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374424B00035G

Description
Heat Sink, Fin, Pin Fin Array, Omnidirect, Aluminum, Anodized, ROHS COMPLIANT
CategoryThermal management products    Heat resisting bracing   
File Size190KB,2 Pages
ManufacturerBoyd Corporation
Environmental Compliance
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374424B00035G Online Shopping

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374424B00035G Overview

Heat Sink, Fin, Pin Fin Array, Omnidirect, Aluminum, Anodized, ROHS COMPLIANT

374424B00035G Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
package instructionROHS COMPLIANT
Reach Compliance Codecompliant
Main materialALUMINUM
colorBLACK
structureFIN
fin directionOMNIDIRECT
Surface layerANODIZED
high18 mm
length27 mm
contourPIN FIN ARRAY
Heat Resistant Support Device TypeHEAT SINK
width27 mm
Base Number Matches1
5/16/12
374424B00035G - heatsinks for BGA Devices
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BGA Heat Sinks
374424B00035G
Pin Fin heat sink with tape attachment
RoHS:
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Features
Tape mounting saves board space by eliminating mounting holes
Convenient peel and stick assembly is quick and clean
Pin Fin array allows omni-directional airflow to maximize heat dissipation
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Width: 27.00
Length: 27.00
Height: 18.00
Base Thickness: 1.50
Fin Thickness: Length 1.63, Width 1.40
# of Fins: Length 8, Width 8
Fin Tip to Tip: 0.00
Finish: Black Anodize
Thermal Performance
Natural Convection: 20.30
(based on a heatsink temperature rise of 75°C above ambient)
Forced convection: 6.46
based on fully ducted airflow entering at 1.0 m/s (197 LFM).
https://www.aavid.com/products/bga/374424b00035g
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