5962-8989204YC datasheet, PDF - EEWORLD Datasheet

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5962-8989204YC: DescriptionStandard SRAM, 16KX4, 20ns, CMOS, CERAMIC, QCC-28; Categorystorage storage; File Size82KB，17 Pages; ManufacturerTEMIC; Websitehttp://www.temic.de/

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5962-8989204YC Overview

Standard SRAM, 16KX4, 20ns, CMOS, CERAMIC, QCC-28

5962-8989204YC Parametric

Parameter Name	Attribute value
package instruction	CERAMIC, QCC-28
Reach Compliance Code	unknown
Maximum access time	20 ns
JESD-609 code	e4
memory density	65536 bit
Memory IC Type	STANDARD SRAM
memory width	4
Number of functions	1
word count	16384 words
character code	16000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	16KX4
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QCCN
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	GOLD
Terminal form	NO LEAD
Terminal location	QUAD
Base Number Matches	1

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REVISIONS

LTR

DESCRIPTION

Drawing updated to reflect current requirements. Editorial changes throughout.

- gap

DATE (YR-MO-DA)

00-11-30

APPROVED

Raymond Monnin

THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED.

REV

SHEET

REV

SHEET

REV STATUS

OF SHEETS

PMIC N/A

REV

SHEET

PREPARED BY

Kenneth Rice

STANDARD

MICROCIRCUIT

DRAWING

THIS DRAWING IS AVAILABLE

FOR USE BY ALL

DEPARTMENTS

AND AGENCIES OF THE

DEPARTMENT OF DEFENSE

CHECKED BY

Charles Reusing

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216

http://www.dscc.dla.mil

APPROVED BY

Monica L. Poelking

MICROCIRCUIT, MEMORY, DIGITAL, CMOS 16K X

4 SRAM WITH OE, MONOLITHIC SILICON

DRAWING APPROVAL DATE

90-03-27

AMSC N/A

REVISION LEVEL

SIZE

SHEET

CAGE CODE

67268

1 OF

5962-89892

DSCC FORM 2233

APR 97

DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.

5962-E016-01

2. APPLICABLE DOCUMENTS

2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a

part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed

in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in

the solicitation.

SPECIFICATION

DEPARTMENT OF DEFENSE

MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.

STANDARDS

DEPARTMENT OF DEFENSE

MIL-STD-883 -

MIL-STD-1835 -

HANDBOOKS

DEPARTMENT OF DEFENSE

MIL-HDBK-103 -

MIL-HDBK-780 -

List of Standard Microcircuit Drawings.

Standard Microcircuit Drawings.

Test Method Standard Microcircuits.

Interface Standard Electronic Component Case Outlines.

(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization

Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text

of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a

specific exemption has been obtained.

3. REQUIREMENTS

3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-

JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer

Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-

PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying

activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan

may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device.

These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-

PRF-38535 is required to identify when the QML flow option is used.

3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as

specified in MIL-PRF-38535, appendix A and herein.

3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein.

3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.

3.2.3 Truth table. The truth table shall be as specified on figure 2.

STANDARD

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216-5000

DSCC FORM 2234

APR 97

SIZE

REVISION LEVEL

5962-89892

SHEET

3.2.4 Die overcoat. Polyimide and silicone coatings are allowable as an overcoat on the die for alpha particle protection

only. Each coated microcircuit inspection lot (see inspection lot as defined in MIL-PRF-38535) shall be subjected to and pass

the internal moisture content test at 5000 ppm (see test method 1018 of MIL-STD-883). The frequency of the internal water

vapor testing shall not be decreased unless approved by the preparing activity. Samples may be pulled anytime after seal.

3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are

as specified in table I and shall apply over the full case operating temperature range.

3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical

tests for each subgroup are described in table I.

3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN

listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked as listed in MIL-HDBK-103 (see 6.6 herein). For

packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the

option of not marking the "5962-" on the device.

3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an

approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to

listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-

38535,

appendix A and the requirements herein.

3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided

with each lot of microcircuits delivered to this drawing.

3.8 Notification of change. Notification of change to DSCC-VA shall be required in accordance with MIL-PRF-38535,

appendix A.

3.9 Verification and review. DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's

facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the

reviewer.

STANDARD

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216-5000

DSCC FORM 2234

APR 97

SIZE

REVISION LEVEL

5962-89892

SHEET

5962-8989204YC Related Products

	5962-8989204YC	5962-8989202YC
Description	Standard SRAM, 16KX4, 20ns, CMOS, CERAMIC, QCC-28	Standard SRAM, 16KX4, 25ns, CMOS, CERAMIC, QCC-28
package instruction	CERAMIC, QCC-28	CERAMIC, QCC-28
Reach Compliance Code	unknown	unknown
Maximum access time	20 ns	25 ns
JESD-609 code	e4	e4
memory density	65536 bit	65536 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM
memory width	4	4
Number of functions	1	1
word count	16384 words	16384 words
character code	16000	16000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C
organize	16KX4	16KX4
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QCCN	QCCN
Package form	CHIP CARRIER	CHIP CARRIER
Parallel/Serial	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified
Maximum supply voltage (Vsup)	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V
surface mount	YES	YES
technology	CMOS	CMOS
Temperature level	MILITARY	MILITARY
Terminal surface	GOLD	GOLD
Terminal form	NO LEAD	NO LEAD
Terminal location	QUAD	QUAD
Base Number Matches	1	1

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