The documentation and process conversion measures
necessary to comply with this document shall be
completed by 10 May 2011.
INCH-POUND
MIL-PRF-19500/538F
10 February 2011
SUPERSEDING
MIL-PRF-19500/538E
25 April 2009
PERFORMANCE SPECIFICATION SHEET
* SEMICONDUCTOR DEVICE, TRANSISTOR, NPN, SILICON, POWER,
TYPES 2N6676, 2N6678, 2N6676T1, 2N6678T1, 2N6676T3, 2N6678T3, 2N6691, AND 2N6693,
JAN, JANTX, JANTXV, JANS, JANSM, JANSD, JANSP, JANSL, JANSR, JANSF, JANSG, JANSH, JANHCA,
JANKCA, JANKCAM, JANKCAD, JANKCAP, JANKCAL, JANKCAR, JANKCAF, JANKCAG, AND JANKCAH
This specification is approved for use by all Departments
and Agencies of the Department of Defense.
The requirements for acquiring the product described herein shall consist of
this specification sheet and MIL-PRF-19500.
1. SCOPE
* 1.1 Scope. This specification covers the performance requirements for NPN silicon, power transistors. Four levels
of product assurance are provided for each device type as specified in MIL-PRF-19500. Two levels of product
assurance are provided for each unencapsulated device type. Provisions for radiation hardness assurance (RHA) to
eight radiation levels is provided for JANS and JANKC product assurance levels. RHA level designators “M”, “D”, “P“,
“L”, “R”, “F”, “G”, and “H” are appended to the device prefix to identify devices, which have passed RHA requirements.
* 1.2 Physical dimensions. See figure 1 (TO-3) - 2N6676, 2N6678; figure 2 (TO-61) - 2N6691, 2N6693, figure 3
(TO-254AA) - 2N6676T1, 2N6678T1, figure 4 (TO-257AA) - 2N6676T3, 2N6678T3, and figure 5 (JANHC and
JANKC).
1.3 Maximum ratings.
Types
P
T
T
A
= +25°C
W
6
6
4
4
6
6
P
T
T
C
= +25°C (1)
W
175
175
(3) 125
(3) 125
175
175
R
θJC
(2)
°C/W
1.0
1.0
1.3
1.3
1.0
1.0
V
CBO
and
V
CEX
V dc
450
650
450
650
450
650
V
CEO
T
J
and T
STG
°C
-65 to +200
-65 to +200
-65 to +200
-65 to +200
-65 to +200
-65 to +200
2N6676, 2N6676T1
2N6678, 2N6678T1
2N6676T3
2N6678T3
2N6691
2N6693
V dc
300
400
300
400
300
400
* Comments, suggestions, or questions on this document should be addressed to DLA Land and Maritime,
ATTN: VAC, P.O. Box 3990, Columbus, OH 43218-3990, or emailed to
Semiconductor@dscc.dla.mil.
Since
contact information can change, you may want to verify the currency of this address information using the
ASSIST Online database at
https://assist.daps.dla.mil
.
AMSC N/A
FSC 5961
MIL-PRF-19500/538F
*
1.3 Maximum ratings. - Continued.
Types
V
EBO
V dc
8.0
8.0
8.0
8.0
8.0
8.0
I
B
A dc
5
5
5
5
5
5
I
C
A dc
15
15
15
15
15
15
2N6676, 2N6676T1
2N6678, 2N6678T1
2N6676T3
2N6678T3
2N6691
2N6693
(1) See figures 6 and 7 for temperature-power derating curves.
(2) See figures 8 through 11, thermal impedance curves.
(3) For TO-257 devices with typical mounting and small footprint, conservatively rated at 125 W and 1.3°C/W only.
1.4 Primary electrical characteristics at T
C
= +25°C.
hFE1
Limits
VCE = 3 V dc
IC = 1 A dc
(1)
hFE2
VCE = 3 V dc
IC = 15 A dc
(1)
VBE(sat)
IC = 15 A dc
IB = 3 A dc
VCE(sat)
IC = 15 A dc
IB = 3 A dc
V dc
Min
Max
15
40
|h
fe
|
Limits
VCE = 10 V dc
IC = 1 A dc
f = 5 MHz
8
20
Cobo
VCB = 10 V dc
IE = 0
100 KHz < f < 1 MHz
pF
150
500
tc
1.5
V dc
1.0
Switching
(2)
tr
td
ts
tf
µs
µs
µs
µs
µs
Min
Max
3
10
0.5
0.1
0.6
2.5
0.5
(1) Pulsed (see 4.5.1).
