375124B60024G datasheet, PDF - EEWORLD Datasheet

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375124B60024G: DescriptionHeat Sink, Fin, Pin Fin Array, Omnidirect, Aluminum, Anodized, ROHS COMPLIANT; CategoryThermal management products Heat resisting bracing; File Size198KB，4 Pages; ManufacturerBoyd Corporation; Environmental Compliance

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375124B60024G Overview

Heat Sink, Fin, Pin Fin Array, Omnidirect, Aluminum, Anodized, ROHS COMPLIANT

375124B60024G Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
package instruction	ROHS COMPLIANT
Reach Compliance Code	compliant
Main material	ALUMINUM
color	BLACK
structure	FIN
fin direction	OMNIDIRECT
Surface layer	ANODIZED
high	25 mm
length	40 mm
contour	PIN FIN ARRAY
Heat Resistant Support Device Type	HEAT SINK
width	40 mm
Base Number Matches	1

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How To Select a Heat Sink

Example A

Find a space saving heat sink to keep a TO-220 device below the

maximum 150°C junction temperature in natural convection. Device

will be screw mounted with an electrically conductive interface.

Example B

Find a heat sink to keep a TO-220 device below the maximum

150 °C junction temperature in forced convection at 400 ft/min.

Device must be electrically insulated and mounted with a labor

saving clip.

Given:

PD = 12 watts

θJC

= 2.5°C/W (from semiconductor manufacturer)

TJ max = 140°C (from semiconductor manufacturer)

TA max = 50°C

A Hi-Flow® pad works great with clip mounting and provides the

necessary electrical insulation. Thermal resistance for

Hi-Flow® at low pressure is 1.15°C/W (from page 87).

Using equation 1, solve for R

θSA

= 140 – 50 - (2.5 + 1.15) = 3.85°C/W

Many styles are available. If board space is a concern,

533202B02551G (pg 55) meets the requirements.

Air Velocity—Feet Per Minute

400

600

800

HOW TO SELECT A HEAT SINK

Given:

PD = 6 watts

θJC

= 3°C/W (from semiconductor manufacturer)

TJ max = 150°C (from semiconductor manufacturer)

TA max = 65°C

A Kondux

pad is a good choice for electrically conductive

applications. Thermal resistance for Kondux

can be determined

from the following graph.

Typical TO-220 Performance

0.60

0.50

(ºC/W)

0.40

0.30

0.20

0.10

0.00

Screw Torque (in-lb)

Heat Dissipated—Watts

Using equation 1, solve for R

θSA

= 150 – 65 - ( 3 + 0.5) = 10.7°C/W

The Index by Heat Sink Style on page 8 lists space saving heat sinks.

Several models are in the 10 °C/W range. Choose the one that best

fits the application and verify thermal resistance from graph.

Part number 593202B03500G shows

a 60 °C temperature rise at 6 watts.

100

Mounting Surface Temp

Rise Above Ambient—°C

Heat Dissipated—Watts

200

Air Velocity—Feet Per Minute

400

600

800

1000

53320X

53330X

According to the above graph, an airflow of 400 ft/min results

in a thermal resistance of 3°C/W. This is less than the required

thermal resistance of 3.85°C/W and is therefore acceptable

under these airflow conditions.

If height is a concern, 533702B02552G would meet the

requirements and is only 1.0” tall

Hi-Flow® is a trademark of the Bergquist Company

θSA

= 60 = 10.0°C/W

Which meets the above requirement in natural convection.

AMERICA

EUROPE

www.aavidthermalloy.com

Thermal Resistance From MTG

Surface to Ambient—°C/Watt

USA

Tel: +1 (603) 224-9988 email: info@aavid.com

Italy

Tel: +39 051 764011 email: sales.it@aavid.com

United Kingdom

Tel: +44 1793 401400 email: sales.uk@aavid.com

ASIA

Singapore

Tel: +65 6362 8388 email: sales@aavid.com.sg

Taiwan

Tel: +886(2) 2698-9888 email: sales@aavid.com.tw

Thermal Resistance From MTG

Surface to Ambient—°C/Watt

Mounting Surface Temp

Rise Above Ambient—°C

At 2 in-lb of torque the thermal resistance

is approximately R

θCS

= 0.5°C/W

100

200

1000

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