EEWORLDEEWORLDEEWORLD

Part Number

Search

75970-3AP-35LF

Description
Board Stacking Connector
CategoryThe connector    The connector   
File Size207KB,3 Pages
ManufacturerAmphenol
Websitehttp://www.amphenol.com/
Environmental Compliance
Download Datasheet Parametric View All

75970-3AP-35LF Overview

Board Stacking Connector

75970-3AP-35LF Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Reach Compliance Codeunknown
ECCN codeEAR99
Connector typeBOARD STACKING CONNECTOR
Contact to complete cooperationMATTE TIN (79) OVER NICKEL (50)
Contact completed and terminatedMATTE TIN (79) OVER NICKEL (50)
Contact materialPHOSPHOR BRONZE
JESD-609 codee3
Manufacturer's serial number75970
Base Number Matches1
PDS: Rev :DE
STATUS:Released
Printed: Jan 10, 2014
【Design Tools】2011 EDK13.1 Training Part - Training Materials
Pictures speak louder than words[[i] This post was last edited by fuli247012412 on 2012-3-16 22:11[/i]]...
fuli247012412 FPGA/CPLD
Embedded Linux System and Its Application Prospects
This paper mainly analyzes the characteristics of embedded Linux system application development, outlines its development process and challenges, and explains the development and application prospects...
frozenviolet Linux and Android
[Favorite MSP432] Share the learning experience of MSP432: the successor of MSP430
[i=s]This post was last edited by xunke on 2016-10-4 20:43[/i] [align=left][font=宋体] I don't know if this title is appropriate. I think [/font]MSP432[font=宋体] is the successor of [/font][font=Calibri]...
xunke Microcontroller MCU
51 function interrupt system problem
Why is it that in this program, I don't need to press the third row of keys on the matrix keyboard, and after burning, the LEDs will change four lights at a time, just like a running light, and my int...
圈在指尖 51mcu
How to call modules after IAR modularization
Please guide me, I want to know the basic operation of IAR modularization, thank you...
工业园 Microcontroller MCU
Three-box temperature shock chamber
Product Features  This equipment is divided into three parts: high temperature area, low temperature area and test area. It adopts a unique thermal insulation structure and heat and cold storage effec...
bjjufu Discrete Device

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2611  674  1895  2378  1073  53  14  39  48  22 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号