boarD to boarD connEctors
MEG-ARRAY
®
MEZZANINE CONNECTOR SYSTEM
HiGH DEnsity, bGa DEsiGn EXcEls at HiGH spEED pErForMancE anD rEliability
DEscription
The MEG-Array
®
Mezzanine Connector
system provides the high density and high
speed benefits of a large array supported by
the reliability and low costs of standard surface
mount PCB assembly.
1.27mm x 1.27mm array of discrete circuit
contacts allows flexible ground distribution to
optimize high speed signal integrity at speeds
exceeding 10 Gb/s. MEG-Array is offered in a
variety of PCB mezzanine stack heights.
FCI’s advanced manufacturing supports a
patented BGA interconnect design. Multiple
in-process vision systems monitor BGA contact
integrity including solder sphere size, location
and co-planarity plus other critical-to-function
attributes.
FEaturEs & bEnEFits
High density, high speed, discrete contact, array connector
Flexible ground distribution optimizes high speed signal integrity
10 Gb/s differential pair performance with under 1% cross-talk
28 Gb/s high speed performance documented for 4mm and 6mm
stack height
Online s-parameter files and signal integrity performance reports
improve design accuracy and time-to-market
1.27mm x 1.27mm grid provides 71 contacts per cm2 density to
save space
Wide range of sizes and PCB stack heights increase mechanical
design flexibility
6 PCB Stack heights: 4mm to 14mm
8 sizes: 81 to 528 positions
Revolutionary, trusted BGA interconnect platform
High density standard BGA attachment lowers assembly costs by
using standard SMT processes
BGA natural surface tension provides self-alignment and self-leveling
for multiple connector usage
Patented BGA contact attachment preserves solder ball positioning
Optimized PCB routing enhances electrical performance
Quality and Reliability
Time-tested reliability record includes Telcordia GR-1217-CORE and
NPS-25298-2 options
22+ year solder joint reliability per IPC-SM-785
17 Billion + lines shipped to customer satisfaction
Precious metal plating options satisfy varying customer needs for
environmental resistance
tarGEt MarkEts /
applications
COMMUNICATIONS
Transmission
Access
Switching
Optics
Networking
DATA
Servers
Storage
I&I
Industrial controls & equipment
Analytical & diagnostic
Medical
MEG-ARRAY
®
CONNECTOR SYSTEM
MatErials
Housing: Liquid Crystal Polymer
Contact: Copper Alloy
Plating: Au over Ni OR GXT™ over Ni
SnPb – Solderballs: 63Sn/37Pb Ø 0.76mm
Pb-Free – Solderballs: 95.5 Sn/4 Ag/0.5 Cu
spEciFications
Product specifications: GS-12-100
Application specification: GS-20-033
Meets requirements of Telcordia GR-1217-CORE issue I
Meets requirements of NPS-25298-2 (25 year life
expectancy) (supporting test reports can be obtained at:
www.fciconnect.com/highspeed)
MEcHanical pErForMancE
Durability: 50, 100, or 200 cycles
Telcordia GR-1217-CORE, NPS-25298-2
Documents
Contact Wipe: 0.80mm Nominal
IPC-SM-785 Solder Joint Reliability: 22.1 year
product end-of-life
packaGinG
Tape and Reel
MorE Data
S- Parameter, IGES and ProE files, signal integrity reports
and additional information available at: www.fci.com/
megarray
Standard MEG-Array
®
plugs and receptacles shipped
with a cap for product protection and for use by automat-
ed pick-and-place equipment
ElEctrical pErForMancE
Current Rating:
• 0.45 A / Contact ≤30°C
∆T
(100% Energized)
• 2.0 A < 30°C ∆T (Single Contact Energized)
Low Level Contact Resistance: See product specification
GS-12-100 for performance results of specific stack
heights
Dielectric Withstanding Voltage: 200 VAC max.
Insulation resistance: 1000 mΩ min.
Differential impedance (Z
0
), Propagation Delay, Near-End
Cross-Talk, S21 (insertion loss) and S11 (return loss):
For performance of various stack heights, please refer to
www.fci.com/megarray.
MEG-array
®
connEctor sizEs
Housing Housing
Housing
Housing
Width Width
Width Width
BGABGA Pad Pad
Pad BGA
BGA Pad
Spacing Spacing
SpacingSpacing
BGABGA Pads Pads
Pads BGA
BGA Pads
Housing Length
Housing LengthLength
Housing Length
Housing
Feature
81 position 100 position
Description
(9x9)
(10x10)
Housing Length
17.43
18.7
Housing Width
16.07
17.34
BGA/Pad Length
10.16
11.43
BGA/Pad Width
10.16
11.43
All Dimensions in mm.
200 position 240 position 300 position 320 position 400 position 528 position
(10x20)
(8x30)
(10x30)
(10x32)
(10x40)
(12x44)
31.4
42.3
44.1
46.64
56.8
61.88
17.34
14.8
17.34
17.34
17.34
19.88
24.13
36.83
36.83
39.37
49.53
54.61
11.43
8.89
11.43
11.43
11.43
13.97
京公网安备 11010802033920号
EEWORLD
