The UT54ACS365 and UT54ACTS365 are non-inverting hex
buffer and line driver with three-state outputs. The output en-
ables (OE1 and OE2) control the three-state outputs. If OE1 or
OE2 is high, the outputs will be in a high impedance state. For
data, both OE1 and OE2 must be low.
The devices are characterized over full military temperature
range of -55°C to +125°C.
FUNCTION TABLE
INPUTS
OE1
L
L
X
H
OE2
L
L
H
X
A
L
H
X
X
OUTPUT
Y
L
H
Z
Z
PINOUTS
16-Pin DIP
Top View
OE1
A1
Y1
A2
Y2
A3
Y3
V
SS
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
V
DD
OE2
A6
Y6
A5
Y5
A4
Y4
16-Lead Flatpack
Top View
OE1
A1
Y1
A2
Y2
A3
Y3
V
SS
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
V
DD
OE2
A6
Y6
A5
Y5
A4
Y4
LOGIC SYMBOL
OE1
OE2
(1)
(15)
&
EN
A1
A2
A3
A4
A5
A6
(2)
(4)
(6)
(10)
(12)
(14)
(3)
(5)
(7)
(9)
(11)
(13)
Y1
Y2
Y3
Y4
Y5
Y6
Note:
1. Logic symbol in accordance with ANSI/IEEE Std 91-1984 and
IEC Publication 617-12.
1
LOGIC DIAGRAM
OE2
(15)
A6
(14)
A5
(12)
A4
(10)
A3
(6)
A2
(4)
OE1
(1)
A1
(2)
(13)
Y6
Y5
(11)
Y4
(9)
Y3
(7)
Y2
(5)
Y1
(3)
2
OPERATIONAL ENVIRONMENT
1
PARAMETER
Total Dose
SEU Threshold
2
SEL Threshold
Neutron Fluence
LIMIT
1.0E6
80
120
1.0E14
UNITS
rads(Si)
MeV-cm
2
/mg
MeV-cm
2
/mg
n/cm
2
Notes:
1. Logic will not latchup during radiation exposure within the limits defined in the table.
2. Device storage elements are immune to SEU affects.
ABSOLUTE MAXIMUM RATINGS
SYMBOL
V
DD
V
I/O
T
STG
T
J
T
LS
Θ
JC
I
I
P
D
PARAMETER
Supply voltage
Voltage any pin
Storage Temperature range
Maximum junction temperature
Lead temperature (soldering 5 seconds)
Thermal resistance junction to case
DC input current
Maximum power dissipation
LIMIT
-0.3 to 7.0
-.3 to V
DD
+.3
-65 to +150
+175
+300
20
±10
1
UNITS
V
V
°C
°C
°C
°C/W
mA
W
Note:
1. Stresses outside the listed absolute maximum ratings may cause permanent damage to the device. This is a stress rating only, functional operation of the device at
these or any other conditions beyond limits indicated in the operational sections is not recommended. Exposure to absolute maximum rating conditions for extended
periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
SYMBOL
V
DD
V
IN
T
C
PARAMETER
Supply voltage
Input voltage any pin
Temperature range
LIMIT
4.5 to 5.5
0 to V
DD
-55 to + 125
UNITS
V
V
°C
3
DC ELECTRICAL CHARACTERISTICS
7
(V
DD
= 5.0V
±
10%; V
SS
= 0V
6
, -55°C < T
C
< +125°C); Unless otherwise noted, Tc is per the temperature range ordered.
SYMBOL
V
IL
PARAMETER
Low-level input voltage
1
ACTS
ACS
High-level input voltage
1
ACTS
ACS
Input leakage current
ACTS/ACS
Low-level output voltage
3
ACTS
ACS
High-level output voltage
3
ACTS
ACS
Three-state output leakage current
Short-circuit output current
2 ,4
ACTS/ACS
Output current
10
(Sink)
I
OH
Output current
10
(Source)
P
total
I
DDQ
ΔI
DDQ
Power dissipation
2, 8, 9
Quiescent Supply Current
Quiescent Supply Current Delta
ACTS
V
IN
= V
DD
or V
SS
I
OL
= 12.0mA
I
OL
= 100μA
I
OH
= -12.0mA
I
OH
= -100μA
V
O
= V
DD
and V
SS
V
O
= V
DD
and V
SS
V
IN
= V
DD
or V
SS
V
OL
= 0.4V
V
IN
= V
DD
or V
SS
V
OH
= V
DD
- 0.4V
C
L
= 50pF
V
DD
= 5.5V
For input under test
V
IN
= V
DD
- 2.1V
For all other inputs
V
IN
= V
DD
or V
SS
V
DD
= 5.5V
C
IN
C
OUT
Input capacitance
5
Output capacitance
5
ƒ
= 1MHz @ 0V
ƒ
= 1MHz @ 0V
15
15
pF
pF
1.8
10
1.6
mW/
MHz
μA
mA
-12
mA
.7V
DD
V
DD
- 0.25
-30
30
.5V
DD
.7V
DD
-1
1
CONDITION
MIN
MAX
0.8
.3V
DD
UNIT
V
V
IH
V
I
IN
V
OL
μA
0.40
0.25
V
V
OH
V
μA
I
OZ
I
OS
I
OL
-300
12
300
mA
mA
4
Notes:
1. Functional tests are conducted in accordance with MIL-STD-883 with the following input test conditions: V
IH
= V
IH
(min) + 20%, - 0%; V
IL
= V
IL
(max) + 0%, -
50%, as specified herein, for TTL, CMOS, or Schmitt compatible inputs. Devices may be tested using any input voltage within the above specified range, but are
guaranteed to V
IH
(min) and V
IL
(max).
