5962-8986302ZX datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > storage> storage> 5962-8986302ZX

5962-8986302ZX: DescriptionFIFO, 512X9, 65ns, Asynchronous, CMOS, CQCC32, CERAMIC, LLCC-32; Categorystorage storage; File Size226KB，22 Pages; ManufacturerTEMIC; Websitehttp://www.temic.de/

Download Datasheet Parametric Compare View All

5962-8986302ZX Overview

FIFO, 512X9, 65ns, Asynchronous, CMOS, CQCC32, CERAMIC, LLCC-32

5962-8986302ZX Parametric

Parameter Name	Attribute value
package instruction	CERAMIC, LLCC-32
Reach Compliance Code	unknown
Maximum access time	65 ns
Other features	RETRANSMIT
Maximum clock frequency (fCLK)	12.5 MHz
period time	80 ns
JESD-30 code	R-CQCC-N32
JESD-609 code	e0
length	13.97 mm
memory density	4608 bit
Memory IC Type	OTHER FIFO
memory width	9
Number of functions	1
Number of terminals	32
word count	512 words
character code	512
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	512X9
Exportable	NO
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QCCN
Encapsulate equivalent code	LCC32,.45X.55
Package shape	RECTANGULAR
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
power supply	5 V
Certification status	Not Qualified
Filter level	38535Q/M;38534H;883B
Maximum seat height	2.286 mm
Maximum standby current	0.025 A
Maximum slew rate	0.115 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	TIN LEAD
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	QUAD
width	11.43 mm
Base Number Matches	1

Preview

Download Datasheet

View All

REVISIONS

LTR

DESCRIPTION

DATE

(YR-MO-DA)

APPROVED

REV

SHEET

REV

SHEET

REV STATUS

OF SHEETS

PMIC N/A

REV

SHEET

PREPARED BY

James E. Jamison

STANDARDIZED

MILITARY

DRAWING

THIS DRAWING IS AVAILABLE

FOR USE BY ALL

DEPARTMENTS

AND AGENCIES OF THE

DEPARTMENT OF DEFENSE

DEFENSE ELECTRONICS SUPPLY CENTER

DAYTON, OHIO 45444

CHECKED BY

Charles Reusing

APPROVED BY

Michael A. Frye

MICROCIRCUITS, DIGITAL, MEMORY, CMOS,

PARALLEL 512 X 9 FIFO, MONOLITHIC

SILICON

SIZE

CAGE CODE

DRAWING APPROVAL DATE

17 SEPTEMBER 1990

AMSC N/A

REVISION LEVEL

SHEET

67268

5962-89863

DESC FORM 193

JUL 91

DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.

5962-E012

5962-8986302ZX Related Products

	5962-8986302ZX	5962-8986301YX	5962-8986304YX	5962-8986303ZX	5962-8986301ZX	5962-8986304ZX	5962-8986303YX	5962-8986302YX
Description	FIFO, 512X9, 65ns, Asynchronous, CMOS, CQCC32, CERAMIC, LLCC-32	FIFO, 512X9, 80ns, Asynchronous, CMOS, 1.485 X 0.310 INCH, 0.230 INCH HIEGHT, DIP-28	FIFO, 512X9, 40ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, CERDIP-28	FIFO, 512X9, 50ns, Asynchronous, CMOS, CQCC32,	FIFO, 512X9, 80ns, Asynchronous, CMOS,	FIFO, 512X9, 40ns, Asynchronous, CMOS, CQCC32, CERAMIC, LLCC-32	FIFO, 512X9, 50ns, Asynchronous, CMOS, 1.485 X 0.310 INCH, 0.230 INCH HIEGHT, DIP-28	FIFO, 512X9, 65ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, CERDIP-28
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
Maximum access time	65 ns	80 ns	40 ns	50 ns	80 ns	40 ns	50 ns	65 ns
Maximum clock frequency (fCLK)	12.5 MHz	10 MHz	20 MHz	15.38 MHz	10 MHz	20 MHz	15.38 MHz	12.5 MHz
period time	80 ns	100 ns	50 ns	65 ns	100 ns	50 ns	65 ns	80 ns
JESD-30 code	R-CQCC-N32	R-XDIP-T28	R-GDIP-T28	R-CQCC-N32	R-XQCC-N32	R-CQCC-N32	R-XDIP-T28	R-GDIP-T28
memory density	4608 bit	4608 bit	4608 bit	4608 bit	4608 bit	4608 bit	4608 bit	4608 bit
Memory IC Type	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO
memory width	9	9	9	9	9	9	9	9
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	32	28	28	32	32	32	28	28
word count	512 words	512 words	512 words	512 words	512 words	512 words	512 words	512 words
character code	512	512	512	512	512	512	512	512
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
organize	512X9	512X9	512X9	512X9	512X9	512X9	512X9	512X9
Exportable	NO	NO	NO	NO	NO	NO	NO	NO
Package body material	CERAMIC, METAL-SEALED COFIRED	UNSPECIFIED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	UNSPECIFIED	CERAMIC, METAL-SEALED COFIRED	UNSPECIFIED	CERAMIC, GLASS-SEALED
encapsulated code	QCCN	DIP	DIP	QCCN	QCCN	QCCN	DIP	DIP
Encapsulate equivalent code	LCC32,.45X.55	DIP28,.3	DIP28,.3	LCC32,.45X.55	LCC32,.45X.55	LCC32,.45X.55	DIP28,.3	DIP28,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER	IN-LINE	IN-LINE	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Filter level	38535Q/M;38534H;883B	MIL-STD-883	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B
Maximum standby current	0.025 A	0.025 A	0.025 A	0.025 A	0.025 A	0.025 A	0.025 A	0.025 A
Maximum slew rate	0.115 mA	0.115 mA	0.14 mA	0.13 mA	0.115 mA	0.14 mA	0.13 mA	0.115 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	NO	NO	YES	YES	YES	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal form	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	NO LEAD	NO LEAD	NO LEAD	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	1.27 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm	1.27 mm	2.54 mm	2.54 mm
Terminal location	QUAD	DUAL	DUAL	QUAD	QUAD	QUAD	DUAL	DUAL
Base Number Matches	1	1	1	1	1	1	1	1
package instruction	CERAMIC, LLCC-32	1.485 X 0.310 INCH, 0.230 INCH HIEGHT, DIP-28	0.300 INCH, CERDIP-28	-	-	CERAMIC, LLCC-32	1.485 X 0.310 INCH, 0.230 INCH HIEGHT, DIP-28	0.300 INCH, CERDIP-28
Other features	RETRANSMIT	-	RETRANSMIT	RETRANSMIT	RETRANSMIT	RETRANSMIT	-	RETRANSMIT
JESD-609 code	e0	-	e0	e0	e4	e0	e0	e0
length	13.97 mm	-	37.0205 mm	13.97 mm	13.97 mm	13.97 mm	-	37.0205 mm
Maximum seat height	2.286 mm	-	5.08 mm	3.048 mm	3.048 mm	2.286 mm	-	5.08 mm
Terminal surface	TIN LEAD	-	TIN LEAD	TIN LEAD	GOLD	TIN LEAD	TIN LEAD	TIN LEAD
width	11.43 mm	-	7.62 mm	11.43 mm	11.43 mm	11.43 mm	-	7.62 mm

