• Wide operating power supply range of 3.0V to 5.5V
• Available QML Q or V processes
• 14-lead flatpack
PINOUT
14-Pin Flatpack
Top View
A1
B1
Y1
A2
B2
Y2
V
SS
OUTPUT
B
H
X
L
Y
H
L
L
1
2
3
4
5
6
7
14
13
12
11
10
9
8
V
DD
B4
A4
Y4
B3
A3
Y3
FUNCTION TABLE
INPUT
A
H
L
X
LOGIC DIAGRAM
LOGIC SYMBOL
A1
B1
A2
B2
A3
B3
A4
B4
(1)
(2)
(4)
(5)
(9)
(10)
(12)
(13)
(11)
&
(3)
(6)
(8)
Y1
Y2
Y3
Y4
A1
B1
A2
B2
A3
B3
A4
B4
Y4
Y3
Y1
Y2
Note:
1. Logic symbol in accordance with ANSI/IEEE standard 91-1984 and
IEC Publication 617-12.
DESCRIPTION
The UT54ACTS08E is a quadruple two-input AND gate. The
circuit performs the Boolean functions Y= A
⋅
B or
Y= A+B
in positive logic.
The devices are characterized over full military temperature
range of -55°C to +125°C.
1
RADIATION HARDNESS SPECIFICATIONS
1
PARAMETER
Total Dose
SEU Threshold
2
SEL Threshold
Neutron Fluence
LIMIT
1.0E6
80
120
1.0E14
UNITS
rads(Si)
MeV-cm
2
/mg
MeV-cm
2
/mg
n/cm
2
Notes:
1. Logic will not latchup during radiation exposure within the limits defined in the table.
2. Device storage elements are immune to SEU affects.
ABSOLUTE MAXIMUM RATINGS
1
SYMBOL
V
DD
V
I/O
T
STG
T
J
T
LS
Θ
JC
I
I
P
D
Note:
1. Stresses outside the listed absolute maximum ratings may cause permanent damage to the device. This is a stress rating only, functional operation of the device at these
or any other conditions beyond limits indicated in the operational sections is not recommended. Exposure to absolute maximum rating conditions for extended periods
may affect device reliability.
PARAMETER
Supply voltage
Voltage any pin
Storage Temperature range
Maximum junction temperature
Lead temperature (soldering 5 seconds)
Thermal resistance junction to case
DC input current
Maximum power dissipation
LIMIT
-0.3 to 7.0
-.3 to V
DD
+.3
-65 to +150
+175
+300
20
±10
1
UNITS
V
V
°C
°C
°C
°C/W
mA
W
RECOMMENDED OPERATING CONDITIONS
SYMBOL
V
DD
V
IN
T
C
PARAMETER
Supply voltage
Input voltage any pin
Temperature range
LIMIT
3.0 to 5.5
0 to V
DD
-55 to +125
UNITS
V
V
°C
2
DC ELECTRICAL CHARACTERISTICS FOR THE UT54ACTS08E
7
( V
DD
= 3.0V to 5.5V; V
SS
= 0V
6
; -55°C < T
C
< +125°C)
SYMBOL
V
IL
Description
Low-level input voltage
1
High-level input voltage
1
Input leakage current
Low-level output voltage
3
CONDITION
VDD
3.0V
5.5V
MIN
MAX
0.8
0.8
UNIT
V
V
IH
3.0V
5.5V
2.0
2.75
-1
1
0.4
0.4
2.4
3.15
-100
-200
6
8
-6
-8
1.8
0.72
10
1.6
100
200
V
µA
V
V
V
V
mA
I
IN
V
OL
V
IN
= V
DD
or V
SS
I
OL
= 6mA
I
OL
= 8mA
5.5V
3.0V
4.5V
3.0V
4.5V
3.0V
5.5V
V
OH
High-level output voltage
3
I
OH
= -6mA
I
OH
= -8mA
I
OS
Short-circuit output current
2 ,4
V
O
= V
DD
and V
SS
I
OL
Low level output current
10
V
IN
= V
DD
or V
SS
V
OL
= 0.4V
3.0V
5.5V
3.0V
5.5V
5.5V
3.0V
mA
I
OH
High level output current
10
V
IN
= V
DD
or V
SS
V
OH
= V
DD
-0.4V
mA
P
total
I
DDQ
∆I
DDQ
Power dissipation
2, 8, ,9
Quiescent Supply Current
Quiescent Supply Current Delta
C
L
= 50pF
V
IN
= V
DD
or V
SS
For input under test
V
IN
= V
DD
- 2.1V
For all other inputs
V
IN
= V
DD
or V
SS
ƒ
= 1MHz
ƒ
= 1MHz
mW/
MHz
µA
mA
5.5V
5.5V
C
IN
C
OUT
Input capacitance
5
Output capacitance
5
0V
0V
15
15
pF
pF
Notes:
1. Functional tests are conducted in accordance with MIL-STD-883 with the following input test conditions: V
IH
= V
IH
(min) + 20%, - 0%; V
IL
= V
IL
(max) + 0%, - 50%,
as specified herein, for TTL, CMOS, or Schmitt compatible inputs. Devices may be tested using any input voltage within the above specified range, but are guaranteed
to V
IH
(min) and V
IL
(max).
