REVISIONS
LTR
A
B
C
D
E
F
G
H
DESCRIPTION
Add device types 04, 05, and 06. Editorial changes throughout.
Add device types 07, 08, and 09. Update boilerplate. Editorial changes throughout. -
TVN
Changes in accordance with NOR 5962-R002-01. - TVN
Update the boilerplate in accordance with the requirements of MIL-PRF-38535. –
TVN
Update boilerplate to current MIL-PRF-38535 requirements. – CFS
Update case outline Y package dimension A and A1 in figure 1 of Quad flat pack for
device types 07, 08 and 09. - MAA
Update values of t
WP2
, t
RDYL1
, t
RDYL2
, in table I, per GIDEP# GB4-C-12-0005. - PHN
Correct dimensions A, D, and E for case outline X, Figure 1. Update boilerplate to
current MIL-PRF-38535 requirements. - PHN
DATE (
YR-MO-DA
)
96-01-17
99-04-12
00-12-21
01-04-11
07-07-30
11-02-01
12-04-17
13-03-04
APPROVED
Monica L. Poelking
Monica L. Poelking
Thomas M. Hess
Thomas M. Hess
Thomas M. Hess
David Corbett
Thomas M. Hess
Thomas M. Hess
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PREPARED BY
Thomas M. Hess
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PMIC N/A
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
Thomas M. Hess
APPROVED BY
Monica L. Poelking
DRAWING APPROVAL DATE
95-03-28
REVISION LEVEL
SIZE
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
http://www.landandmaritime.dla.mil
MICROCIRCUIT, DIGITAL, SERIAL MICROCODED
MULTI-MODE INTELLIGENT TERMINAL, SILICON
CAGE CODE
AMSC N/A
H
A
67268
SHEET
5962-94758
1 OF 38
DSCC FORM 2233
APR 97
5962-E281-13
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q) and
space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or
Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN.
1.2 PIN. The PIN is as shown in the following example:
5962
-
94758
01
Q
X
X
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
/
\/
Drawing number
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are
marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device types. The device types identify the circuit function as follows:
Device type
01
02
03
04
05
06
07
08
09
Generic number
69151XT15
69151XT5
69151XT12
69151XTE15
69151XTE5
69151XTE12
69151XTE15
69151XTE5
69151XTE12
Circuit function
Serial microcoded monolithic multi-mode intelligent
terminal with +5 V/-15 V operation
Serial microcoded monolithic multi-mode intelligent
terminal with +5 V operation
Serial microcoded monolithic multi-mode intelligent
terminal with +5 V/-12 V operation
Enhanced serial microcoded monolithic multi-mode
intelligent terminal with +5 V/-15V operation
Enhanced serial microcoded monolithic multi-mode
intelligent terminal with +5 V operation
Enhanced, serial microcoded monolithic multi-mode
intelligent terminal with +5 V/-12V operation
Enhanced, serial microcoded monolithic multi-mode
intelligent terminal with +5 V/-15V operation
Enhanced, serial microcoded monolithic multi-mode
intelligent terminal with +5 V operation
Enhanced, serial microcoded monolithic multi-mode
intelligent terminal with +5 V/-12V operation
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as
follows:
Device class
Q or V
Device requirements documentation
Certification and qualification to MIL-PRF-38535
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-94758
SHEET
H
2
1.2.4 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows:
Outline letter
X
Y
Descriptive designator
See figure 1
See figure 1
Terminals
139
140
Package style
Pin grid array
Quad flat pack
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535.
1.3 Absolute maximum ratings.
1/
Storage temperature range (T
STG
) ........................................................................ -65°C to +150°C
Operating case temperature range (T
C
) ................................................................ -55°C to +125°C
Transceiver supply voltage (V
EE
):
Device types 01, 03, 04, 06, 07, 09 .................................................................. -22 V dc
Transceiver supply voltage range (V
CC
):
Device types 02, 05, 08 .................................................................................... -0.3 V dc to +7.0 V dc
Logic supply voltage range (V
DD
) ........................................................................... -0.3 V dc to +7.0 V dc
Input voltage range (receiver) (V
DR
):
Device types 01, 03, 04, 06, 07, 09 .................................................................. 42 V
P,L-L
Device types 02, 05, 08 .................................................................................... 10 V
P,L-L
Maximum power dissipation (P
D
) ........................................................................... 5 W
Logic voltage on any pin range (V
I/O
) ..................................................................... -0.3 V dc to V
DD
+ 0.3 V dc
Logic latch-up immunity (I
LU
) .................................................................................
±150
mA
Logic input current (I
I
) ...........................................................................................
