technology Corp. product distributor for the latest product information

before purchasing a product listed herein.

The information described here may contain technical inaccuracies or typographical errors.

Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising

from these inaccuracies or errors.

Please also pay attention to information published by Renesas Technology Corp. by various means,

including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com).

4. When using any or all of the information contained in these materials, including product data,

diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total

system before making a final decision on the applicability of the information and products. Renesas

Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the

information contained herein.

5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or

system that is used under circumstances in which human life is potentially at stake. Please contact

Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when

considering the use of a product contained herein for any specific purposes, such as apparatus or

systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.

6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in

whole or in part these materials.

7. If these products or technologies are subject to the Japanese export control restrictions, they must

be exported under a license from the Japanese government and cannot be imported into a country

other than the approved destination.

Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the

country of destination is prohibited.

8. Please contact Renesas Technology Corp. for further details on these materials or the products

contained therein.

Rev. 4.00 Sep 27, 2006 page ii of xliv

Preface

The H8S/2148 Group, H8S/2144 Group, and H8S/2147N comprise high-performance

microcomputers with a 32-bit H8S/2000 CPU core, and a set of on-chip supporting functions

required for system configuration.

The H8S/2000 CPU can execute basic instructions in one state, and is provided with sixteen

internal 16-bit general registers with a 32-bit configuration, and a concise and optimized

instruction set. The CPU can handle a 16-Mbyte linear address space (architecturally 4 Gbytes).

Programs based on the high-level language C can also be run efficiently.

Single-power-supply flash memory (F-ZTAT™*) and mask ROM versions are available,

providing a quick and flexible response to conditions from ramp-up through full-scale volume

production, even for applications with frequently changing specifications.

On-chip peripheral functions include a 16-bit free-running timer (FRT), 8-bit timer (TMR),

watchdog timer (WDT), two PWM timers (PWM and PWMX), a serial communication interface

(SCI, IrDA), PS/2-compatible keyboard buffer controller, host interface (HIF), D/A converter

(DAC), A/D converter (ADC), and I/O ports. An I C bus interface (IIC) can also be incorporated

as an option.

An on-chip data transfer controller (DTC) is also provided, enabling high-speed data transfer

without CPU intervention.

The H8S/2148 Group has all the above on-chip supporting functions, and can also be provided

with an IIC module as an option. The H8S/2144 Group comprises reduced-function versions, with

fewer TMR channels, and no PWM, keyboard buffer controller, HIF, IIC, or DTC modules, and

the H8S/2147N with fewer TMR channels, no DTC and some other functions.

Use of the H8S/2148 Group, H8S/2144 Group, H8S/2147N enables compact, high-performance

systems to be implemented easily. The comprehensive PC-related interface functions and 16

matrix key-scan functions are ideal for applications such as notebook PC keyboard control and

intelligent battery and power supply control, while the various timer functions and their

interconnectability (timer connection), plus the interlinked operation of the I C bus interface and

data transfer controller (DTC), in particular, make these devices ideal for use in PC monitors. In

addition, the combination of F-ZTAT™* and reduced-function versions is ideal for applications

such as CD-ROM drive units in which on-chip program memory is essential to meet performance

requirements, product start-up times are short, and program modifications may be necessary after

end-product assembly.

Rev. 4.00 Sep 27, 2006 page v of xliv

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