5962-3826702VXM datasheet, PDF

Datasheet> All Categories > 5962-3826702VXM

Preview

5962-3826702VXM: DescriptionGIGATRUE 550 CAT6 PATCH 1 FT. SNAGLESS, GREEN; File Size320KB，40 Pages; ManufacturerMaxell; Websitehttp://www.maxell.com

Download Datasheet View All

5962-3826702VXM Overview

GIGATRUE 550 CAT6 PATCH 1 FT. SNAGLESS, GREEN

Preview

Download Datasheet

View All

REVISIONS

LTR

DESCRIPTION

Add packages T and W. Add vendor CAGE 60395 as source of

supply. Increase data retention to 20 years, minimum. Redrawn with

changes.

Changes in accordance with NOR 5962-R139-94.

Changes in accordance with NOR 5962-R278-94.

Changes in accordance with NOR 5962-R163-96.

Updated boilerplate. Added device types 16-18 and packages M and N

to drawing along with vendor CAGE 0EU86 as supplier. Removed

figures 9, 10 and 11 software data protect algorithms. Removed

vendor 61395 as supplier. - glg

Corrected dimensions for packages "M" and "N". - glg

Added device 19, packages 6 and 7, and updated boilerplate. ksr

DATE

(YR-MO-DA)

93-06-29

APPROVED

M. A. Frye

94-03-29

94-09-19

96-06-27

98-07-22

M. A. Frye

Raymond Monnin

99-10-06

01- 10- 05

Raymond Monnin

THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED.

REV

SHEET

REV

SHEET

REV STATUS

OF SHEETS

REV

SHEET

PREPARED BY

Kenneth Rice

CHECKED BY

Charles Reusing

PMIC N/A

STANDARD

MICROCIRCUIT

DRAWING

THIS DRAWING IS

AVAILABLE

FOR USE BY ALL

DEPARTMENTS

AND AGENCIES OF THE

DEPARTMENT OF DEFENSE

AMSC N/A

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216

APPROVED BY

Charles E. Besore

MICROCIRCUIT, MEMORY, DIGITAL,

CMOS 128K x 8 BIT EEPROM,

MONOLITHIC SILICON

SIZE

SHEET

DRAWING APPROVAL DATE

91-07-12

REVISION LEVEL

CAGE CODE

67268

5962-38267

DSCC FORM 2233

APR 97

DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.

5962-E561-01

2. APPLICABLE DOCUMENTS

2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part

of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the

issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the

solicitation.

SPECIFICATION

DEPARTMENT OF DEFENSE

MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.

STANDARDS

DEPARTMENT OF DEFENSE

MIL-STD-883 -

MIL-STD-1835 -

HANDBOOKS

DEPARTMENT OF DEFENSE

MIL-HDBK-103 -

MIL-HDBK-780 -

List of Standard Microcircuit Drawings.

Standard Microcircuit Drawings.

Test Method Standard Microcircuits.

Interface Standard for Microcircuit Case Outlines.

(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization

Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094).

2.2 Non-Government publications. The following documents form a part of this document to the extent specified herein. Unless

otherwise specified, the issues of the documents which are DoD adopted are those listed in the issue of the DODISS cited in the

solicitation. Unless otherwise specified, the issues of documents not listed in the DODISS are the issues of the documents cited

in the solicitation.

AMERICAN SOCIETY FOR TESTING AND MATERIALS (ASTM)

ASTM Standard F1192-88

Standard Guide for the Measurement of Single Event Phenomena from

Heavy Ion Irradiation of Semiconductor Devices.

(Applications for copies of ASTM publications should be addressed to the American Society for Testing and Materials, 1916

Race Street, Philadelphia, PA 19103).

ELECTRONICS INDUSTRIES ASSOCIATION (EIA)

JEDEC Standard EIA/JESD78 - I/C Latch-up Test.

(Applications for copies should be addressed to the Electronics Industries Association, 2500 Wilson Boulevard, Arlington,

VA 22201).

(Non-Government standards and other publications are normally available from the organizations that prepare or distribute

the documents. These documents also may be available in or through libraries or other informational services).

2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of

this drawing shall take precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a

specific exemption has been obtained.

SIZE

STANDARD

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216-5000

DSCC FORM 2234

APR 97

REVISION LEVEL

5962-38267

SHEET

3. REQUIREMENTS

3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535

and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM

plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in

accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein.

3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified

in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.

3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1.

3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.

3.2.3 Truth table. The truth table shall be as specified on figure 3.

3.2.3.1 Unprogrammed devices. The truth table for unprogrammed devices for contracts involving no altered item drawing

shall be as specified on figure 3 herein. When required, in screening (see 4.2 herein), or quality conformance inspection groups

A, B, C, or D (see 4.4 herein), the devices shall be programmed by the manufacturer prior to test in a checkerboard or similar

pattern (a minimum of 50 percent of the total number of bits programmed).

3.2.3.2 Programmed devices. The requirements for supplying programmed devices are not part of this document.

3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical

performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case

operating temperature range.

3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical

tests for each subgroup are defined in table I.

3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked

as listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN number is not feasible due to space limitations,

the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator

shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class

M shall be in accordance with MIL-PRF-38535, appendix A.

3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in

MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.

3.6 Certificate of compliance.

For device classes Q and V, a certificate of compliance shall be required from a QML-38535

listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of

compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2

herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall

affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for

device class M, the requirements of MIL-PRF-38535, appendix A and herein.

3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for

device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.

3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein)

involving devices acquired to this drawing is required for any change as defined in MIL-PRF-38535, appendix A.

SIZE

STANDARD

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216-5000

DSCC FORM 2234

APR 97

REVISION LEVEL

5962-38267

SHEET

Recommended Resources

Infrared anti-theft alarm circuit one a

High reliability universal timer (CC4518, CC4001) circuit

Base amplitude modulation application circuit

Soil moisture meter circuit

Circuit diagram of current-to-voltage converter with strong resistance to common-mode voltage

Ion smoke alarm circuit

DIY a simple WIFI signal amplifier: The signal where I live is not very good. I have always wanted to DIY a simple WIFI signal amplifier. In fact, it should be more accurate to say a WIFI repeater. The principle is routing + NAT functio...; wateras1 RF/Wirelessly

Embedded C Programming with Atmel AVR: Embedded C Programming with Atmel AVR...; weilanqing Microchip MCU

[2022 Digi-Key Innovation Design Competition] - Intelligent Electronic Weighing System: 1. Function Overview ESP32S2: 1. Developed based on CircuitPython language 2. Comes with LCD screen, drives LCD screen, and outputs information 3. Connect HX711 weighing and metering module 4. MQTT pu...; eew_dCepDu DigiKey Technology Zone

Automatic sprinkler water temperature regulator: I want to ask if there is such a product. My home is a solar cell water heater. It takes a while to adjust the water every time I take a shower. Moreover, the water temperature is sometimes hot and so...; xyh_521 Energy Infrastructure?

Problems with copper pouring in PADS: How to pour copper into the pins in PADS without forming a thermal pad? As shown in the figure below:I hope someone who knows can help me solve this problem, thank you!...; 静若幽兰 PCB Design

Brother, please help me, I will definitely thank you: How to make the remaining space of flash into storage area, that is, how to partition using nor flash?...; sure549 Embedded System

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components