(2) See figure 12 (pulse response circuits).
2
MIL-PRF-19500/538F
2. APPLICABLE DOCUMENTS
2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification. This
section does not include documents cited in other sections of this specification or recommended for additional
information or as examples. While every effort has been made to ensure the completeness of this list, document
users are cautioned that they must meet all specified requirements of documents cited in sections 3, 4, or 5 of this
specification, whether or not they are listed.
2.2 Government documents.
2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a
part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are
those cited in the solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
MIL-PRF-19500
-
Semiconductor Devices, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-750
-
Test Methods for Semiconductor Devices.
* (Copies of these documents are available online at
https://assist.daps.dla.mil/quicksearch
or
https://assist.daps.dla.mil
or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D,
Philadelphia, PA 19111-5094.)
2.3 Order of precedence. Unless otherwise noted herein or in the contract, in the event of a conflict between the
text of this document and the references cited herein, the text of this document takes precedence. Nothing in this
document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained.
3
MIL-PRF-19500/538F
Dimensions
Ltr
Inches
Min
CD
CH
HR
HR
1
HT
L
1
LD
LL
MHD
MHS
PS
PS
1
S
1
.038
.312
.151
1.177
.420
.205
.655
.270
.495
.131
.060
Max
.875
.380
.525
.188
.135
.050
.043
.500
.161
1.197
.440
.225
0.675
0.97
7.92
3.84
29.90
10.67
5.21
16.64
6.86
12.57
3.33
1.52
Millimeters
Min
Max
22.22
9.65
13.34
4.78
3.43
1.27
1.09
12.70
4.09
30.40
11.18
5.72
17.14
4
4, 5
4
5, 9
5, 9
5
7
3
Notes
TO-3
NOTES:
1. Dimensions are in inches.
2. Millimeters are given for general information only.
3. Body contour is optional within zone defined by CD
4. These dimensions shall be measured at points .050 inch (1.27 mm) to .055 inch (1.40 mm) below seating plane.
Measurement shall be made at seating plane.
5. Both terminals.
6. At both ends.
7. Two holes.
8. Terminal 1 is the emitter, terminal 2 is base. The collector shall be electrically connected to the case.
9. LD applies between L
1
and LL. Diameter is uncontrolled in L
1
.
10. In accordance with ASME Y14.5M, diameters are equivalent to
φx
symbology.
FIGURE 1. Physical dimensions (TO-3) for 2N6676 and 2N6678.
4
MIL-PRF-19500/538F
Dimension
Ltr
Inches
Min
A
1
CD
CD
1
CH
HF
HT
.570
.610
.325
.667
.090
.640
.340
.170
.422
Max
.270
.610
.687
.460
.687
.150
.875
.415
.213
.455
.090
.047
.046
.220
.072
.077
.249
1.19
1.17
5.59
14.48
15.49
8.26
16.94
2.29
16.26
8.64
4.32
10.72
Millimeters
Min
Max
6.86
15.49
17.45
11.68
17.45
3.81
22.22
10.54
5.41
11.56
2.29
1.83
1.96
6.32
7
4
3, 6
3, 6
Notes
TO-61
OAH
PS
PS
1
SL
SU
T
T
1
UD
NOTES:
1. Dimensions are in inches, millimeters are given for general information only.
2. See NSB Handbook H28, “Screw-Thread Standards for Federal Services”.
3. The orientation of the terminals in relation to the hex flats is not controlled.
4. All three terminals.
5. The case temperature may be measured anywhere on the seating plane within .125 inch (3.18 mm) of the
stud.
6. Terminal spacing measured at the base seat only.
7. This dimension applies to the location of the center line of the terminals.
8. Terminal - 1, emitter; terminal - 2, base; terminal - 3, collector. All leads are isolated from the case.
9. In accordance with ASME Y14.5M, diameters are equivalent to
φx
symbology.
FIGURE 2. Physical dimensions (TO-61) for 2N6691 and 2N6693.
5
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