10H SERIES, 11-INPUT OR-AND/OR-AND-INVERT GATE, CQCC20, CERAMIC, LCC-20
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Motorola ( NXP ) |
| package instruction | QCCN, LCC20,.35SQ |
| Reach Compliance Code | unknown |
| series | 10H |
| JESD-30 code | S-CQCC-N20 |
| JESD-609 code | e0 |
| length | 8.885 mm |
| Logic integrated circuit type | OR-AND/OR-AND-INVERT GATE |
| Number of functions | 1 |
| Number of entries | 11 |
| Number of terminals | 20 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Output characteristics | OPEN-EMITTER |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | QCCN |
| Encapsulate equivalent code | LCC20,.35SQ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Maximum supply current (ICC) | 29 mA |
| propagation delay (tpd) | 2.6 ns |
| Certification status | Not Qualified |
| Schmitt trigger | NO |
| Filter level | 38535Q/M;38534H;883B |
| Maximum seat height | 1.9 mm |
| surface mount | YES |
| technology | ECL |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | NO LEAD |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 8.885 mm |
| Base Number Matches | 1 |
| 5962-87730012A | 10H521/BEAJC | 10H521/BFAJC | 5962-8773001FA | 5962-8773001EA | |
|---|---|---|---|---|---|
| Description | 10H SERIES, 11-INPUT OR-AND/OR-AND-INVERT GATE, CQCC20, CERAMIC, LCC-20 | 10H SERIES, 11-INPUT OR-AND/OR-AND-INVERT GATE, CDIP16, CERDIP-16 | 10H SERIES, 11-INPUT OR-AND/OR-AND-INVERT GATE, CDFP16, CERAMIC, FP-16 | 10H SERIES, 11-INPUT OR-AND/OR-AND-INVERT GATE, CDFP16, CERAMIC, FP-16 | 10H SERIES, 11-INPUT OR-AND/OR-AND-INVERT GATE, CDIP16, CERDIP-16 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | QCCN, LCC20,.35SQ | DIP, DIP16,.3 | DFP, FL16,.3 | DFP, FL16,.3 | DIP, DIP16,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| series | 10H | 10H | 10H | 10H | 10H |
| JESD-30 code | S-CQCC-N20 | R-GDIP-T16 | R-GDFP-F16 | R-GDFP-F16 | R-GDIP-T16 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 |
| length | 8.885 mm | 19.495 mm | 9.65 mm | 9.65 mm | 19.49 mm |
| Logic integrated circuit type | OR-AND/OR-AND-INVERT GATE | OR-AND/OR-AND-INVERT GATE | OR-AND/OR-AND-INVERT GATE | OR-AND/OR-AND-INVERT GATE | OR-AND/OR-AND-INVERT GATE |
| Number of functions | 1 | 1 | 1 | 1 | 1 |
| Number of entries | 11 | 11 | 11 | 11 | 11 |
| Number of terminals | 20 | 16 | 16 | 16 | 16 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| Output characteristics | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER |
| Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| encapsulated code | QCCN | DIP | DFP | DFP | DIP |
| Encapsulate equivalent code | LCC20,.35SQ | DIP16,.3 | FL16,.3 | FL16,.3 | DIP16,.3 |
| Package shape | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | CHIP CARRIER | IN-LINE | FLATPACK | FLATPACK | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Maximum supply current (ICC) | 29 mA | 29 mA | 29 mA | 29 mA | 29 mA |
| propagation delay (tpd) | 2.6 ns | 2.6 ns | 2.6 ns | 2.6 ns | 2.6 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Schmitt trigger | NO | NO | NO | NO | NO |
| Filter level | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
| Maximum seat height | 1.9 mm | 5.08 mm | 2.15 mm | 2.15 mm | 5.08 mm |
| surface mount | YES | NO | YES | YES | NO |
| technology | ECL | ECL | ECL | ECL | ECL |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | NO LEAD | THROUGH-HOLE | FLAT | FLAT | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| Terminal location | QUAD | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 8.885 mm | 7.62 mm | 6.415 mm | 6.415 mm | 7.62 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
| Maker | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) | - | Motorola ( NXP ) |
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