2. Supplied as a design limit but not guaranteed or tested.
3. Per MIL-PRF-38535, for current density
≤5.0E5
amps/cm
2
, the maximum product of load capacitance (per output buffer) times frequency should not exceed 3,765pF/
MHz.
4. Not more than one output may be shorted at a time for maximum duration of one second.
5. Capacitance measured for initial qualification and when design changes may affect the value. Capacitance is measured between the designated terminal and V
SS
at
frequency of 1MHz and a signal amplitude of 50mV rms maximum.
6. Maximum allowable relative shift equals 50mV.
7. All specifications valid for radiation dose
≤
1E6 rads(Si) per MIL-STD-883 Method 1019 Condition B.
8. Power does not include power contribution of any TTL output sink current
9. Power dissipation specified per switching output.
10. This value is guaranteed based on characterization data, but not tested.
3
AC ELECTRICAL CHARACTERISTICS FOR THE UT54ACTS08E
2
(V
DD
= 3.0V to 5.5V; V
SS
= 0V
1
, -55°C < T
C
< +125°C)
SYMBOL
t
PLH
PARAMETER
Input to Yn
C
L
= 30pF
V
DD
3.0V & 3.6V
4.5V & 5.5V
C
L
= 50pF
3.0V & 3.6V
4.5V & 5.5V
t
PHL
Input to Yn
C
L
= 30pF
3.0V & 3.6V
4.5V & 5.5V
C
L
= 50pF
3.0V & 3.6V
4.5V & 5.5V
Notes:
1. Maximum allowable relative shift equals 50mV.
2. All specifications valid for radiation dose
≤
1E6 rads(Si) per MIL-STD-883 Method 1019 Condition B.
The 485 module on my board is connected to usart1, PB6 and PB7. I followed the 485 communication routine of the Atom development board and changed serial port 2 to serial port 1. I can communicate wit...
When I call OSQPost() in the serial port interrupt program of STM32, I call OSQPend() in the task to wait for the message of the receiving queue. As a result, the received data is wrong. However, I ca...
I have always wanted to buy a 9B96 development board, but I missed a great opportunity before!! :victory: Today eeworld is doing group buying!! eeworld is so powerful!! . Return to TI... Learn more......
When testing STB products, the interference values of the left and right channels are different. One channel is routed under the amplifier. Will it have any impact? Is the impact greater at the front ...
Flip-chip and ball grid array (BGA) are two widely used packaging technologies in the electronics industry. Each has its own advantages and limitations, and in some cases, they can complement each ...[Details]
Some time ago, I attended the 4th Energy Chemistry Forum of the Chinese Chemical Society and learned about high-energy-density and high-safety batteries. I would like to summarize and share this wi...[Details]
The most significant feature of IPS panels is that both electrodes are located on the same surface, unlike other LCD panels, which have electrodes arranged on top and bottom surfaces in a three-dim...[Details]
Limited vocabulary recognition
According to the number of characters, words or short sentences in the vocabulary, it can be roughly divided into: less than 100 is small vocabulary; 100-1000 is...[Details]
According to foreign media reports, BMW has just been granted a patent for a screen that could cover the entire roof. BMW hopes to transform at least a portion of the vehicle's headliner into a dis...[Details]
introduction
The concept of the smart home is gradually developing and gaining market acceptance. We believe its ultimate form lies in the interconnection of all home appliances through open i...[Details]
Electric vehicles' 12V batteries don't rely on a generator to power them. Only gasoline-powered vehicles rely on the engine to drive a generator to generate electricity while driving, which is used...[Details]
Reflow soldering is one of the most commonly used methods in electronics manufacturing, allowing for the soldering of large numbers of components in a relatively short time. However, any experience...[Details]
Industrial computers with GPUs leverage powerful parallel processing to build deep learning models to analyze and respond to optical inputs. The systems develop an understanding of visual data to i...[Details]
Methods of DC motor speed regulation:
1. The voltage regulator can be used to change the input voltage and speed directly, which is often used for large kilowatt-level motors.
2. Thyristo...[Details]
Previously, Positive Motion Technology shared with you the firmware upgrade of motion controller, ZBasic program development, ZPLC program development, communication with touch screen and input/out...[Details]
Lightweighting of automobiles is still a relatively unfamiliar term for automobiles. With the continuous improvement of environmental protection requirements, relevant regulations have also put for...[Details]
As the range of electric vehicles continues to increase, driving electric vehicles for long-distance travel has become a trend. For high-speed travel, how much impact will high-speed driving of ele...[Details]
introduction
In recent years, multi-touch has emerged as a new alternative to traditional human-computer interaction. It eliminates the need for keyboards and mice, enabling simultaneous inter...[Details]
"I want to ask why there are so many manufacturers making mobile phone CPUs, but only Intel and AMD make computer CPUs?"
The progress of domestic PC CPU production has disappointed many ...[Details]