2. Supplied as a design limit but not guaranteed or tested.
3. Per MIL-PRF-38535, for current density
≤
5.0E5 amps/cm
2
, the maximum product of load capacitance (per output buffer) times frequency should not exceed 3,765
pF/MHz.
4. Not more than one output may be shorted at a time for maximum duration of one second.
5. Capacitance measured for initial qualification and when design changes may affect the value. Capacitance is measured between the designated terminal and V
SS
at
frequency of 1MHz and a signal amplitude of 50mV rms maximum.
6. Maximum allowable relative shift equals 50mV.
7. All specifications valid for radiation dose
≤
1E6 rads(Si).
8. Power does not include power contribution of any TTL output sink current.
9. Power dissipation specified per switching output.
10. This value is guaranteed based on characterization data, but not tested.
The 7-segment digital tube decoder driver and counter form a 24-hour timer. Here is an introduction to the 7-segment digital tube. See the figure below [img] http://www.51hei.com/UpFiles/Pic/chip/2008...
Hello everyone! I want to ask the experts, if I use DSP to receive external pulses and count the number of pulses, I see there are two ports: TCLKINB to receive pulses, TDIRB to receive the level of d...
Which books are essential for learning embedded systems? Are there any books related to embedded systems? Any books related to embedded systems are fine~~ Including various operating systems or networ...
Wearable devices will become smaller, more functional, and run longer, thanks to innovations in battery charging, low quiescent current operation, intelligent power management, and high integration. B...
I would like to ask the experts: I used PB to develop an X86 kernel (with a special BSP) and then exported the SDK. After the settings were completed, I clicked platform->sdk->build sdk. When I starte...
I am a rookie, but I have an unfinished driver code. What I need to solve urgently is what end work the driver should do to ensure the normal shutdown of the software when shutting down. I don't know ...
From being a global leader to losing the market, Korean battery manufacturers have always wanted to regain the lost market and dignity, but facing Chinese battery manufacturers represented by CAT...[Details]
Wave soldering is a crucial electronic component soldering technique used in the production of a wide range of electronic devices, from home appliances to computers to avionics. The process is wide...[Details]
Ever since the Tesla fire incident, electric cars, already known for their poor reputation, have been subjected to even more scathing criticism. Despite this, many people are still willing to buy t...[Details]
On August 22, the National Energy Administration released the latest data, showing that by the end of July 2025, China's total number of electric vehicle charging infrastructure will reach 16.696 m...[Details]
introduction
According to the China Fire Statistics Yearbook, electrical fires accounted for more than 30% of fire accidents in the past decade, and the trend is increasing year by year. They ...[Details]
Teletrac Navman has launched the Multi IQ dashcam, a cloud-based solution designed for large commercial vehicle operators. It connects up to five cameras to cover the vehicle's interior, sides, and...[Details]
A tubular motor is an electric motor that is typically used to control the movement of machines and equipment. Tubular motors are generally divided into two categories: linear tubular motors and ro...[Details]
A scale, a large, ground-mounted scale, is typically used to measure the tonnage of truck cargo. It's the primary weighing device used in factories, mines, and businesses for bulk cargo measurement...[Details]
Smartphones can be incredibly unintelligent. For example, consider an office full of people, each absorbed in their work. Suddenly, the silence is broken by a burst of loud pop music. A colleague's...[Details]
introduction
The OMAP-L138 dual-core processor is a new generation of low-power single-chip systems (SoCs) from TI. It is widely used in communications, industrial, medical diagnostic, and aud...[Details]
Today,
the Intel®
Universal
Quick Connector (UQD) Interchangeability Alliance was officially established
. At the inaugural ceremony, Intel and its first certified partners—Invicta...[Details]
In microwave amplification circuits, the power chip is the core of the entire circuit. A large number of semiconductor devices in the chip will generate a lot of heat when working. If the heat diss...[Details]
A Beijing chemical project utilizes a distributed control system (DCS). The master control system primarily uses the Modbus protocol, while the remote field devices utilize the PROFIBUS-DP protocol...[Details]
In July 2025, stimulated by the "old for new" policy, China's new energy vehicle penetration rate reached a historic 50% mark. While industry experts like Cui Dongshu celebrated the market's perfor...[Details]
At the 2025 KeyBanc Investor Conference,
ON
Semiconductor CEO Hassane S. El-Khoury, framing global industrial transformation as the basis for
his strategic layout in two high-growth sect...[Details]
Analog electronics
京公网安备 11010802033920号
EEWORLD
