40T40-100C datasheet, PDF - EEWORLD Datasheet

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40T40-100C: DescriptionRF/Microwave Termination, 0MHz Min, 50000MHz Max, 40ohm; CategoryWireless rf/communication Radio frequency and microwave; File Size128KB，2 Pages; ManufacturerCobham PLC

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40T40-100C Overview

RF/Microwave Termination, 0MHz Min, 50000MHz Max, 40ohm

40T40-100C Parametric

Parameter Name	Attribute value
Reach Compliance Code	unknown
Characteristic impedance	40 Ω
structure	COMPONENT
Maximum operating frequency	50000 MHz
Minimum operating frequency
RF/Microwave Device Types	RF/MICROWAVE TERMINATION
Base Number Matches	1

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High Power Terminations Short Form

ADVANCED DATA SHEET

Model 10T Series

DC to 20 GHz

The 10T Series are High Power Thin-Film Terminations designed for use in 10 Gbit systems. An integrated DC

Block can be added to the termination for a reduction in DC current consumption and heat dissipation

10Gbit High Power Terminations

Aeroflex Part #

10T50-(100/500) (C/M )

10T40-(100/500) (C/M)

10T35-(100/500) (C/M)

Termination

Value

50 ohms ±2%

40 ohms ±2%

35 ohms ±2%

Power

Handling

mW Min

100 / 500

Transmission

Line

CPWG / MS

S11, 0 - 20 GHz

-15 dB min

(with no wire-bonds)

-15 dB min

(with no wire-bonds, in 40W system)

-15 dB min

(with no wire-bonds, in 35W system)

Size

.138” x .079”

138” x .079“

138” x .079”

Notes:

1. These devices will need to be mounted on a heat sink with a good thermal / electrical conductive epoxy or solder.

2. Electrical connections are made through wire-bonds.

3. 100 = 100 mW, 500 = 500 mW, C = CPWG, M = Microstrip.

Model 40T Series

DC to 50 GHz

The 40T Series are High Power Thin-Film Terminations designed for use in 40 Gbit systems. An integrated DC

Block can be added to the termination for a reduction in DC current consumption and heat dissipation

40Gbit High Power Terminations

Aeroflex Part #

40T50-(100/500) (C/M)

40T40-(100/500) (C/M)

40T35-(100/500) (C/M)

Termination

Value

50 ohms ±2%

40 ohms ±2%

35 ohms ±2%

Power

Handling

mW Min

100 / 500

Transmission

Line

CPWG / MS

S11, 0 - 20 GHz

-15 dB min

(with no wire-bonds)

-15 dB min

(with no wire-bonds, in 40W system)

-15 dB min

(with no wire-bonds, in 35W system)

Size

.138” x .079”

138” x .079“

138” x .079”

Notes:

1. These devices will need to be mounted on a heat sink with a good thermal / electrical conductive epoxy or solder.

2. Electrical connections are made through wire-bonds.

3. 100 = 100 mW, 500 = 500 mW, C = CPWG, M = Microstrip.

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