Standard SRAM, 32KX8, 25ns, CMOS, PDSO28, 8 X 13.40 MM, TSOP1-28
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | ALSC [Alliance Semiconductor Corporation] |
| Parts packaging code | TSOP |
| package instruction | SOP, TSSOP28,.53,22 |
| Contacts | 28 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Maximum access time | 25 ns |
| I/O type | COMMON |
| JESD-30 code | R-PDSO-G28 |
| JESD-609 code | e0 |
| memory density | 262144 bit |
| Memory IC Type | STANDARD SRAM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 28 |
| word count | 32768 words |
| character code | 32000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 32KX8 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SOP |
| Encapsulate equivalent code | TSSOP28,.53,22 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 240 |
| power supply | 3.3 V |
| Certification status | Not Qualified |
| Maximum standby current | 0.0005 A |
| Minimum standby current | 2 V |
| Maximum slew rate | 0.04 mA |
| Maximum supply voltage (Vsup) | 3.6 V |
| Minimum supply voltage (Vsup) | 3 V |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 0.55 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| Base Number Matches | 1 |
| AS7C3256-25TC | AS7C3256-25PC | AS7C3256-25JC | |
|---|---|---|---|
| Description | Standard SRAM, 32KX8, 25ns, CMOS, PDSO28, 8 X 13.40 MM, TSOP1-28 | Standard SRAM, 32KX8, 25ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 | Standard SRAM, 32KX8, 25ns, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOJ-28 |
| Is it Rohs certified? | incompatible | incompatible | incompatible |
| Maker | ALSC [Alliance Semiconductor Corporation] | ALSC [Alliance Semiconductor Corporation] | ALSC [Alliance Semiconductor Corporation] |
| Parts packaging code | TSOP | DIP | SOJ |
| package instruction | SOP, TSSOP28,.53,22 | DIP, DIP28,.3 | SOJ, SOJ28,.34 |
| Contacts | 28 | 28 | 28 |
| Reach Compliance Code | unknown | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 |
| Maximum access time | 25 ns | 25 ns | 25 ns |
| I/O type | COMMON | COMMON | COMMON |
| JESD-30 code | R-PDSO-G28 | R-PDIP-T28 | R-PDSO-J28 |
| JESD-609 code | e0 | e0 | e0 |
| memory density | 262144 bit | 262144 bit | 262144 bit |
| Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| memory width | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 |
| Number of terminals | 28 | 28 | 28 |
| word count | 32768 words | 32768 words | 32768 words |
| character code | 32000 | 32000 | 32000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C |
| organize | 32KX8 | 32KX8 | 32KX8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | SOP | DIP | SOJ |
| Encapsulate equivalent code | TSSOP28,.53,22 | DIP28,.3 | SOJ28,.34 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE | IN-LINE | SMALL OUTLINE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | 240 | NOT SPECIFIED | 225 |
| power supply | 3.3 V | 3.3 V | 3.3 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| Maximum standby current | 0.0005 A | 0.0005 A | 0.0005 A |
| Minimum standby current | 2 V | 2 V | 2 V |
| Maximum slew rate | 0.04 mA | 0.04 mA | 0.04 mA |
| Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | 3.6 V |
| Minimum supply voltage (Vsup) | 3 V | 3 V | 3 V |
| Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V |
| surface mount | YES | NO | YES |
| technology | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING | THROUGH-HOLE | J BEND |
| Terminal pitch | 0.55 mm | 2.54 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Base Number Matches | 1 | 1 | 1 |
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