GD74HCT139 datasheet, PDF - EEWORLD Datasheet

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GD74HCT139: DescriptionDecoder/Driver, CMOS, PDIP16,; Categorylogic logic; File Size186KB，4 Pages; ManufacturerLG Semicon Co., Ltd.

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GD74HCT139 Overview

Decoder/Driver, CMOS, PDIP16,

GD74HCT139 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Reach Compliance Code	unknown
JESD-30 code	R-PDIP-T16
JESD-609 code	e0
Load capacitance (CL)	50 pF
Logic integrated circuit type	OTHER DECODER/DRIVER
MaximumI(ol)	0.004 A
Number of functions	2
Number of terminals	16
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Prop。Delay @ Nom-Sup	43 ns
Certification status	Not Qualified
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Base Number Matches	1

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GD74HCT139 Related Products

	GD74HCT139	GD54HCT139J	GD74HCT139J	GD74HCT139D	GD74HC139J	GD74HC139D	GD74HC139	GD54HC139J
Description	Decoder/Driver, CMOS, PDIP16,	Decoder/Driver, CMOS, CDIP16,	Decoder/Driver, CMOS, CDIP16,	Decoder/Driver, CMOS, PDSO16,	Decoder/Driver, CMOS, CDIP16,	Decoder/Driver, CMOS, PDSO16,	Decoder/Driver, CMOS, PDIP16,	Decoder/Driver, CMOS, CDIP16,
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
JESD-30 code	R-PDIP-T16	R-XDIP-T16	R-XDIP-T16	R-PDSO-G16	R-XDIP-T16	R-PDSO-G16	R-PDIP-T16	R-XDIP-T16
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0
Load capacitance (CL)	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF
Logic integrated circuit type	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER
MaximumI(ol)	0.004 A	0.004 A	0.004 A	0.004 A	0.004 A	0.004 A	0.004 A	0.004 A
Number of functions	2	2	2	2	2	2	2	2
Number of terminals	16	16	16	16	16	16	16	16
Maximum operating temperature	85 °C	125 °C	85 °C	85 °C	85 °C	85 °C	85 °C	125 °C
Minimum operating temperature	-40 °C	-55 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-55 °C
Package body material	PLASTIC/EPOXY	CERAMIC	CERAMIC	PLASTIC/EPOXY	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC
encapsulated code	DIP	DIP	DIP	SOP	DIP	SOP	DIP	DIP
Encapsulate equivalent code	DIP16,.3	DIP16,.3	DIP16,.3	SOP16,.25	DIP16,.3	SOP16,.25	DIP16,.3	DIP16,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	SMALL OUTLINE	IN-LINE	SMALL OUTLINE	IN-LINE	IN-LINE
power supply	5 V	5 V	5 V	5 V	2/6 V	2/6 V	2/6 V	2/6 V
Prop。Delay @ Nom-Sup	43 ns	51 ns	43 ns	43 ns	36 ns	36 ns	36 ns	44 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
surface mount	NO	NO	NO	YES	NO	YES	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	MILITARY	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	GULL WING	THROUGH-HOLE	GULL WING	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	1.27 mm	2.54 mm	1.27 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maker	-	-	-	LG Semicon Co., Ltd.	LG Semicon Co., Ltd.	LG Semicon Co., Ltd.	LG Semicon Co., Ltd.	LG Semicon Co., Ltd.

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