Recommended Resources

The simplest voice-controlled music lantern

Encoder, decoder circuit diagram

Constant Current LED Battery Charger

Demonstration circuit using dual flip-flops

lkEb Wien bridge signal generator circuit

Sawtooth wave oscillator composed of integrating circuit and comparator

Which topology should be chosen for a ZIGBEE-based smart home?: Hello everyone. I am going to write a master's thesis. The content is about ZIGBEE's smart home system. I have read some literature from 1 or 2 years ago, and most of them use star topology. I would l...; royalyuan Embedded System

Ask for help from seniors and classmates, Digital voltmeter based on 51 single chip microcomputer: Content: Measuring range 0-10VDC, error 5%, design DC voltage conversion circuit, AD conversion circuit, interface circuit, display circuit, design power supply, calculate power supply power and effic...; zxpla 51mcu

Switcher Purchase: I'm looking for a design of an energy switching controller that can monitor related data. I'd prefer someone in Jiangsu or Nanjing. Let's meet and discuss the details....; cierstar MCU

This is a serious problem, how can I solve it?: [img]file:///F:/Program%20Files/Tencent/QQ/Users/382864860/Image/@760GXD(G96Y24}MHQ[1DN0.jpg[/img] This problem occurred when I was programming yesterday. I have been working on it for a whole day but...; terrykgm DSP and ARM Processors

【Low Power】Xilinx Power Analysis Tool: As shown in the figure below, this is the content of this article...; jjkwz FPGA/CPLD

Using FPGA to implement multi-channel voice/data multiplexing equipment: [b]Abstract[/b]: This paper uses FPGA to complete the multiplexing and demultiplexing process of 8-way synchronous voice and 16-way asynchronous data, and realizes the frame synchronization capture be...; kandy2059 FPGA/CPLD

Shortcut: S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 SA SB SC SD SE SF SG SH SI SJ SK SL SM SN SO SP SQ SR SS ST SU SV SW SX SY SZ T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 TA TB TC TD TE TF TG TH TI TJ TK TL TM TN TO TP TQ TR TS TT TU TV TW TX TY TZ U0 U1 U2 U3 U4 U6 U7 U8 UA UB UC UD UE UF UG UH UI UJ UK UL UM UN UP UQ UR US UT UU UV UW UX UZ V0 V1 V2 V3 V4 V5 V6 V7 V8 V9 VA VB VC VD VE VF VG VH VI VJ VK VL VM VN VO VP VQ VR VS VT VU VV VW VX VY VZ W0 W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WJ WK WL WM WN WO WP WR WS WT WU WV WW WY X0 X1 X2 X3 X4 X5 X7 X8 X9 XA XB XC XD XE XF XG XH XK XL XM XN XO XP XQ XR XS XT XU XV XW XX XY XZ Y0 Y1 Y2 Y4 Y5 Y6 Y9 YA YB YC YD YE YF YG YH YK YL YM YN YP YQ YR YS YT YX Z0 Z1 Z2 Z3 Z4 Z5 Z6 Z8 ZA ZB ZC ZD ZE ZF ZG ZH ZJ ZL ZM ZN ZP ZR ZS ZT ZU ZV ZW ZX ZY

Popular Components