±10
mA
Peak output current (transmitter) (I
O
):
Device types 01, 03, 04, 06, 07, 09 .................................................................. 190 mA
Device types 02, 05, 08 .................................................................................... 1000 mA
Maximum junction temperature (T
J
):
Device types 01, 03, 04, 06, 07, 09 .................................................................. +150°C
Device types 02, 05, 08 .................................................................................... +135°C
Receiver common mode input voltage range (V
IC
):
Device types 01, 03, 04, 06, 07, 09 .................................................................. -11 V dc to +11 V dc
Device types 02, 05, 08 .................................................................................... -5 V dc to +5 V dc
Lead temperature (soldering, 5 seconds) .............................................................. +300°C
Thermal resistance junction-to-case (Θ
JC
): 2/
Cases X and Y .................................................................................................. 7°C/W
__________
1/
Stresses above the absolute maximum rating may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond limits indicated in the operational sections of
this specification is not recommended. Extended operation at the maximum levels may degrade performance and affect
reliability.
Mounting in accordance with MIL-STD-883, method 1012.
2/
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-94758
SHEET
H
3
1.4 Recommended operating conditions.
Transceiver supply voltage range (V
CC
):
Device types 01, 03, 04, 06, 07, 09 .................................................................. +4.75 V dc to +5.5 V dc
Device types 02, 05, 08 .................................................................................... +4.5 V dc to +5.5 V dc
Logic supply voltage range (V
DD
) .......................................................................... +4.5 V dc to +5.5 V dc
Transceiver supply voltage range (V
EE
):
Device types 01, 04, 07 .................................................................................... -15 V dc
±
5%
Device types 03, 06, 09 .................................................................................... -12 V dc
±
5%
Receiver differential voltage (V
DR
):
Device types 01, 03, 04, 06, 07, 09 .................................................................. 40 V
P-P
Device types 02, 05, 08 .................................................................................... 8.0 V
P-P
Logic dc input voltage range (V
IN
).......................................................................... 0 V dc to V
DD
Receiver common mode input voltage (V
IC
):
Device types 01, 03, 04, 06, 07, 09 ..................................................................
±10
V dc
Device types 02, 05, 08 ....................................................................................
±5.0
V dc
Driver peak output current (I
O
):
Device types 01, 03, 04, 06, 07, 09 .................................................................. 180 mA
Device types 02, 05, 08 .................................................................................... 700 mA
Serial data rate range (S
D
) .................................................................................... 0 to 1 MHz
Clock duty cycle (D
C
) ............................................................................................ 50
±
5%
Case operating temperature range (T
C
) ................................................................ -55°C to +125°C
Operating frequency (F
IN
) ..................................................................................... 24 MHz
±
0.01%
1.5 Digital logic testing for device classes Q and V.
Fault coverage measurement of manufacturing
logic tests (MIL-STD-883, method 5012) .......................................................... 95.12 percent
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535
-
Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883
MIL-STD-1835
-
-
Test Methods and Procedures for Microelectronics.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 -
MIL-HDBK-780 -
MIL-HDBK-1553 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
Multiplex Application Handbook.
(Copies of these documents are available online at
https://assist.daps.dla.mil/quicksearch/
or from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094).
2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein.
Unless otherwise specified, the issues of the documents are the issues of the documents cited in the solicitation or contract.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-94758
SHEET
H
4
IEEE - THE INSTITUTE OF ELECTRICAL AND ELECTRONICS ENGINEERS (IEEE)
IEEE Standard 1149.1 - IEEE Standard Test Access Port and Boundary Scan Architecture.
(Copies of these documents are available online at
http://www.ieee.org
or from the IEEE Service Center, 445 Hoes Lane,
P.O. Box 1331, Piscataway, NJ 08855–1331).
2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535 and herein for device classes Q and V.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Block diagram. The block diagram shall be as specified on figure 3.
3.2.4 Boundary scan instruction codes. The boundary scan instruction codes shall be as specified on figure 4.
3.2.5 Timing waveforms. The timing waveforms shall be as specified on figure 5.
3.2.6 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document
revision level control and shall be made available to the preparing and acquiring activity upon request.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full
case operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are defined in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer
has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be
marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in
MIL-PRF-38535.
3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535
listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). The certificate of compliance
submitted to DLA Land and Maritime -VA prior to listing as an approved source of supply for this drawing shall affirm that the
manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein.
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 shall
be provided with each lot of microcircuits delivered to this drawing.
3.11 IEEE 1149.1 compliance. Theses devices shall be compliant to IEEE 1149.1.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-94758
SHEET
H
5
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