H8S/2138F-ZTAT datasheet, PDF - EEWORLD Datasheet

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H8S/2138F-ZTAT: Description16-BIT, FLASH, 20 MHz, MICROCONTROLLER, PQFP80; Categorysemiconductor The embedded processor and controller; File Size6MB，1061 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

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H8S/2138F-ZTAT Overview

16-BIT, FLASH, 20 MHz, MICROCONTROLLER, PQFP80

H8S/2138F-ZTAT Parametric

Parameter Name	Attribute value
Number of functions	1
Number of terminals	80
Maximum operating temperature	75 Cel
Minimum operating temperature	-20 Cel
Maximum supply/operating voltage	5.5 V
Minimum supply/operating voltage	4.5 V
Rated supply voltage	5 V
External data bus width	8
Number of input and output buses	66
Line speed	20 MHz
Processing package description	Plastic, Quad Flat Package-80
state	TRANSFERRED
packaging shape	SQUARE
Package Size	FLATPACK
surface mount	Yes
Terminal form	GULL WING
Terminal spacing	0.6500 mm
terminal coating	tin lead
Terminal location	Four
Packaging Materials	Plastic/Epoxy
Temperature level	COMMERCIAL EXTENDED
ADC channel	Yes
Address bus width	16
Number of digits	16
Maximum FCLK clock frequency	20 MHz
DAC channel	Yes
Microprocessor type	Microcontroller
PWM channel	Yes
ROM programming	FLASH

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REJ09B0301-0400

H8S/2138

Group

H8S/2134

Group

H8S/2138F-ZTAT™, H8S/2134F-ZTAT™,

H8S/2132F-ZTAT™

Hardware Manual

Renesas 16-Bit Single-Chip Microcomputer

H8S Family/H8S/2100 Series

H8S/2138

HD6432138S

HD6432138SW

HD64F2138

HD64F2138V

HD64F2138A

HD64F2138AV

HD6432137S

HD6432137SW

H8S/2134

HD6432134S

HD64F2134

HD64F2134V

HD64F2134A

HD64F2134AV

HD6432133S

HD6432132

HD64F2132R

HD64F2132RV

HD6432130

H8S/2137

H8S/2133

H8S/2132

H8S/2130

Rev. 4.00

Revision Date: Jun 06, 2006

Keep safety first in your circuit designs!

1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and

more reliable, but there is always the possibility that trouble may occur with them. Trouble with

semiconductors may lead to personal injury, fire or property damage.

Remember to give due consideration to safety when making your circuit designs, with appropriate

measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or

(iii) prevention against any malfunction or mishap.

Notes regarding these materials

1. These materials are intended as a reference to assist our customers in the selection of the Renesas

Technology Corp. product best suited to the customer's application; they do not convey any license

under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or

a third party.

2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-

party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or

circuit application examples contained in these materials.

3. All information contained in these materials, including product data, diagrams, charts, programs and

algorithms represents information on products at the time of publication of these materials, and are

subject to change by Renesas Technology Corp. without notice due to product improvements or

other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or

an authorized Renesas Technology Corp. product distributor for the latest product information

before purchasing a product listed herein.

The information described here may contain technical inaccuracies or typographical errors.

Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising

from these inaccuracies or errors.

Please also pay attention to information published by Renesas Technology Corp. by various means,

including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com).

4. When using any or all of the information contained in these materials, including product data,

diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total

system before making a final decision on the applicability of the information and products. Renesas

Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the

information contained herein.

5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or

system that is used under circumstances in which human life is potentially at stake. Please contact

Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when

considering the use of a product contained herein for any specific purposes, such as apparatus or

systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.

6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in

whole or in part these materials.

7. If these products or technologies are subject to the Japanese export control restrictions, they must

be exported under a license from the Japanese government and cannot be imported into a country

other than the approved destination.

Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the

country of destination is prohibited.

8. Please contact Renesas Technology Corp. for further details on these materials or the products

contained therein.

Rev. 4.00 Jun 06, 2006 page ii of liv

Preface

The H8S/2138 Group and H8S/2134 Group comprise high-performance microcomputers with a

32-bit H8S/2000 CPU core, and a set of on-chip supporting functions required for system

configuration.

The H8S/2000 CPU can execute basic instructions in one state, and is provided with sixteen

internal 16-bit general registers with a 32-bit configuration, and a concise and optimized

instruction set. The CPU can handle a 16-Mbyte linear address space (architecturally 4 Gbytes).

Programs based on the high-level language C can also be run efficiently.

Single-power-supply flash memory (F-ZTAT™*) and mask ROM versions are available,

providing a quick and flexible response to conditions from ramp-up through full-scale volume

production, even for applications with frequently changing specifications.

On-chip peripheral functions include a 16-bit free-running timer (FRT), 8-bit timer (TMR),

watchdog timer (WDT), two PWM timers (PWM and PWMX), a serial communication interface

(SCI, IrDA), host interface (HIF), D/A converter (DAC), A/D converter (ADC), and I/O ports. An

I C bus interface (IIC) can also be incorporated as an option.

An on-chip data transfer controller (DTC) is also provided, enabling high-speed data transfer

without CPU intervention.

The H8S/2138 Group has all the above on-chip supporting functions, and can also be provided

with an IIC module as an option. The H8S/2134 Group comprises reduced-function versions, with

fewer TMR channels, and no PWM, HIF, IIC, or DTC modules.

Use of the H8S/2138 or H8S/2134 Group enables compact, high-performance systems to be

implemented easily. The comprehensive PC-related interface functions and 16

8 matrix key-scan

functions are ideal for applications such as notebook PC keyboard control and intelligent battery

and power supply control, while the various timer functions and their interconnectability (timer

connection), plus the interlinked operation of the I C bus interface and data transfer controller

(DTC), in particular, make these devices ideal for use in PC monitors. In addition, the combination

of F-ZTAT™* and reduced-function versions is ideal for applications such as system units in

which on-chip program memory is essential to meet performance requirements, product start-up

times are short, and program modifications may be necessary after end-product assembly.

This manual describes the hardware of the H8S/2138 Group and H8S/2134 Group. Refer to the

H8S/2600 Series and H8S/2000 Series Software Manual

for a detailed description of the

instruction set.

Note: * F-ZTAT (Flexible-ZTAT) is a trademark of Renesas Technology Corp.

Rev. 4.00 Jun 06, 2006 page v of liv

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